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BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20260507T120000
DTEND;TZID=America/Los_Angeles:20260507T130000
DTSTAMP:20260421T012907
CREATED:20260311T183306Z
LAST-MODIFIED:20260311T183306Z
UID:77858-1778155200-1778158800@svec.org
SUMMARY:Power Distribution in Heterogeneous Integrated Packaging for Data Center Computing
DESCRIPTION:[]Join us for an insightful webinar with Francesco Carobolante\, founder of IoTissimo® LLC and an EPS Distinguished Lecturer\, as he explores the critical challenges and innovative solutions that advanced packaging can provide to address the "Power Wall". With over 30 years of industry experience and a tenure at Intel’s Corporate Strategy Office\, Francesco will delve into the Heterogeneous Integration Roadmap (HIR) perspective on scaling high-power AI processors. This session will analyze how signal BW and energy requirements dictate the options available for architecting the package structure\, including Vertical Power Delivery\, integrated voltage regulators and advanced thermal management techniques. Discover how these architectural shifts are enabling the next generation of data center performance.\nSpeaker(s): Francesco Carobolante\,\nVirtual: https://events.vtools.ieee.org/m/546237
URL:https://svec.org/event/power-distribution-in-heterogeneous-integrated-packaging-for-data-center-computing/
LOCATION:Virtual: https://events.vtools.ieee.org/m/546237
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20260512T120000
DTEND;TZID=America/Los_Angeles:20260512T130000
DTSTAMP:20260421T012907
CREATED:20260120T174820Z
LAST-MODIFIED:20260120T174820Z
UID:77639-1778587200-1778590800@svec.org
SUMMARY:From Process to Performance: Challenges in uOLED and uLED Electronics Manufacturing
DESCRIPTION:As uOLED and uLED technologies transition from research to high-volume manufacturing\, system performance is increasingly constrained by process variability rather than design intent. Electrical\, thermal\, and mechanical decisions made during manufacturing directly translate into optical non-uniformity\, efficiency loss\, and reliability challenges. Understanding these process-to-performance linkages is critical for building scalable\, high-performance emissive display systems.\nVirtual: https://events.vtools.ieee.org/m/533601
URL:https://svec.org/event/from-process-to-performance-challenges-in-uoled-and-uled-electronics-manufacturing-2/
LOCATION:Virtual: https://events.vtools.ieee.org/m/533601
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20260512T170000
DTEND;TZID=America/Los_Angeles:20260512T193000
DTSTAMP:20260421T012907
CREATED:20260402T110335Z
LAST-MODIFIED:20260402T110335Z
UID:78240-1778605200-1778614200@svec.org
SUMMARY:The Intelligence of the Machine.. The Rigor of the Road!!
DESCRIPTION:IEEE Event Agenda – Tuesday May 12\, 2026\n🔹 5:00 PM – 5:30 PM\nRegistration\, Refreshments\, Food & Networking (Meet & Greet)\nFeatured Speakers & Sessions\n🔹 5:30 PM – 6:15 PM\nTopic 1: Industry Talk – Standardizing Automotive Firmware for SDVs\nExperts from Mercedes-Benz\, Arm\, and Athos Silicon will discuss the urgent need for a standardized\, secure\, and vendor-agnostic firmware foundation.\nKey focus areas:\n– Overcoming fragmented firmware ecosystems\n– UEFI as a scalable automotive standard\n– Enabling functional safety\, cybersecurity\, and interoperability\n– Supporting chiplet-based and next-gen ADAS architectures\nSpeakers:\n– François Piednoël – (https://www.linkedin.com/in/francoispiednoel/)\n– Sachin Athanikar – (https://www.linkedin.com/in/sachin-athanikar-18ba5914/)\n– Dong Wei (https://www.linkedin.com/in/dongweimba/)\n🔹 6:15 PM – 6:45 PM\nTopic 2: Academic Keynote – Safe Embodied AI: From Theory to Deployment\nProf. Ding Zhao (Carnegie Mellon University)\nTopics include:\n– Rare-event safety in autonomous systems\n– Safe reinforcement and imitation learning\n– Generalizable and adaptive AI safety\n– Future of trustworthy embodied AI at scale\nSpeaker:\n– Ding Zhao – (https://www.linkedin.com/in/ding-zhao-01130730/)\n🔹 6:45 PM – 7:15 PM\nTopic 3: Industry Talk – Static Safety Is Dead: Continuous Risk & Compliance for SDVs\nAkshay Chalana (CEO & Co-founder\, Saphira AI)\nModern vehicles evolve continuously through software updates\, AI-driven functionality\, and increasing connectivity—yet safety and cybersecurity practices remain largely static.