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SUMMARY:Thermal Analysis for Thermal Challenges with Heterogeneous Packaging
DESCRIPTION:Thermal Analysis for Thermal Challenges with Heterogeneous Packaging\nAbstract:\nWith the commercialization of thermoreflectance thermal imaging Microsanj has met many of the thermal challenges inherent with today’s advanced devices.\nThe thermoreflectance principle exploits the fact that the reflectivity of a material changes with temperature. By measuring the reflectivity change with probing wavelengths in the visible band\, this technique supports thermal measurements with diffraction limited spatial resolution in the sub-micron range and a temporal response in the nanosecond range.\nNew thermal analysis challenges are arising with current trends and advances in heterogeneous packaging techniques. To address these new challenges\, Microsanj is developing enhancements and new products. A brief description of these techniques including optical pump-probe imaging\, flash thermography\, over-the-air imaging for the analysis of embedded antennas\, and others approaches being investigated will be provided in this presentation.\nBio:\nDustin Kendig\nDustin Kendig is Co-Founder and Vice President of Microsanj LLC in Santa Clara\, California.\nAt Microsanj he is developing sub-micrometer transient thermal imaging systems for the semiconductor industry for thermal characterization and fault isolation. Microsanj has 75+ commercial products and research partnerships with companies and research labs in a dozen countries.\nHe is a member of the IEEE Instrumentation and Measurement and Reliability Societies. In 2009\, he was the recipient of the Huffman Prize\, Dean’s Award\, and Chancellor’s Award. He won best poster at IEEE PVSC in 2010 and best paper at IEEE ITherm in 2017. He holds 4 patents and has published over 60 papers.\nDustin Kendig received his B.S. Degree with Honors in Electrical Engineering from the University of California\, Santa Cruz.\nAGENDA:\nThursday March 6\, 2025\n11:30 AM: Networking\, Pizza & Drinks\nNoon — 1 pm: Seminar\nPlease register on Eventbrite before 9:30 AM on Thursday February 6\, 2025\n$4 IEEE members $6 non IEEE members\n(discounts for unemployed and students )\nSee examplesAdd\nBldg: ==> Use corner entrance: Kifer Road / San Lucar Court ==> Do not enter at main entrance on Kifer Road\, EAG Labs\, 810 Kifer Road\, Sunnyvale\, California\, California\, United States\, 95051
URL:https://svec.org/event/thermal-analysis-for-thermal-challenges-with-heterogeneous-packaging/
LOCATION:Bldg: ==> Use corner entrance: Kifer Road / San Lucar Court ==> Do not enter at main entrance on Kifer Road\, EAG Labs\, 810 Kifer Road\, Sunnyvale\, California\, California\, United States\, 95051
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DTSTART;TZID=America/Los_Angeles:20250306T190000
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LAST-MODIFIED:20250215T080305Z
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SUMMARY:Expertise – the Limits of “I’ll Know It When I See It”
DESCRIPTION:Sean Murphy will share the challenges and strategies of navigating the limits of intuitive understanding in the realms of engineering and entrepreneurship. It offers a roadmap for blending human expertise with automation\, effective delegation\, and the creation of a shared mission. Aiming to equip leaders and innovators with the tools to transform intuition into actionable insight and collective achievement.\nUncover how to move beyond “I will know it when I see it\,” fostering a culture of precision\, collaboration\, and innovation in your projects and organizations.\nPractical tips for:\n– Exploration and verification\n– Recognizing opportunities\n– Recognizing and managing the limits of intuition\n– Delegating tasks and problems\n– Blending human expertise with automation\nSpeaker(s): Sean Murphy\nVirtual: https://events.vtools.ieee.org/m/468793
URL:https://svec.org/event/expertise-the-limits-of-ill-know-it-when-i-see-it/
LOCATION:Virtual: https://events.vtools.ieee.org/m/468793
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