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SUMMARY:Introduction to IEC 61850 by Rich Hunt
DESCRIPTION:The IEEE SF & OEB Power & Energy Society (PES) Chapters invite you to join us on April 23\, 2025 11:45 AM PDT\, for a virtual Lunch-and-Learn to hear Richard Hunt from Quanta Technology provide an Introduction to IEC 61850.\nIntroduction to IEC 61850\nThis session will discuss the fundamentals of IEC 61850\, including data model\, communication methods\, services\, and configuration.\nTopics:\n– Why do we care about IEC 61850?\n– What does IEC 61850 do?\n– How does IEC 61850 work?\nAt the end of the session\, attendees should have a general understanding of IEC 61850. This session can be the starting point for further investigation into system and network architecture\, testing\, and implementing specific system functionality.\nSpeaker(s): Rich Hunt\, PE\, Executive Advisor – Quanta Technology\,\nVirtual: https://events.vtools.ieee.org/m/478617
URL:https://svec.org/event/introduction-to-iec-61850-by-rich-hunt/
LOCATION:Virtual: https://events.vtools.ieee.org/m/478617
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SUMMARY:Electronics Packaging Case Studies at Binghamton University
DESCRIPTION:[] The Analytical & Diagnostics Laboratory (ADL)\, an initiative under Binghamton University’s S3IP Center of Excellence\, is a centralized\, interdisciplinary research facility. Partnering with the Integrated Electronics Engineering Center (IEEC)\, a New York State Center for Advanced Technology\, the ADL advances electronics packaging\, reliability\, and manufacturing research. Together\, they drive innovation in systems integration\, flexible electronics\, renewable energy\, and medical devices.\nMany industry partners collaborate with us for our advanced instrumentation\, stress testing capability\, and failure analysis expertise. In this talk\, we will review several case studies that center around these topics in microelectronics. For example\, in modern high-powered applications\, electromigration which has been predominately a chip level phenomenon is now a concern for circuit boards with BGA sized features. We will show the progression from test vehicle design through stress evaluation into failure characterization. Another example centers around identification of an open circuit in a functional printed circuit board. We will further elaborate on techniques used to isolate failures and identify failure mechanisms as well as the relationship between these mechanisms and typical environmental stresses.\nSpeaker(s): Jennifer Sammakia\, Stephen Cain\nVirtual: https://events.vtools.ieee.org/m/479386
URL:https://svec.org/event/electronics-packaging-case-studies-at-binghamton-university/
LOCATION:Virtual: https://events.vtools.ieee.org/m/479386
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