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BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20260415T070000
DTEND;TZID=America/Los_Angeles:20260415T080000
DTSTAMP:20260609T165049
CREATED:20260402T110323Z
LAST-MODIFIED:20260402T110323Z
UID:78235-1776236400-1776240000@svec.org
SUMMARY:Optical Sampling Thermoreflectance for 3D Heterogeneous Integration
DESCRIPTION:Th[]e transition to 3D heterogeneous integration has fundamentally changed the thermal characterization problem. Buried heat sources\, anisotropic thin-film materials\, through-silicon vias\, and multilayer stacked structures require measurement techniques with sub-micron spatial resolution\, depth sensitivity\, and a temporal range — capabilities that infrared thermography and Raman spectroscopy cannot reliably deliver at this level of structural complexity. This session presents optical sampling thermoreflectance as a practical\, commercially available solution\, with real measurement data from a university lab and an industrial FA environment.\nVirtual: https://events.vtools.ieee.org/m/551389
URL:https://svec.org/event/optical-sampling-thermoreflectance-for-3d-heterogeneous-integration/
LOCATION:Virtual: https://events.vtools.ieee.org/m/551389
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20260415T170000
DTEND;TZID=America/Los_Angeles:20260415T180000
DTSTAMP:20260609T165049
CREATED:20260206T094815Z
LAST-MODIFIED:20260206T094815Z
UID:77705-1776272400-1776276000@svec.org
SUMMARY:Spring Speaker Series 2
DESCRIPTION:Continuation of Speaker Series at Stanford IEEE.\nStanford\, California\, United States\, 94305
URL:https://svec.org/event/spring-speaker-series-2/
LOCATION:Stanford\, California\, United States\, 94305
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20260415T190000
DTEND;TZID=America/Los_Angeles:20260415T203000
DTSTAMP:20260609T165049
CREATED:20260314T183315Z
LAST-MODIFIED:20260314T183315Z
UID:77875-1776279600-1776285000@svec.org
SUMMARY:Advancing Clean Energy: Ontario's Darlington New Nuclear Project
DESCRIPTION:Ontario Power Generation’s Darlington New Nuclear Project (DNNP) is at the forefront of deploying Small Modular Reactor (SMR) technology in Canada\, anchored by the GE Vernova Hitachi BWRX-300. As North America’s first commercial\, grid-scale SMR\, DNNP plans up to four units totaling 1\,200 MW. The project introduces advanced safety features\, including natural circulation cooling\, integral isolation valves\, and passive heat removal\, while supporting thousands of jobs and boosting Ontario’s economy. A collaboration between OPG\, GE Vernova Hitachi\, AtkinsRéalis\, and Aecon-Kiewit\, DNNP strengthens Ontario’s clean energy leadership and sets a model for SMR deployment globally. With construction underway\, DNNP will help meet rising electricity demand\, advance electrification\, and deliver reliable\, carbon-free power\, showcasing nuclear innovation’s vital role in climate action and economic growth.\nSpeaker: Michael Takla\, Ontario Power Generation\nEvent Moderator: Dr. Maike Luiken\, PhD\, SMIEEE\, IEEE-HKN\, FEIC\, FCAE\, is managing director\, R&D\, at a start-up company\, Carbovate Development\, and Adjunct Research Professor\, Western University\, Canada.\nSpeaker(s): Michael Takla\, Maike Luiken\nAgenda:\nWe were given written permission to rebroadcast the Canadian earlier program which will be on April 1 at 9:00am.\nThe SCV Section Life Members Affinity Group program will be at the more convenient time on Apr 15\, 2026 at 07:00 PM Pacific Time\nVirtual: https://events.vtools.ieee.org/m/547687
URL:https://svec.org/event/advancing-clean-energy-ontarios-darlington-new-nuclear-project/
LOCATION:Virtual: https://events.vtools.ieee.org/m/547687
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=-07:00:20260420T183000
DTEND;TZID=-07:00:20260420T203000
DTSTAMP:20260609T165049
CREATED:20260310T180308Z
LAST-MODIFIED:20260310T180308Z
UID:77852-1776709800-1776717000@svec.org
SUMMARY:Labelled Deductive Systems for Logical Validation of LLM Output
