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SUMMARY:Third Annual IEEE Hybrid Bonding Symposium (HBS)
DESCRIPTION:[]\nHybrid Bonding has emerged as the technology of choice in the semiconductor industry for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device performance\, it will become widely adopted for a broad range of high-performance semiconductor devices in the years to come. The success of Hybrid Bonding technology for high-volume manufacturing depends critically on the process technology as well as materials and equipment. Design\, performance characterization\, thermal management and reliability are also important considerations to enable applications in various areas.\nJoin us to learn about this expanding field\, and discover how it will affect heterogeneous integration and system design. Registration should start around November 1st.\nCo-sponsored by: Paul Wesling\nSan Jose\, California\, United States\, Virtual: https://events.vtools.ieee.org/m/588020
URL:https://svec.org/event/third-annual-ieee-hybrid-bonding-symposium-hbs/
LOCATION:San Jose\, California\, United States\, Virtual: https://events.vtools.ieee.org/m/588020
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