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DTSTART;TZID=America/Los_Angeles:20250910T090000
DTEND;TZID=America/Los_Angeles:20250912T170000
DTSTAMP:20260428T070503
CREATED:20250731T095141Z
LAST-MODIFIED:20250731T095141Z
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SUMMARY:IEEE International Symposium on Technology and Society (ISTAS25)
DESCRIPTION:The IEEE International Symposium on Technology and Society (ISTAS) is the flagship conference of the IEEE’s Society on Social Implications of Technology (SSIT).\nISTAS is a multi/inter/trans‐disciplinary forum for engineers\, policy makers\, entrepreneurs\, philosophers\, researchers\, social scientists\, technologists\, and polymaths to collaborate\, exchange experiences\, and discuss the social implications of technology.\nHosted by the Santa Clara University (California\, USA)\, ISTAS25 runs from 10-12 September\, and will be live and virtual.\nSpeaker(s): \, \,\nBldg: Sobrato Innovation Building (SCDI – Building 402).\, Santa Clara University\, 500 El Camino Real\, Santa Clara\, California\, United States\, 95053\, Virtual: https://events.vtools.ieee.org/m/494179
URL:https://svec.org/event/ieee-international-symposium-on-technology-and-society-istas25/
LOCATION:Bldg: Sobrato Innovation Building (SCDI – Building 402).\, Santa Clara University\, 500 El Camino Real\, Santa Clara\, California\, United States\, 95053\, Virtual: https://events.vtools.ieee.org/m/494179
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DTSTART;TZID=-07:00:20250911T130000
DTEND;TZID=-07:00:20250911T150000
DTSTAMP:20260428T070503
CREATED:20250811T191833Z
LAST-MODIFIED:20250811T191833Z
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SUMMARY:Coding's Evolving Future
DESCRIPTION:**[RSVP here – https://rsvp.withgoogle.com/events/coding-s-evolving-future-with-ronald-petty](https://rsvp.withgoogle.com/events/coding-s-evolving-future-with-ronald-petty)** \nCoding has revolutionized our world. From Ada Lovelace’s early ideas in the 1800s to today’s sophisticated\, automated code\, we’ve witnessed an extraordinary transformation. \nWe’ve moved from painstakingly writing every instruction to simply telling computers what we want them to achieve. \nBut as our tech gets smarter\, it’s worth asking: What are we gaining\, and what might we be losing in this rapid evolution? \nJoin tech consultant Ronald Petty as we explore how our relationship with code and machines has changed through history. We’ll delve into technology’s expanding accessibility\, the shifting landscape of creativity\, and what it truly means to be a coder when powerful tools can write software for anyone. \nIn this engaging session we’ll cover: \n* **The evolution of coding tools:** From early punch cards to intuitive drag-and-drop interfaces and advanced automation helpers.\n* **Participation in the evolution:** Who gets to join the tech world and why it still matters that everyone has an opportunity.\n* **The shifting meaning of code:** How coding has transitioned from corporate control to today’s open\, community-led projects.\n* **Influences on innovation:** The impact of regulations\, education\, and business trends on how and why we code.\n* **Live demos and surprising stories:** Discover why coding has always been more human than we think.
URL:https://svec.org/event/codings-evolving-future/
LOCATION:Google Visitor Experience\, Google Visitor Experience 2000 N Shoreline Blvd US\,\, Mountain View\, CA\, 94043\, United States
ATTACH;FMTTYPE=image/jpeg:https://svec.org/wp-content/uploads/2025/08/1024x576-dYaLsA.jpg
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DTSTART;TZID=America/Los_Angeles:20250911T173000
DTEND;TZID=America/Los_Angeles:20250911T183000
DTSTAMP:20260428T070503
CREATED:20250828T103308Z
LAST-MODIFIED:20250828T103308Z
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SUMMARY:Oregon ComSoc: The Next Leap in Wireless: Inside the Evolution from Wi-Fi 7 to 8
DESCRIPTION:[]\nAbstract:\nThe arrival of Wi-Fi 7 in early 2024\, based on IEEE 802.11be\, marks a paradigm shift in wireless networking—moving from single-link connections toward collaborative multi-link operation\, enabling greater capacity and lower latency. With multi-link operation\, Wi-Fi 7 can achieve a maximum throughput of 30 Gbps.\nWhile this peak throughput supports most existing applications\, it falls short of meeting the strict reliability demands of emerging use cases such as the metaverse\, augmented and virtual reality\, robotics\, and industrial automation. These challenges are driving the development of the next generation—Wi-Fi 8.\nTo address these needs\, the IEEE 802.11 Task Group bn has been established to define Ultra High Reliability (UHR) PHY and MAC layers. Their goal is to improve WLAN reliability\, reduce latency\, enhance manageability\, and increase throughput across varying signal-to-noise ratios (SNRs).\nIn this talk\, we will identify and describe the key PHY and MAC elements that will shape Wi-Fi 8\, which will operate in the 2.4 GHz\, 5 GHz\, and 6 GHz bands. We will also discuss the enabling mechanisms under design and present performance results where appropriate.