DESCRIPTION:**TALK LOGISTICS:**\nMonday\, April 20\, 2026\n6:30 registration\, food\, networking.\n7:00 SFbayACM upcoming events\, introduce the speaker\n7:10 to 8:15 or 8:30 presentation\nThe Zoom and YouTube links will be provided here about 2-3 days before the event\nSFbayACM will support a local audience at VRP in Mountain View \n**TALK DESCRIPTION:**\nLarge language models (LLMs) often generate fluent but in-correct or unsupported statements\, commonly referred to as hallucinations. We propose a hallucination detection frame-work ValidLLP4LLM based on a Labeled Logic Program (LLP) architecture that integrates multiple reasoning paradigms\, including logic programming\, argumentation\, probabilistic inference\, and abductive explanation. By enriching symbolic rules with semantic\, epistemic\, and contextual labels and applying discourse-aware weighting\, the system prioritizes nucleus claims over peripheral statements during verification. Experiments on three benchmark datasets and a challenging clinical narrative dataset show that LLP consistently outperforms classical symbolic validators\, achieving the highest detection accuracy when combined with discourse modeling. A human evaluation further demonstrates that logic-assisted explanations improve both hallucination detection ac-curacy and user trust. The results suggest that labeled symbolic reasoning with discourse awareness provides a robust and interpretable approach to LLM verification in safety-critical domains. \n**SPEAKER BIO:**\nProf. Boris Galitsky has contributed linguistic and machine learning technologies to Silicon Valley startups as well as companies like eBay and Oracle for over 25 years. His information extraction and sentiment\nanalysis techniques assisted several acquisitions\, such as Xoopit by Yahoo\, Uptake by Groupon\, Loglogic by Tibco\, and Zvents by eBay. His security-related technologies of document analysis contributed to the acquisition of Elastica by Semantec. \nAs an architect of the Intelligent Bots project at Oracle\, he developed a discourse analysis technique used for dialogue management and published in the book Developing Enterprise Chatbots. He also published a two-volume monograph\, “AI for CRM”\, based on his experience developing Oracle Digital Assistant. He is an Apache committer to OpenNLP\, where he created OpenNLP. Similarity component\, which is a basis for a semantically enriched search engine and chatbot development. \nHis exploration and formalization of human reasoning culminated in the book AQ1 Computational Autism broadly used by parents of children with autism spectrum disorder and rehabilitation personnel. His\nfocus on the medical domain led to another research monograph\, “Artificial Intelligence for Healthcare Applications and Management”. He is a now a lead researcher at Moscow Institute for Physics and Technology\, Russia\nhttps://www.linkedin.com/in/boris-galitsky-342109204/ \n#ACM #SFbayACM #AI #GenAI #DataScience #LLM\n#Hallucinations #LogicProgramming #NLP #Discourse #Benchmark
URL:https://svec.org/event/labelled-deductive-systems-for-logical-validation-of-llm-output/
LOCATION:Valley Research Park\, 319 N Bernardo Ave\, Mountain View\, CA\, 94043\, United States
ATTACH;FMTTYPE=image/jpeg:https://svec.org/wp-content/uploads/2026/03/1024x576-bCQPfF.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20260421T180000
DTEND;TZID=America/Los_Angeles:20260421T200000
DTSTAMP:20260609T165049
CREATED:20260402T110324Z
LAST-MODIFIED:20260402T110324Z
UID:78237-1776794400-1776801600@svec.org
SUMMARY:APEC 2026 Download - Highlighting Evolving Landscape of Power Electronics
DESCRIPTION:Join us at Santa Clara University for the APEC 2026 Download Event\, hosted by the IEEE PELS San Francisco Bay Area Chapter. This engaging session brings together engineers\, researchers\, and industry professionals to explore the most impactful moments and innovations presented at the Applied Power Electronics Conference (APEC) 2026.\nThe event will highlight key takeaways from technical sessions\, including emerging trends in wide bandgap semiconductors\, advances in high-efficiency power conversion\, AI-driven design optimization\, and next-generation energy systems. Attendees will gain valuable insights into cutting-edge research and real-world applications shaping the future of power electronics.\nIn addition\, we will cover standout keynote sessions\, offering perspectives from industry leaders on the evolving landscape of power electronics. The program aims to foster knowledge sharing\, networking\, and discussion within the local power electronics community.\nStudent Highlights:\nStudents are especially encouraged to attend! This is a great opportunity to:\n– Discover cutting-edge topics that can inspire your coursework\, senior projects\, or research direction\n– Learn directly from experts about industry expectations and emerging career paths in power electronics\n– Network with professionals and local engineers from leading companies in Silicon Valley\n– Gain exposure to real-world applications beyond the classroom\nWhether you attended APEC or want a curated overview of its most important developments\, this download event is an excellent opportunity to stay informed\, get inspired\, and expand your professional network.\nBldg: Sobrato Campus for Discovery and Innovation\, Santa Clara University\, 500 El Camino Real\, Santa Clara\, California\, United States\,  95053
