In recent years, the field of advanced packaging has taken center stage as the semiconductor industry pursues ever more energy efficient, high-performance, and low-cost electronic systems. While the field of advanced packaging is undergoing revolutionary technology advances today, there is little doubt that advanced packaging in the new era of Moore’s Law will offer extreme levels of die integration/bonding and begin to blur the boundary between on- and off-chip connectivity (especially in 3D architectures) due to ever denser physical I/O interfaces/bonds. This talk will address a few technical areas. First, we present a survey of recent advanced packaging technologies. Next, we discuss the emergence of panel-based glass-core packages and their potential impact on AI workloads. Further, we present a deep dive into GT’s glass-core packaging technologies, including large-area glass packages and glass-based stitch-chip technologies for digital and mm-wave electronics. Next, 3D technologies enabled by SiO2-based chiplet wafer-level reconstitution technologies for dense 3DHI technologies and selective-ALD cobalt chiplet bonding are also discussed.
Speaker(s): Muhannad Bakir,
Virtual: https://events.vtools.ieee.org/m/400217
Heterogeneous Integration Innovations Enabled by Glass-Core Packaging and 3D Technologies
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