\nBio:\nDr. Cheng Chen is a Senior Staff Wireless Standards Engineer at Intel Corporation. He leads Intel's standardization efforts on Wi-Fi sensing (802.11bf) and integrated millimeter wave (802.11bq) within the IEEE 802.11 Working Group\, as well as Intel's Wi-Fi certification programs within the Wi-Fi Alliance. He currently serves as Editor for the IEEE 802.11bq Task Group\, Technical Editor for the Wi-Fi 7 Technical Task Group\, and Vice Chair of the Wi-Fi Sensing Task Group in the Wi-Fi Alliance. He previously served as Technical Editor for the Wi-Fi 6 Technical Task Group (July 2021–June 2022).\nDr. Chen is a Senior Member of the IEEE and an IEEE ComSoc Distinguished Lecturer for the 2025–2026 term. He is an active contributor and voting member of multiple IEEE 802.11 standards\, including 802.11ay (Next-generation 60 GHz Wi-Fi)\, 802.11be (Extremely High Throughput)\, 802.11bf (WLAN Sensing)\, 802.11bn (Ultra High Reliability)\, and 802.11bq (Integrated Millimeter Wave). He also contributes to several Wi-Fi Alliance certification programs\, including Wi-Fi 6\, Wi-Fi 6E\, Wi-Fi 7\, and Wi-Fi sensing.\nIn recognition of his outstanding contributions across standards forums\, Dr. Chen has received multiple awards\, including the IEEE Standards Association Award for Outstanding Contributions to IEEE 802.11ay and the Wi-Fi Alliance Leadership Recognition Award for the Wi-Fi 6 launch.\nDr. Chen earned his B.E. degree in Electronics and Information Engineering from Huazhong University of Science and Technology\, Wuhan\, China\, in 2011\, and his M.S. and Ph.D. degrees in Electrical Engineering from Northwestern University\, Evanston\, IL\, in 2013 and 2016\, respectively.\nCo-sponsored by: Pradeep Kumar\nVirtual: https://events.vtools.ieee.org/m/497970
URL:https://svec.org/event/oregon-comsoc-the-next-leap-in-wireless-inside-the-evolution-from-wi-fi-7-to-8/
LOCATION:Virtual: https://events.vtools.ieee.org/m/497970
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DTSTART;TZID=America/Los_Angeles:20250911T183000
DTEND;TZID=America/Los_Angeles:20250911T200000
DTSTAMP:20260428T070503
CREATED:20250701T084928Z
LAST-MODIFIED:20250701T084928Z
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SUMMARY:Tape Roadmap and Challenges with using new High Areal Density Tapes
DESCRIPTION:As the LTO tape roadmap advances toward significantly higher capacities\, the industry is undergoing a paradigm shift in how those gains are achieved. Traditionally\, increased capacity came from expanding tape length and increasing linear bit and track densities together\, enabled by larger recorded bits on thicker media. However\, beginning with LTO-8\, the focus has shifted to higher track densities and thinner\, longer tape substrates—a transformation that brings both opportunity and complexity.\nThis transition introduces a new set of engineering and operational challenges. With thinner media and smaller recorded bit dimensions\, the number of wraps and head passes per full volume increases significantly. As a result\, tape systems are becoming more sensitive to environmental conditions\, including temperature\, humidity\, and airborne debris. These changes mainly due to smaller bit dimensions place added pressure on Tape Dimensional Stability (TDS) control mechanisms and contribute to elevated Tape Alerts and Drive Errors\, especially in real-world usage scenarios.\nInnovations in LTO-10\, such as the tilted head and servo format architecture (the Pisa head) and new cleaning mechanisms\, represent a major leap in addressing these challenges. This new format allows precise compensation for tape dimensional changes\, improving tape-to-head alignment. However\, such innovations are just one part of the broader strategy needed to ensure reliable tape performance at scale.\nIn parallel\, modern data architectures are redefining tape’s role. Tapes are no longer just archival media stored offsite for disaster recovery. In today’s tiered storage ecosystems\, data on tape must be randomly accessible\, highly durable\, and maintain multi-9s reliability over lifespans exceeding ten years. This shift requires that tapes perform reliably not just at write time\, but throughout their lifecycle as active data assets.\nTo meet these demands\, the industry must adopt:\n– Advanced host-level tape and drive management algorithms\n– Researching and implementing ML based algorithms for Real world tape Alerts and errors and estimating data durability and availability\n– Integration of erasure coding\, redundancy models with new RAIL based Library architectures\nThis presentation will focus into the magnetic data tape technological innovations\, real-world tape alerts and errors\, and architectural changes shaping the next generation of tape storage. Emphasis will be placed on understanding the interplay between environmental variables and system performance\, and how innovation at system and Library level is essential to ensuring long-term reliability in this new era of high-capacity tape systems.\nSpeaker(s): Turguy\,\nAgenda:\n6:30 – 7:00	Socializing and Networking at Quadrant\n6:55	Zoom session will be online with Waiting Room\n7:00 – 7:45	Lecture begins\, online and in person\n7:45 – 8:00	Questions and Answers\n1120 Ringwood Ct\, San Jose\, California\, United States\, 95131\, Virtual: https://events.vtools.ieee.org/m/491103
URL:https://svec.org/event/tape-roadmap-and-challenges-with-using-new-high-areal-density-tapes/
LOCATION:1120 Ringwood Ct\, San Jose\, California\, United States\, 95131\, Virtual: https://events.vtools.ieee.org/m/491103
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