URL:https://svec.org/event/apec-2026-download-highlighting-evolving-landscape-of-power-electronics/
LOCATION:Bldg: Sobrato Campus for Discovery and Innovation\, Santa Clara University\, 500 El Camino Real\, Santa Clara\, California\, United States\,  95053
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20260422T110000
DTEND;TZID=America/Los_Angeles:20260422T140000
DTSTAMP:20260609T165049
CREATED:20260217T171807Z
LAST-MODIFIED:20260217T171807Z
UID:77777-1776855600-1776866400@svec.org
SUMMARY:Quarterly social meeting and program
DESCRIPTION:Reserve this date for a social gathering and a program of general interest to be determined. IEEE member fee is subsidized.\nAgenda:\nSocial meeting\, presentation\, and lunch. Select from buffet or order from menu depending on the number of registrations.\nBldg: Golf course restaurant\, not pro shop\, Beeb's Sports Bar and Grill\, 915 Club House Drive\, Livermore\, California\, United States
URL:https://svec.org/event/quarterly-social-meeting-and-program-2/
LOCATION:Bldg\, Livermore\, CA\, United States
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20260423T113000
DTEND;TZID=America/Los_Angeles:20260423T131000
DTSTAMP:20260609T165049
CREATED:20260402T110324Z
LAST-MODIFIED:20260402T110324Z
UID:78238-1776943800-1776949800@svec.org
SUMMARY:Diamond Semiconductor Device Design & Fabrication
DESCRIPTION:Diamond Semiconductor Device Design & Fabrication\n[]\nAbstract:\nDiamond Quanta: making diamond as available as silicon\nSpeaker:\nAdam Khan\nFounder & CEO\nDiamond Quanta\nAGENDA:\nThursday April 23\, 2026\n11:30 AM: Networking\, Pizza & Drinks\nNoon — 1 pm: Seminar\nPlease register on Eventbrite before 9:30 AM on Thursday April 23\, 2026\n$4 IEEE members $6 non IEEE members\n(discounts for unemployed and students )\nBldg: ==> Use corner entrance: Kifer Road / San Lucar Court ==> Do not enter at main entrance on Kifer Road\, EAG Labs\, 810 Kifer Road\, Sunnyvale\, California\, California\, United States\, 95051
URL:https://svec.org/event/diamond-semiconductor-device-design-fabrication/
LOCATION:Bldg: ==> Use corner entrance: Kifer Road / San Lucar Court ==> Do not enter at main entrance on Kifer Road\, EAG Labs\, 810 Kifer Road\, Sunnyvale\, California\, California\, United States\, 95051
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20260425T093000
DTEND;TZID=America/Los_Angeles:20260425T110000
DTSTAMP:20260609T165049
CREATED:20260318T184811Z
LAST-MODIFIED:20260318T184811Z
UID:77893-1777109400-1777114800@svec.org
SUMMARY:SCV-EPS AdCom Meeting (APRIL 2026)
DESCRIPTION:Monthly AdCom meeting:\n1. Welcome – Hualiang\n2. Symposium status update – Annette/Paul/Hualiang\n3. Education outreach status – Masha/Azmat/Hualiang\n4. Chapter Storage – Hualiang XXXX NOT\n5. Monthly talk preparation – Chandan/Luu\n6. Chapter website update – XXXX NOT Venkatesh/Claire/Paul\n7. Senior member advancement – Dwayne\nXxxx NOT\n8: Election 2026\n9: Open discussion – All\nAgenda:\nMonthly AdCom meeting:\n1. Welcome – Hualiang\n2. Symposium status update – Annette/Paul/Hualiang\n3. Education outreach status – Masha/Azmat/Hualiang\n4. Chapter Storage – Hualiang XXXX NOT\n5. Monthly talk preparation – Chandan/Luu\n6. Chapter website update – XXXX NOT Venkatesh/Claire/Paul\n7. Senior member advancement – Dwayne\nXxxx NOT\n8: Election 2026\n9: Open discussion – All\nVirtual: https://events.vtools.ieee.org/m/549396
URL:https://svec.org/event/scv-eps-adcom-meeting-april-2026/
LOCATION:Virtual: https://events.vtools.ieee.org/m/549396
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20260426T080000
DTEND;TZID=America/Los_Angeles:20260426T170000
DTSTAMP:20260609T165049
CREATED:20260427T014839Z
LAST-MODIFIED:20260427T014839Z
UID:78301-1777190400-1777222800@svec.org
SUMMARY:THE INTELLIGENCE OF THE MACHINE. THE RIGOR OF THE ROAD!!