\nThis talk explores:\n– What breaks when traditional safety assumptions no longer hold\n– Real-world ADAS/autonomy failure propagation: dataset bias\, requirement drift\, and system boundary ambiguity\n– Cross-domain challenges between safety and cybersecurity\n– A new model for continuous\, system-aware risk assessment and compliance\n– Treating compliance artifacts as live infrastructure integrated into development pipelines\nThis session provides a practical path to maintaining certification-grade rigor while operating at software velocity.\nSpeaker:\n– Akshay Chalana – (https://www.linkedin.com/in/akshaychalana/)\n🔹 7:15 PM – 7:30 PM\nQ&A and open discussion – Aditi Ramadwar\nAbout This Technical Forum\nThis technical forum brings together OEMs\, Tier-1 suppliers\, semiconductor leaders\, researchers\, and innovators to address the challenge of fragmentation and define a unified\, future-ready mobility stack.\nWho Should Attend:\n– Automotive engineers and architects\n– Safety and cybersecurity specialists\n– Semiconductor and embedded systems professionals\n– Researchers in autonomous vehicles and AI safety\n– Technical decision-makers from OEMs and suppliers\n– Students in Automotive\, Compute\, Mechanical & Electrical Engineering\nWe would be delighted if you could join us and participate in shaping the future of intelligent transportation.\nSpeaker(s): Francois\, Wei \, Sachin\, Zhao\, Akshay\nSEMI\, 673 S Milpitas Blvd\, Milpitas\, California\, United States\, 95035
URL:https://svec.org/event/the-intelligence-of-the-machine-the-rigor-of-the-road/
LOCATION:SEMI\, 673 S Milpitas Blvd\, Milpitas\, California\, United States\, 95035
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20260517T170000
DTEND;TZID=America/Los_Angeles:20260518T180000
DTSTAMP:20260421T012907
CREATED:20260206T094815Z
LAST-MODIFIED:20260206T094815Z
UID:77706-1779037200-1779127200@svec.org
SUMMARY:Spring Speaker Series 3
DESCRIPTION:Continuation of Speaker Series at Stanford IEEE.\nStanford\, California\, United States\, 94305
URL:https://svec.org/event/spring-speaker-series-3/
LOCATION:Stanford\, California\, United States\, 94305
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20260519T080000
DTEND;TZID=America/Los_Angeles:20260520T170000
DTSTAMP:20260421T012907
CREATED:20260206T094815Z
LAST-MODIFIED:20260206T094815Z
UID:77708-1779177600-1779296400@svec.org
SUMMARY:Third Annual IEEE Build-Up Substrate Symposium
DESCRIPTION:[]\n(More information will be added in early March. General Registration should open around March 1st. Sponsors may register at the link below.)\nWe are living in the era of heterogeneous integration driven by fast\, efficient and big data computing resources at our fingertips. The mega-monolithic silicon chip is a thing of the past\, replaced with 3D heterogeneous integration of chiplets onto a platform made of an organic build-up substrate. Volume manufacturers of build-up substrates are entirely based in Asia\, leaving a desert in the US. Volume build-up substrates used by major IDMs are manufactured in Asian countries including Taiwan\, Japan and China.\nHowever\, there are multiple activities starting up in the US\, and this is why a gathering of the US players is important. This symposium is geared for all those involved in the supply chain of build-up substrates in the US\, as well as users. This Symposium is an opportunity for all build-up substrate players to meet\, network and cohesively work with funding agencies who will be invited to this symposium to focus on onshoring build-up substrate production and utilization.\nSamsung\, San Jose\, California\, United States
