Abstract
The miniaturization led advances in silicon-based micro/nanoelectronics on planar and stiff substrates, have revolutionized nearly every socio-economic sector through fast computing and communication. However, miniaturization alone is insufficient as several emerging applications (e.g., robotics, interactive systems, wearables, flexible displays etc.) require electronics with features such as flexible form factors, and seamlessly integrated on soft substrates. The environmental impact of inherently wasteful fabrication steps in conventional micro/nanofabrication is also a growing concern. As a result, new resource-efficient methods are being explored to fabricate electronic devices and circuits on unconventional flexible and stretchable substrates. This talk will present recent advances in this direction, particularly focussing on hybrid or heterogenous integration of the off-the-shelf devices, ultra-thin chips, and high-mobility semiconducting nanostructures-based printed electronics. The talk will also cover innovative resource efficient methods such as transfer printing, contact printing and direct-roll printing etc. that are expected to transform the way electronics will be manufactured in future.
Speaker(s): Prof. Ravinder Dahiya,
Agenda:
6:30 – 6:45 PM Registration & Networking
6:45 – 6:50 PM Chapter Announcements
6:50 – 7:10 PM 2023 MEMS Report Card
7:10 – 7:50 PM Invited Talk
7:50 – 8:00 PM Questions & Answers
Virtual: https://events.vtools.ieee.org/m/422413
High-Performance Printed Electronics
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