DESCRIPTION:This technical forum brings together OEMs\, Tier-1 suppliers\, semiconductor leaders\, researchers\, and innovators to address the challenge of fragmentation and define a unified\, future-ready mobility stack. \nWho Should Attend: \n\nAutomotive engineers and architects\nSafety and cybersecurity specialists\nSemiconductor and embedded systems professionals\nResearchers in autonomous vehicles and AI safety\nTechnical decision-makers from OEMs and suppliers\nStudents in Automotive\, Compute\, Mechanical & Electrical Engineering\n\nWe would be delighted if you could join us and participate in shaping the future of intelligent transportation. \nWHEN: Tuesday\, May 12\, 2026 5:00 – 7:30PM \nWHERE: SEMI HQ – 673 S Milpitas Blvd\, Milpitas\, CA \nIEEE-VTS_260512_ speaker_finalREGISTRATION: \nIn-Person:   https://events.vtools.ieee.org/m/551666 \nZoom:   https://tinyurl.com/5h3ccejs
URL:https://svec.org/event/the-intelligence-of-the-machine-the-rigor-of-the-road-2/
LOCATION:SEMI Headquarters\, 673 South Milpitas Blvd.\,\, Milpitas\, CA\, 95035
ATTACH;FMTTYPE=image/jpeg:https://svec.org/wp-content/uploads/2026/04/IEEE-VTS_260512_-speaker_final-scaled.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20260507T120000
DTEND;TZID=America/Los_Angeles:20260507T130000
DTSTAMP:20260609T165049
CREATED:20260311T183306Z
LAST-MODIFIED:20260311T183306Z
UID:77858-1778155200-1778158800@svec.org
SUMMARY:Power Distribution in Heterogeneous Integrated Packaging for Data Center Computing
DESCRIPTION:[]Join us for an insightful webinar with Francesco Carobolante\, founder of IoTissimo® LLC and an EPS Distinguished Lecturer\, as he explores the critical challenges and innovative solutions that advanced packaging can provide to address the "Power Wall". With over 30 years of industry experience and a tenure at Intel’s Corporate Strategy Office\, Francesco will delve into the Heterogeneous Integration Roadmap (HIR) perspective on scaling high-power AI processors. This session will analyze how signal BW and energy requirements dictate the options available for architecting the package structure\, including Vertical Power Delivery\, integrated voltage regulators and advanced thermal management techniques. Discover how these architectural shifts are enabling the next generation of data center performance.\nSpeaker(s): Francesco Carobolante\,\nVirtual: https://events.vtools.ieee.org/m/546237
URL:https://svec.org/event/power-distribution-in-heterogeneous-integrated-packaging-for-data-center-computing/
LOCATION:Virtual: https://events.vtools.ieee.org/m/546237
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20260512T120000
DTEND;TZID=America/Los_Angeles:20260512T130000
DTSTAMP:20260609T165049
CREATED:20260120T174820Z
LAST-MODIFIED:20260120T174820Z
UID:77639-1778587200-1778590800@svec.org
SUMMARY:From Process to Performance: Challenges in uOLED and uLED Electronics Manufacturing
DESCRIPTION:As uOLED and uLED technologies transition from research to high-volume manufacturing\, system performance is increasingly constrained by process variability rather than design intent. Electrical\, thermal\, and mechanical decisions made during manufacturing directly translate into optical non-uniformity\, efficiency loss\, and reliability challenges. Understanding these process-to-performance linkages is critical for building scalable\, high-performance emissive display systems.\nVirtual: https://events.vtools.ieee.org/m/533601
URL:https://svec.org/event/from-process-to-performance-challenges-in-uoled-and-uled-electronics-manufacturing-2/
LOCATION:Virtual: https://events.vtools.ieee.org/m/533601
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20260512T170000
DTEND;TZID=America/Los_Angeles:20260512T193000
DTSTAMP:20260609T165049
CREATED:20260402T110335Z
LAST-MODIFIED:20260427T014956Z
UID:78240-1778605200-1778614200@svec.org
SUMMARY:The Intelligence of the Machine.. The Rigor of the Road!!
DESCRIPTION:IEEE Event Agenda – Tuesday May 12\, 2026\n🔹 5:00 PM – 5:30 PM\nRegistration\, Refreshments\, Food & Networking (Meet & Greet)\nFeatured Speakers & Sessions\n🔹 5:30 PM – 6:15 PM\nTopic 1: Industry Talk – Standardizing Automotive Firmware for SDVs\nExperts from Mercedes-Benz\, Arm\, and Athos Silicon will discuss the urgent need for a standardized\, secure\, and vendor-agnostic firmware foundation.\nKey focus areas:\n– Overcoming fragmented firmware ecosystems\n– UEFI as a scalable automotive standard\n– Enabling functional safety\, cybersecurity\, and interoperability\n– Supporting chiplet-based and next-gen ADAS architectures\nSpeakers:\n– François Piednoël – (https://www.linkedin.com/in/francoispiednoel/)\n– Sachin Athanikar – (https://www.linkedin.com/in/sachin-athanikar-18ba5914/)\n– Dong Wei (https://www.linkedin.com/in/dongweimba/)\n🔹 6:15 PM – 6:45 PM\nTopic 2: Academic Keynote – Safe Embodied AI: From Theory to Deployment\nProf. Ding Zhao (Carnegie Mellon University)\nTopics include:\n– Rare-event safety in autonomous systems\n– Safe reinforcement and imitation learning\n– Generalizable and adaptive AI safety\n– Future of trustworthy embodied AI at scale\nSpeaker:\n– Ding Zhao – (https://www.linkedin.com/in/ding-zhao-01130730/)\n🔹 6:45 PM – 7:15 PM\nTopic 3: Industry Talk – Static Safety Is Dead: Continuous Risk & Compliance for SDVs\nAkshay Chalana (CEO & Co-founder\, Saphira AI)\nModern vehicles evolve continuously through software updates\, AI-driven functionality\, and increasing connectivity—yet safety and cybersecurity practices remain largely static.\nThis talk explores:\n– What breaks when traditional safety assumptions no longer hold\n– Real-world ADAS/autonomy failure propagation: dataset bias\, requirement drift\, and system boundary ambiguity\n– Cross-domain challenges between safety and cybersecurity\n– A new model for continuous\, system-aware risk assessment and compliance\n– Treating compliance artifacts as live infrastructure integrated into development pipelines\nThis session provides a practical path to maintaining certification-grade rigor while operating at software velocity.\nSpeaker:\n– Akshay Chalana – (https://www.linkedin.com/in/akshaychalana/)\n🔹 7:15 PM – 7:30 PM\nQ&A and open discussion – Aditi Ramadwar\nAbout This Technical Forum\nThis technical forum brings together OEMs\, Tier-1 suppliers\, semiconductor leaders\, researchers\, and innovators to address the challenge of fragmentation and define a unified\, future-ready mobility stack.\nWho Should Attend:\n– Automotive engineers and architects\n– Safety and cybersecurity specialists\n– Semiconductor and embedded systems professionals\n– Researchers in autonomous vehicles and AI safety\n– Technical decision-makers from OEMs and suppliers\n– Students in Automotive\, Compute\, Mechanical & Electrical Engineering\nWe would be delighted if you could join us and participate in shaping the future of intelligent transportation.\nSpeaker(s): Francois\, Wei \, Sachin\, Zhao\, Akshay\nSEMI\, 673 S Milpitas Blvd\, Milpitas\, California\, United States\, 95035