URL:https://svec.org/event/third-annual-ieee-build-up-substrate-symposium/
LOCATION:Samsung\, San Jose\, CA\, United States
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20260519T090000
DTEND;TZID=America/Los_Angeles:20260520T170000
DTSTAMP:20260421T012907
CREATED:20260304T174831Z
LAST-MODIFIED:20260304T174831Z
UID:77832-1779181200-1779296400@svec.org
SUMMARY:IEEE Build-Up Substrate Symposium (BUSS)
DESCRIPTION:We are living in the era of heterogeneous integration driven by fast\, efficient and big data computing resources at our fingertips. The mega-monolithic silicon chip is a thing of the past\, replaced with 3D heterogeneous integration of chiplets onto a platform made of an organic build-up substrate. Volume manufacturers of build-up substrates are entirely based in Asia\, leaving a desert in the US. Volume build-up substrates used by major IDMs are manufactured in Asian countries including Taiwan\, Japan and China.\nHowever\, there are multiple activities starting up in the US\, and this is why a gathering of the US players is important. This symposium is geared for all those involved in the supply chain of build-up substrates in the US\, as well as users. As the US Congress debates H.R. 3249\, the Protecting Circuit Boards and Substrates (PCBS) Act\, this Symposium is an opportunity for all build-up substrate players to meet\, network and cohesively work with funding agencies who will be invited to this symposium to focus on onshoring build-up substrate production and utilization.\nlocation to be announced\, Milpitas\, California\, United States\, Virtual: https://events.vtools.ieee.org/m/544352
URL:https://svec.org/event/ieee-build-up-substrate-symposium-buss-2/
LOCATION:location to be announced\, Milpitas\, California\, United States\, Virtual: https://events.vtools.ieee.org/m/544352
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/New_York:20260525T210000
DTEND;TZID=America/New_York:20260526T170000
DTSTAMP:20260421T012907
CREATED:20260226T173312Z
LAST-MODIFIED:20260226T173312Z
UID:77809-1779742800-1779814800@svec.org
SUMMARY:IEEE Canada Blockchain Forum 2026 (4th edition)
DESCRIPTION:The IEEE Blockchain Forum is returning for the fourth time as part of (https://www.torontotechweek.com/). The goal of this compact one-day event is to congregate BUIDLers\, researchers\, academics\, and engineers building blockchain protocols\, infrastructure\, and decentralized software applications.\nNote: (https://events.vtools.ieee.org/m/469545) counted with 200 participants and speakers from JP Morgan\, the Bank of Canada\, Mastercard\, the Ethereum Enterprise Alliance\, EY\, Starknet\, among others.\n[]\nCo-sponsored by: Government of Ontario\nAgenda:\nAgenda TBC\nOntario Investment and Trade Centre\, 250 Yonge Street\, 35th Floor\, Toronto\, Ontario\, Canada\, M5B 2L7
URL:https://svec.org/event/ieee-canada-blockchain-forum-2026-4th-edition/
LOCATION:Ontario Investment and Trade Centre\, 250 Yonge Street\, 35th Floor\, Toronto\, Ontario\, Canada\, M5B 2L7
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20260624T080000
DTEND;TZID=America/Los_Angeles:20260625T170000
DTSTAMP:20260421T012907
CREATED:20260319T184817Z
LAST-MODIFIED:20260319T184817Z
UID:77896-1782288000-1782406800@svec.org
SUMMARY:Center for Advanced Signal and Image Sciences (CASIS) 29th Annual Workshop
