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DTSTART;TZID=America/Los_Angeles:20250828T113000
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UID:76883-1756380600-1756386600@svec.org
SUMMARY:Extremely Power-Dense Solar Panels for the Extremes of Space
DESCRIPTION:Extremely Power-Dense Solar Panels for the Extremes of Space\nhttps://www.eventbrite.com/e/1539115508919?aff=oddtdtcreator\nAbstract:\nUltrathin photovoltaic devices based on two-dimensional (2D) transition metal dichalcogenides (TMDs) have emerged as promising candidates for next-generation solar power in weight- and volume-constrained environments.\nIn this talk\, I will present flexible TMD solar cells that integrate semitransparent contacts and engineered interfacial layers to enhance charge collection\, optical absorption\, and environmental stability.\nCompared to traditional thin-film and III-V technologies\, these 2D devices offer superior specific power\, mechanical flexibility\, and potential resilience under extreme operating conditions.\nI will also discuss pathways for transitioning TMD photovoltaics from laboratory demonstrations to real-world deployment in aerospace\, mobile\, and off-grid systems.\nThis includes recent efforts through Arinna\, a spin-out focused on advancing 2D solar technologies for mission-ready applications across space\, mobility\, and distributed energy sectors.\nRead More:\n(https://www.arinna.xyz/)\n(https://www.nature.com/articles/s41467-021-27195-7)\n(https://www.cell.com/device/fulltext/S2666-9986(25)00036-5)\n[]\nBio:\nDr. Koosha Nassiri Nazif is a leading expert in high-specific-power photovoltaics\, with over a decade of experience in thin films and two-dimensional (2D) materials.\nHe earned his Ph.D. in Electrical Engineering from Stanford University\, where he led foundational research on flexible transition metal dichalcogenide (TMD) solar cells\, resulting in multiple publications and patents. His postdoctoral work at Stanford focused on scalable manufacturing and radiation resilience of these materials.\nHe is now co-founder and CEO of Arinna\, where he is building on this foundation to commercialize breakthrough solar technologies for advanced power and mobility systems.\nIn-Person Meeting\nThursday\, August 28\, 2025\n11:30 AM: Networking\, Pizza & Drinks\nNoon — 1 pm: Seminar\n——–\nPlease register on Eventbrite before 9:30 AM on Thursday August 28\nCo-sponsored by: SCV/SF Jt. Section Chapter\, ED15 Joint Chapter\nAgenda:\n11:30 AM: Networking\, Pizza & Drinks\nNoon — 1 pm: Seminar\nBreak & Networking\n1 pm — 1:30 pm\nOptional Lab Tour\n1:30 pm – 2:00 pm\nCovalent Metrology\, 923 Thompson Pl\, Sunnyvale\, California\, United States\, 94085
URL:https://svec.org/event/extremely-power-dense-solar-panels-for-the-extremes-of-space/
LOCATION:Covalent Metrology\, 923 Thompson Pl\, Sunnyvale\, California\, United States\, 94085
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DTSTART;TZID=America/Los_Angeles:20250828T120000
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DTSTAMP:20260422T042221
CREATED:20250802T094830Z
LAST-MODIFIED:20250802T094830Z
UID:76807-1756382400-1756386900@svec.org
SUMMARY:Advances in Vertical Wire Technology for Wire Bond Applications
DESCRIPTION:[]Advances in smart response-based processes have significantly improved wire bond reliability and further strengthened the use of the technology in high-volume manufacturing (HVM). Wire bonding technology remains a staple choice in vast majority of semiconductor packages due to its low cost\, increased flexibility\, and high yield rate. A traditional wire bond process consists of a wire loop with a ball bond on die and a wedge bond on substrate. Vertical Wires are an emerging interconnect solution formed using a unique process on the same ball bond equipment. Vertical Wires can be used as an alternative to the traditional wire bond processes or in conjunction with the traditional wire loops in SiPs. Although initially developed for interconnection applications\, Vertical Wire technology was introduced in HVM for EMI shielding in SiP and RF packages. This presentation will detail new advances in Vertical Wire Technology to further reduce wire pitch\, increase I/O density\, and reduce package footprint. An overview of application range\, capability and design rules for the technology will be discussed.\nSpeaker(s): Basil Milton\,\nVirtual: https://events.vtools.ieee.org/m/495344
URL:https://svec.org/event/advances-in-vertical-wire-technology-for-wire-bond-applications/
LOCATION:Virtual: https://events.vtools.ieee.org/m/495344
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DTSTART;TZID=America/Los_Angeles:20250828T173000
DTEND;TZID=America/Los_Angeles:20250828T200000
DTSTAMP:20260422T042221
CREATED:20250808T095026Z
LAST-MODIFIED:20250808T095026Z
UID:76844-1756402200-1756411200@svec.org
SUMMARY:IEEE Young Professional Happy Hour
DESCRIPTION:IEEE Bay Area Summer Social\nCome join us for a fun Thursday evening at Tempest SF (Dive Bar)! Network with local IEEE young professionals and students in the area for internships\, while enjoying delicious food and drinks. This in-person event is the perfect opportunity to relax\, unwind\, and connect with like-minded professionals in a casual setting. Don't miss out on this chance to make new friends and build connections to help you navigate the transition from student to working professional.\nSpecial Invite: SHPE SFBA Professional Chapter!\nFirst drink is free\, and we will provide appetizers to share. Price of admission (including drink and food) is $5 for young professionals and $3 for students/interns. See you there!\nWhy Connect with Young Professionals?\nGetting involved with your local IEEE Young Professional (YP) organization is a great way to bridge the transition between academic life and a full-fledged professional career. A few key benefits of being involved in your local YP section include:\n– Networking Opportunities: IEEE YP events bring together like-minded individuals from diverse technical backgrounds. It's a perfect platform to expand your professional network\, potentially connecting you with future collaborators\, mentors\, or employers.\n– Professional Development: Gain valuable insights and skills through workshops\, seminars\, and panel discussions tailored to enhance your professional growth. These events often cover topics ranging from technical advancements to career advancement strategies.\n– Transition from Student to Professional: For students/interns transitioning into full-time roles\, IEEE YP provides a supportive environment helping navigate this crucial career phase successfully.\n– Friendship and Camaraderie: Beyond professional benefits\, IEEE YP fosters friendships and camaraderie among its members. Building a strong network of peers who share your interests can make your professional journey more fulfilling and enjoyable.\nPublic Transportaion.\nTake Bart and get off at Powell Station\, it is about a 7min walk from Bart.\nAgenda:\n5:30 PM-Check in\n6:00 PM-Ice Breaker\n7:00 PM-Group Picture\n2940 431 Natoma Street \, San Francisco\, California\, United States\, 94103
URL:https://svec.org/event/ieee-young-professional-happy-hour/
LOCATION:2940 431 Natoma Street \, San Francisco\, California\, United States\, 94103
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