URL:https://svec.org/event/the-intelligence-of-the-machine-the-rigor-of-the-road/
LOCATION:SEMI\, 673 S Milpitas Blvd\, Milpitas\, California\, United States\, 95035
ATTACH;FMTTYPE=image/jpeg:https://svec.org/wp-content/uploads/2026/04/IEEE-VTS_260512_-speaker_final-scaled.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20260517T170000
DTEND;TZID=America/Los_Angeles:20260518T180000
DTSTAMP:20260609T165049
CREATED:20260206T094815Z
LAST-MODIFIED:20260206T094815Z
UID:77706-1779037200-1779127200@svec.org
SUMMARY:Spring Speaker Series 3
DESCRIPTION:Continuation of Speaker Series at Stanford IEEE.\nStanford\, California\, United States\, 94305
URL:https://svec.org/event/spring-speaker-series-3/
LOCATION:Stanford\, California\, United States\, 94305
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=-07:00:20260518T183000
DTEND;TZID=-07:00:20260518T203000
DTSTAMP:20260609T165049
CREATED:20260421T210324Z
LAST-MODIFIED:20260421T210324Z
UID:78274-1779129000-1779136200@svec.org
SUMMARY:Closing the Loop: Using Comp Vision to Auto PCB E-Waste Sorting (Student Proj)
DESCRIPTION:**TALK LOGISTICS:**\nMonday\, May 18\, 2026\n(remote speaker\, audience can be either in person or remote on Zoom. Please RSVP and indicate if you will be local or remote) \n6:30 registration\, food sponsored by Neo4j\, networking.\n7:00 SFbayACM upcoming events\, introduce the speaker\n7:10 to 8:15 or 8:30 based on Q and A – presentation \nZoom link:\n(updated 2 days before the event)\nYouTube:\n(updated 2 days before the event) \nSFbayACM will support a local audience at VRP in Mountain View \n.\n**TALK DESCRIPTION:**\nElectronic waste is one of the fastest-growing waste streams in the world\, yet most recycling processes destroy valuable components through industrial shredding. This talk walks through our project building a low-cost\, AI-powered system that identifies and physically sorts reusable components from discarded printed circuit boards (PCBs) — recovering more value at the component level rather than treating boards as bulk scrap. \nA key advantage of our system is cost. Our full build came in at roughly $350\, compared to approximately $5\,000–$6\,000 for a tumbler-based solution — which only recovers lower-value bulk material — and $20\,000+ for a commercial pick-and-place system. \n**Proposed Talk Structure:**\n**1. The Problem** — Scale of PCB e-waste globally and in the Bay Area\, why industrial shredding leaves recoverable value on the table\, and the circular economy opportunity at the component level. \n**2. Technical Approach** — Dataset construction: merging FPIC and Dataset Ninja (~6\,000+ annotated images\, 18 component classes). Model selection: YOLOv11 instance segmentation and why it fits a centroid-based picking system. Training pipeline challenges — class mapping inconsistencies across merged datasets. Results: ~91% mAP across component classes. \n**3. Mechanical Design** — Gantry hardware selection and why a repurposed CR10 3D printer frame made sense. Stepper motor control and coordinate mapping from vision output to physical space. Tradeoffs in the mechanical design — precision vs. cost vs. complexity. \n**4. The Physical System in Action** — Integrating vision model output with the gantry. Video walkthrough of end-to-end component sorting. \n**5. Lessons Learned & Broader Implications** — What broke\, what surprised us\, and what we’d do differently. Potential applications — PCB recyclers\, repair shops\, maker spaces. Where AI fits in sustainable hardware reuse pipelines. \n.\n**SPEAKER’s BIO:**\n**Vighnesh is a junior at Archbishop Mitty High School in San Jose\,** California. He recently competed in his first science fair\, the Synopsys Silicon Valley Science & Technology Championship\, where he and his teammates placed 2nd in the engineering category. His interests span computer vision\, robotics\, and AI\, and he has experience as a junior developer working with TypeScript\, React\, and SQL. He is also a member of his school’s FRC robotics team. \n**Lalit is a junior at Archbishop Mitty High School** specializing in computer vision\, robotics\, and embedded systems\, with hands-on experience spanning Arduino and Raspberry Pi integration\, YOLOv11-based object detection\, and competitive robotics programming in C++. He serves as the lead programmer for his school’s VEX Robotics team and co-president of the Data Science Club\, where he has developed expertise in autonomous systems and real-time control. Along with Vighnesh and Vrishank\, he competed in his first science fair\, the Synopsys Silicon Valley Science & Technology Championship\, where they placed 2nd in the engineering category. \n**Vrishank is a junior at Archbishop Mitty High School in San Jose\,** California. He conducted research at UC Santa Cruz’s COSMOS program in photonics\, working on SPR biosensing and Fresnel lens optimization for solar sails. He competed at the Synopsys Silicon Valley Science & Technology Championship\, where his team placed 2nd in the engineering category with an automated e-waste sorting system. He developed a CAR-T cell therapy manufacturing QC system for the BioHESC bioengineering competition\, where his team placed 1st. His other projects include high voltage electronics such as nixie tube clocks and flyback transformer circuits. His interests are in electrical engineering\, photonics\, and semiconductors\, and he has experience in FRC and FLL robotics.