DESCRIPTION:We are thrilled to host LLNL’s 30th Center for Advanced Signal and Image Sciences (CASIS) workshop. The workshop returns with a full 2-day in-person schedule on Wednesday and Thursday\, June 24-25\, 2026.\nWe encourage a broad range of technical topics at the workshop and being non-archival apart from original work\, we are also considering intermediate results from ongoing efforts as well as recently published publications for presentation as a talk and/or a poster. The goal of the workshop is to provide a platform for the exchange of ideas and network with peers across disciplines to foster collaboration and build community. Please submit your abstract by Friday\, May 15\, 2026. Authors will be notified of the review decisions one week later on May 22\, 2026.\nApart from the regular presentation track we will feature parallel tutorials\, hands-on mini workshops and a dedicated student track to introduce career opportunities at LLNL.\nThe workshop will be held in-person at the (https://uclcc.org/) and requires pre-registration until June 18\, 2026. As this is a 2-day whole-day workshop\, we will provide coffee and snacks in morning and afternoon breaks as well as a lunch on both days. As this is our 30th anniversary\, we will also host a Happy Hour following the regular program on Wednesday\, June 24\, 2026.\n(https://engineering.llnl.gov/centers/casis/workshops)\nThis year’s workshop features presentations in the following tracks\, moderated by the Program Chairs:\n– AI/Machine Learning (PhanNguyen\, Kowshik Thopalli)\n– National Ignition Facility (Eugene Kur\, Christopher Miller)\n– Non-Destructive Evaluation (Seemeen Karimi\, Harry Martz)\n– Quantum Sensing & Quantum Computing (Kristi Beck)\n– Remote Sensing\, Non-Invasive Imaging & Inverse Problems (Sean Lehman\, Viacheslav Li)\n– Robotics & Automation (Aldair Gongora\, Abhik Sarkar)\n– Student Track: All topics (Poster only) (Ted Bauman\, Min Priest)\nBecome part of this great experience and submit your talk proposal at https://engineering.llnl.gov/centers/casis/workshops before May 15\, 2025!\nCheck out (https://www.llnl.gov/article/53041/annual-workshop-brings-together-signal-image-science-community) for last year’s amazing event to see what to expect!\nThe no-fee CASIS Workshop is sponsored by the (https://engineering.llnl.gov/) and held at the (https://uclcc.org/). It is organized by the (https://engineering.llnl.gov/centers/casis)\, and is a joint meeting with the local chapters of the (https://www.ewh.ieee.org/r6/oeb/SigProc/sigproc.html) and (https://r6.ieee.org/sfoeb-cs/). supported by the (https://r6.ieee.org/oeb/).\nCo-sponsored by: Lawrence Livermore National Laboratory – Center for Advanced Signal and Image Sciences\nBldg: Building 661 L-794\, University of California Livermore Collaboration Center\, 7000 East Ave\, Livermore\, California\, United States\, 94550
URL:https://svec.org/event/center-for-advanced-signal-and-image-sciences-casis-29th-annual-workshop-2/
LOCATION:Bldg: Building 661 L-794\, University of California Livermore Collaboration Center\, 7000 East Ave\, Livermore\, California\, United States\, 94550
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=-07:00:20260715T190000
DTEND;TZID=-07:00:20260715T210000
DTSTAMP:20260421T012907
CREATED:20260420T210319Z
LAST-MODIFIED:20260420T210319Z
UID:78271-1784142000-1784149200@svec.org
SUMMARY:Multi-Agent Systems at Scale as a Shared Platform for the enterprises
DESCRIPTION:AI Agent Infrastructure as a Shared Platform: Patterns for Multi-Agent Systems at Scale for the enterprise. \nLOCATION ADDRESS (Hybrid\, in person or by zoom\, you choose)\nValley Research Park\n319 North Bernardo Avenue\nMountain View\, CA CA 93043\nDon’t use the front door. When facing the front door\, turn right along the front of the building. Turn left around the building corner. The 2nd door should be open and have a banner and event registration. \nIf you want to join remotely\, you can submit questions via Zoom Q&A. The zoom link:\n[Zoom](https://acm-org.zoom.us/j/92225957844?pwd=E1L50oEkTFvwai73PYfGoqsPdi9xIL.1) (updated 6:55 pm)\nJoin via YouTube:\nhttps://www.youtube.com/watch?v=pO72Hb30fKw \nAGENDA\n6:30 Door opens\, food and networking (we invite honor system contributions)\n7:00 SFBayACM upcoming events\, introduce the speaker\n7:15 Speaker presents.