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SUMMARY:Workshop: Decoding AI Hardware - Materials\, Metrology\, and Failure Analysis in Advanced Packaging
DESCRIPTION:Four guided training talks with small-group interaction:\n9:00: Advanced Packaging for AI – Challenges and Roadmaps in Fault Isolation and Failure Analysis\n9:30: Metal TIM and Low-Temp Solder Paste for HPC & AI Industry Challenges\n10:30: Failure Analysis of Electronic Components for AI and Data Center Infrastructure\n11:00: Scanning Acoustic Microscopy (SAM) and Photo-induced Force Microscopy (PiFM) for Defect Identification and Characterization in AI Hardware\n11:30: lunch\, social/networking\, and optional lab tours\nCo-sponsored by: Paul Wesling\nSpeaker(s): Yan Li\, David Hu\, Audrey Chamoire \, Austin Barnes\nCovalent Corp.\, 925 Thompson Place\, Sunnyvale\, California\, United States\, 94085\, Virtual: https://events.vtools.ieee.org/m/575155
URL:https://svec.org/event/workshop-decoding-ai-hardware-materials-metrology-and-failure-analysis-in-advanced-packaging/
LOCATION:Covalent Corp.\, 925 Thompson Place\, Sunnyvale\, California\, United States\, 94085\, Virtual: https://events.vtools.ieee.org/m/575155
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