URL:https://svec.org/event/closing-the-loop-using-comp-vision-to-auto-pcb-e-waste-sorting-student-proj/
LOCATION:Valley Research Park\, 319 N Bernardo Ave\, Mountain View\, CA\, 94043\, United States
ATTACH;FMTTYPE=image/jpeg:https://svec.org/wp-content/uploads/2026/04/1024x576-V9efqx.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=-07:00:20260518T183000
DTEND;TZID=-07:00:20260518T203000
DTSTAMP:20260609T165049
CREATED:20260421T210324Z
LAST-MODIFIED:20260421T210324Z
UID:78275-1779129000-1779136200@svec.org
SUMMARY:Closing the Loop: Using Comp Vision to Auto PCB E-Waste Sorting (Student Proj)
DESCRIPTION:**TALK LOGISTICS:**\nMonday\, May 18\, 2026\n(remote speaker\, audience can be either in person or remote on Zoom. Please RSVP and indicate if you will be local or remote) \n6:30 registration\, food sponsored by Neo4j\, networking.\n7:00 SFbayACM upcoming events\, introduce the speaker\n7:10 to 8:15 or 8:30 based on Q and A – presentation \nZoom link:\n(updated 2 days before the event)\nYouTube:\n(updated 2 days before the event) \nSFbayACM will support a local audience at VRP in Mountain View \n.\n**TALK DESCRIPTION:**\nElectronic waste is one of the fastest-growing waste streams in the world\, yet most recycling processes destroy valuable components through industrial shredding. This talk walks through our project building a low-cost\, AI-powered system that identifies and physically sorts reusable components from discarded printed circuit boards (PCBs) — recovering more value at the component level rather than treating boards as bulk scrap. \nA key advantage of our system is cost. Our full build came in at roughly $350\, compared to approximately $5\,000–$6\,000 for a tumbler-based solution — which only recovers lower-value bulk material — and $20\,000+ for a commercial pick-and-place system. \n**Proposed Talk Structure:**\n**1. The Problem** — Scale of PCB e-waste globally and in the Bay Area\, why industrial shredding leaves recoverable value on the table\, and the circular economy opportunity at the component level. \n**2. Technical Approach** — Dataset construction: merging FPIC and Dataset Ninja (~6\,000+ annotated images\, 18 component classes). Model selection: YOLOv11 instance segmentation and why it fits a centroid-based picking system. Training pipeline challenges — class mapping inconsistencies across merged datasets. Results: ~91% mAP across component classes. \n**3. Mechanical Design** — Gantry hardware selection and why a repurposed CR10 3D printer frame made sense. Stepper motor control and coordinate mapping from vision output to physical space. Tradeoffs in the mechanical design — precision vs. cost vs. complexity. \n**4. The Physical System in Action** — Integrating vision model output with the gantry. Video walkthrough of end-to-end component sorting. \n**5. Lessons Learned & Broader Implications** — What broke\, what surprised us\, and what we’d do differently. Potential applications — PCB recyclers\, repair shops\, maker spaces. Where AI fits in sustainable hardware reuse pipelines. \n.\n**SPEAKER’s BIO:**\n**Vighnesh is a junior at Archbishop Mitty High School in San Jose\,** California. He recently competed in his first science fair\, the Synopsys Silicon Valley Science & Technology Championship\, where he and his teammates placed 2nd in the engineering category. His interests span computer vision\, robotics\, and AI\, and he has experience as a junior developer working with TypeScript\, React\, and SQL. He is also a member of his school’s FRC robotics team. \n**Lalit is a junior at Archbishop Mitty High School** specializing in computer vision\, robotics\, and embedded systems\, with hands-on experience spanning Arduino and Raspberry Pi integration\, YOLOv11-based object detection\, and competitive robotics programming in C++. He serves as the lead programmer for his school’s VEX Robotics team and co-president of the Data Science Club\, where he has developed expertise in autonomous systems and real-time control. Along with Vighnesh and Vrishank\, he competed in his first science fair\, the Synopsys Silicon Valley Science & Technology Championship\, where they placed 2nd in the engineering category. \n**Vrishank is a junior at Archbishop Mitty High School in San Jose\,** California. He conducted research at UC Santa Cruz’s COSMOS program in photonics\, working on SPR biosensing and Fresnel lens optimization for solar sails. He competed at the Synopsys Silicon Valley Science & Technology Championship\, where his team placed 2nd in the engineering category with an automated e-waste sorting system. He developed a CAR-T cell therapy manufacturing QC system for the BioHESC bioengineering competition\, where his team placed 1st. His other projects include high voltage electronics such as nixie tube clocks and flyback transformer circuits. His interests are in electrical engineering\, photonics\, and semiconductors\, and he has experience in FRC and FLL robotics.
