Symposium on Reliability for Electronics and Photonics Packaging
Fourth year of this new Symposium from the IEEE Electronics Packaging Society. This major Silicon Valley symposium will focus on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging. This includes failure modes, mechanisms, testing schemes, accelerated testing, stress levels, and environmental stresses.
For latest Advance Program and other details, please visit our website: attend.ieee.org/repp/
SEMI World Hdqtrs, 673 S Milpitas Blvd, Milpitas, California, United States, 95035, Virtual: https://events.vtools.ieee.org/m/369938
Symposium on Reliability for Electronics and Photonics Packaging – REPP 2023
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