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X-WR-CALDESC:Events for Silicon Valley Engineering Council
REFRESH-INTERVAL;VALUE=DURATION:PT1H
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DTSTART:20251102T090000
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DTSTART:20260308T100000
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TZOFFSETFROM:-0700
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DTSTART:20261101T090000
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TZOFFSETFROM:-0800
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TZNAME:PDT
DTSTART:20270314T100000
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BEGIN:STANDARD
TZOFFSETFROM:-0700
TZOFFSETTO:-0800
TZNAME:PST
DTSTART:20271107T090000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20260326T120000
DTEND;TZID=America/Los_Angeles:20260326T130000
DTSTAMP:20260420T092227
CREATED:20260215T170305Z
LAST-MODIFIED:20260215T170305Z
UID:77761-1774526400-1774530000@svec.org
SUMMARY:Co-Packaged Optics: Heterogeneous Integration of Chiplets in Switches\, Photonic ICs and Electronic ICs
DESCRIPTION:[]Co-packaged optics (CPO) are heterogeneous integration packaging methods to integrate the optical engine (OE) which consists of photonic ICs (PIC) such as the photodiode laser\, etc. and the electrical engine (EE) which consists of the electronic ICs (EIC) such as the laser driver\, transimpedance amplifier\, etc. as well as the switch ASIC (application specific IC). The advantages of CPO are: (a) to reduce the length of the electrical interface between the OE/EE (or PIC/EIC) and the ASIC\, (b) to reduce the energy required to drive the signal\, and (c) to cut the latency which leads to better electrical performance. In the next few years\, we will see more implementations of a higher level of heterogeneous integration of switch\, PIC and EIC\, whether it is for performance\, form factor\, power consumption or cost. The content of this lecture:\n— Silicon Photonics\n— Data Centers\n— Optical Transceivers\n— Optical Engine (OE) and Electrical Engine (EE)\n— OBO (on-board optics)\n— NPO (near-board optics)\n— CPO (co-packaged optics)\n— 3D Integration of the PIC and EIC\n— 3D Heterogeneous Integration of PIC and EIC\n— 3D Heterogeneous Integration of ASIC Switch\, PIC and EIC\n— 3D Heterogeneous Integration of ASIC Switch\, PIC and EIC with Bridges\n— 3D Heterogeneous Integration of ASIC Switch\, EIC and PIC embedded in Glass-core Substrate\n— Various Forms of CPO\nSpeaker(s): John Lau\,\nVirtual: https://events.vtools.ieee.org/m/539468
URL:https://svec.org/event/co-packaged-optics-heterogeneous-integration-of-chiplets-in-switches-photonic-ics-and-electronic-ics/
LOCATION:Virtual: https://events.vtools.ieee.org/m/539468
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BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20260326T180000
DTEND;TZID=America/Los_Angeles:20260326T190000
DTSTAMP:20260420T092227
CREATED:20260325T001814Z
LAST-MODIFIED:20260325T001814Z
UID:78189-1774548000-1774551600@svec.org
SUMMARY:SCV WIE March 2026 ExCom Meeting
DESCRIPTION:Shalini Lakshmana is inviting you to a scheduled Zoom meeting.\nTopic: SCV WIE Mar ExCom Meeting\nTime: Mar 26\, 2026 06:00 PM Pacific Time (US and Canada)\nEvery month on the 26 of the month\, 36 occurrence(s)\nMonthly: https://zoom.us/meeting/tJArfumopzkpHtaky1j5fYpqwMUeY7hSmBWs/ics?icsToken=DLAvxr8efHNhT92mFgAALAAAAICuIz08PSYY6dBYKGdyAmG9V8apUVN2a4qZ15xYs4WT3mV-sSkt5z2I4R9S5HnEoBhV7EWs81CyNNkybzAwMDAwMQ&meetingMasterEventId=GF3_gS3WTzuUZDIP3DGSlw\nJoin Zoom Meeting\nhttps://zoom.us/j/94690092342?pwd=7PGwqJDSorXhy8TcYD9alL0bucCPEc.1\nMeeting ID: 946 9009 2342\nPasscode: 9yPaX9\nAgenda:\n– New member introductions\n– Past Events\n– Upcoming Events\n– Other agenda items\nVirtual: https://events.vtools.ieee.org/m/550619
URL:https://svec.org/event/scv-wie-march-2026-excom-meeting/
LOCATION:Virtual: https://events.vtools.ieee.org/m/550619
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DTSTART;TZID=America/Los_Angeles:20260326T180000
DTEND;TZID=America/Los_Angeles:20260326T220000
DTSTAMP:20260420T092227
CREATED:20260318T184811Z
LAST-MODIFIED:20260318T184811Z
UID:77891-1774548000-1774562400@svec.org
SUMMARY:SCV-EPS AdCom Meeting (March 2026)
DESCRIPTION:Monthly AdCom meeting:\nAGENDA and location for chapter ExCom/ AdCom\nAgenda:\nMonthly AdCom meeting: [agenda and location limited to chapter AdCom\nVirtual: https://events.vtools.ieee.org/m/549397
URL:https://svec.org/event/scv-eps-adcom-meeting-march-2026-2/
LOCATION:Virtual: https://events.vtools.ieee.org/m/549397
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