URL:https://svec.org/event/closing-the-loop-using-comp-vision-to-auto-pcb-e-waste-sorting-student-proj-2/
LOCATION:Valley Research Park\, 319 N Bernardo Ave\, Mountain View\, CA\, 94043\, United States
ATTACH;FMTTYPE=image/jpeg:https://svec.org/wp-content/uploads/2026/04/1024x576-V9efqx.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20260519T080000
DTEND;TZID=America/Los_Angeles:20260520T170000
DTSTAMP:20260609T165049
CREATED:20260206T094815Z
LAST-MODIFIED:20260206T094815Z
UID:77708-1779177600-1779296400@svec.org
SUMMARY:Third Annual IEEE Build-Up Substrate Symposium
DESCRIPTION:[]\n(More information will be added in early March. General Registration should open around March 1st. Sponsors may register at the link below.)\nWe are living in the era of heterogeneous integration driven by fast\, efficient and big data computing resources at our fingertips. The mega-monolithic silicon chip is a thing of the past\, replaced with 3D heterogeneous integration of chiplets onto a platform made of an organic build-up substrate. Volume manufacturers of build-up substrates are entirely based in Asia\, leaving a desert in the US. Volume build-up substrates used by major IDMs are manufactured in Asian countries including Taiwan\, Japan and China.\nHowever\, there are multiple activities starting up in the US\, and this is why a gathering of the US players is important. This symposium is geared for all those involved in the supply chain of build-up substrates in the US\, as well as users. This Symposium is an opportunity for all build-up substrate players to meet\, network and cohesively work with funding agencies who will be invited to this symposium to focus on onshoring build-up substrate production and utilization.\nSamsung\, San Jose\, California\, United States
URL:https://svec.org/event/third-annual-ieee-build-up-substrate-symposium/
LOCATION:Samsung\, San Jose\, CA\, United States
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20260519T090000
DTEND;TZID=America/Los_Angeles:20260520T170000
DTSTAMP:20260609T165049
CREATED:20260304T174831Z
LAST-MODIFIED:20260304T174831Z
UID:77832-1779181200-1779296400@svec.org
SUMMARY:IEEE Build-Up Substrate Symposium (BUSS)
DESCRIPTION:We are living in the era of heterogeneous integration driven by fast\, efficient and big data computing resources at our fingertips. The mega-monolithic silicon chip is a thing of the past\, replaced with 3D heterogeneous integration of chiplets onto a platform made of an organic build-up substrate. Volume manufacturers of build-up substrates are entirely based in Asia\, leaving a desert in the US. Volume build-up substrates used by major IDMs are manufactured in Asian countries including Taiwan\, Japan and China.\nHowever\, there are multiple activities starting up in the US\, and this is why a gathering of the US players is important. This symposium is geared for all those involved in the supply chain of build-up substrates in the US\, as well as users. As the US Congress debates H.R. 3249\, the Protecting Circuit Boards and Substrates (PCBS) Act\, this Symposium is an opportunity for all build-up substrate players to meet\, network and cohesively work with funding agencies who will be invited to this symposium to focus on onshoring build-up substrate production and utilization.\nlocation to be announced\, Milpitas\, California\, United States\, Virtual: https://events.vtools.ieee.org/m/544352
URL:https://svec.org/event/ieee-build-up-substrate-symposium-buss-2/
LOCATION:location to be announced\, Milpitas\, California\, United States\, Virtual: https://events.vtools.ieee.org/m/544352
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/New_York:20260525T210000
DTEND;TZID=America/New_York:20260526T170000
DTSTAMP:20260609T165049
CREATED:20260226T173312Z
LAST-MODIFIED:20260226T173312Z
UID:77809-1779742800-1779814800@svec.org
SUMMARY:IEEE Canada Blockchain Forum 2026 (4th edition)
DESCRIPTION:The IEEE Blockchain Forum is returning for the fourth time as part of (https://www.torontotechweek.com/). The goal of this compact one-day event is to congregate BUIDLers\, researchers\, academics\, and engineers building blockchain protocols\, infrastructure\, and decentralized software applications.\nNote: (https://events.vtools.ieee.org/m/469545) counted with 200 participants and speakers from JP Morgan\, the Bank of Canada\, Mastercard\, the Ethereum Enterprise Alliance\, EY\, Starknet\, among others.\n[]\nCo-sponsored by: Government of Ontario\nAgenda:\nAgenda TBC\nOntario Investment and Trade Centre\, 250 Yonge Street\, 35th Floor\, Toronto\, Ontario\, Canada\, M5B 2L7