\n8:30 – 8:45 finish\, depending on Q&A \nJoin SF Bay ACM Chapter for an insightful discussion on: \n### **Abstract & Overview** \nAn agent is simple: Prompt + Tools + Model + Boilerplate. The first three are where product teams create value. The last one—state management\, history compression\, streaming\, cancellation\, tracing\, memory\, persistence—is 80% of the code but 0% of the differentiation.\nAt ThoughtSpot\, we built an Agent Platform that draws a hard line between agent logic and agent infrastructure\, letting product teams ship customer-facing agents faster by owning only what matters: their prompts and their tools.\nThis talk covers the infrastructure patterns behind that separation:\n**State management across tool calls.** Stateless tools (state on the agent\, passed as arguments) give you testability and let the LLM reason about state. Stateful tools (state in the tool service) avoid serialization overhead. I’ll walk through flow diagrams\, show how we propagate state via tool response metadata\, and discuss when each pattern fits.\n**Configuration-driven agent definitions.** Agents defined entirely through config—templated prompts\, tool endpoints\, sub-agent rules\, compression strategies. Teams ship agents without writing orchestration code.\n**Inter-agent communication.** Two patterns: agents-as-tools (sub-agent called like any tool\, returns structured output) and agent handoff (full conversation transfer). The platform handles routing and context—teams just declare delegation rules.\n**Shared memory across agents.** Memory in the platform\, not individual agents\, means knowledge accumulates across agent boundaries. Tiered scoping (tenant\, org\, user) with retrieval that surfaces relevant context regardless of which agent captured it.\n**Tool protocol design.** MCP as the base\, with patterns layered on top: cancellation semantics\, progress streaming\, context variable propagation\, and adapters for existing services.\nBuilding for customer-facing scale adds constraints—high concurrency\, encryption\, tenant isolation\, auditability—that shaped our API design throughout.\n**Takeaways:** \n* Mental model for separating agent value from infrastructure\n* State patterns: agent-side vs. tool-side tradeoffs\n* Inter-agent communication: tools vs. handoff\n* Shared memory architecture across agent boundaries\n* MCP extensions for production systems. \nSpeaker Bio\nAshish Shubham is Fellow/Vice President of Engineering at ThoughtSpot\, where he leads the architecture of enterprise-scale AI and embedded analytics platforms used by Fortune 500 organizations. He is the author of *Architecting AI Data Systems* and an inventor on multiple U.S. patents in natural-language-to-SQL\, generative AI interfaces\, and intelligent analytics. Ashish is an IEEE Senior Member and an active reviewer and committee contributor for leading IEEE and ACM conferences and workshops. His work bridges academic research and real-world deployment\, with a focus on building scalable\, trustworthy\, and developer-centric AI systems for production environments.\n[https://linkedin.com/in/ashubham](https://linkedin.com/in/ashubham) \n—\nValley Research Park is a coworking research campus of 104\,000 square feet hosting 60+ life science and technology companies. VRP has over 100 dry labs\, wet labs\, and high power labs sized from 125-15\,000 square feet. VRP manages all of the traditional office elements: break rooms\, conference rooms\, outdoor dining spaces\, and recreational spaces. \nAs a plug-and-play lab space\, once companies have secured their next milestone and are ready to expand\, VRP has 100+ labs ready to expand into.\nhttps://www.valleyresearchpark.com/
URL:https://svec.org/event/multi-agent-systems-at-scale-as-a-shared-platform-for-the-enterprises/
LOCATION:Valley Research Park\, 319 N Bernardo Ave\, Mountain View\, CA\, 94043\, United States
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