URL:https://svec.org/event/ieee-canada-blockchain-forum-2026-4th-edition/
LOCATION:Ontario Investment and Trade Centre\, 250 Yonge Street\, 35th Floor\, Toronto\, Ontario\, Canada\, M5B 2L7
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=-07:00:20260527T190000
DTEND;TZID=-07:00:20260527T210000
DTSTAMP:20260609T165049
CREATED:20260425T210424Z
LAST-MODIFIED:20260425T210424Z
UID:78281-1779908400-1779915600@svec.org
SUMMARY:Latest & Unique Tech Innovations from the 2026 Consumer Electronics Show (CES) 
DESCRIPTION:LOCATION ADDRESS (Hybrid\, in person or by zoom\, you choose)\nValley Research Park\n319 North Bernardo Avenue\nMountain View\, CA CA 93043\nIf you want to join remotely\, you can submit questions via Zoom Q&A. The zoom link:\n[https://acm-org.zoom.us/](https://acm-org.zoom.us/j/99320216248?pwd=hmIZXJbNiS0F4hrJerx0ffnI8rbYOr.1)\nJoin via YouTube:\nhttps://youtube.com/live/sJ38lsfLfeU \nAGENDA\n6:30 Door opens\, SFBAY ACM 69 anniversary Cake and networking (we invite honor system contributions)\n**7:00** SFBay ACM 2025 Slate of board members and annual election\, upcoming events.\n7:15 Speaker presents\n8:25- 8:40 finish\, depending on Q&A \nJoin SF Bay ACM Chapter for an insightful discussion on: \nAbstract\nThis is a summary of the latest and unique tech innovations from the **2026 Consumer Electronics Show (CES)** in Las Vegas. CES’s focus has expanded beyond consumer electronic devices to many categories including wearables\, smart homes\, robotics\, drones\, medical and healthcare devices\, etc. \nSpeaker Bio:\n**Avery Lu is one of the leaders in the Valley in tech business development\, and is current Chair of the IEEE Santa Clara Valley Section**.\nAs Partner & Head of Business Development\, Investments for Aventurine Capital Group\, LLC **([www.aventurine.com](http://www.aventurine.com/))**\, Avery Lu leverages his\n30+ year’s experience as a high-tech business executive in both large corporations and startups. He works directly with\npartners in venture capital\, universities and startups as well as scientists to identify high value intellectual property for\ninvestment and commercialization. Avery is also Senior Director of Program Development and Interest Groups at the\nGlobal Semiconductor Alliance (GSA) **([www.gsaglobal.org](http://www.gsaglobal.org/))**\, a global platform “Where Leaders Meet” to establish an efficient\, profitable\, and\nsustainable high technology global ecosystem encompassing semiconductors\, software\, solutions\, systems\, and services. \nHe has previously co-founded 3 startups; Palo Alto Scientific (AI sports analytics/ wearables/IoT)\, ActionSpot Startup Studio\n(venture studio & co-working space) and WBGlobalSemi (SiC power management solutions). Early in his career\, Avery held\nvarious senior level roles in Business Development\, Segment Marketing\, Product Marketing\, Global Account Management\nand Field Applications Engineering at NXP Semiconductor\, Infineon Technologies\, Toshiba Semiconductor\, Winbond Electronics\,\nAmerican Microsystems Incorporated\, Cypress Semiconductor\, Viewlogic Systems and Xilinx. \nAvery is a Senior Member of IEEE (Institute of Electrical & Electronics Engineers) and Professional Member of IEEE Eta\nKappa Nu Honor Society who is the current Chair of IEEE Santa Clara Valley (SCV) Section in Silicon Valley\, a former\n2015-2016 Chair of IEEE SCV Consumer Technology Society Chapter and an Executive Committee Member of IEEE SCV\nStartup Special Interest Group. Since 2011\, he has served on the Board of Directors of CASPA (Chinese American\nSemiconductor Professional Association)\, and has served on the Advisory Board of the Center for Innovation and\nEntrepreneurship at his alma mater\, Santa Clara University\, where he earned his B.S. in Electrical Engineering.\n[www.linkedin.com/in/averylu](http://www.linkedin.com/in/averylu)\n— \nValley Research Park is a coworking research campus of 104\,000 square feet hosting 30+ life science and technology companies. VRP has over 100 dry labs\, wet labs\, and high power labs sized from 125-15\,000 square feet. VRP manages all of the traditional office elements: break rooms\, conference rooms\, outdoor dining spaces\, and recreational spaces. \nAs a plug-and-play lab space\, once companies have secured their next milestone and are ready to expand\, VRP has 100+ labs ready to expand into.\nhttps://www.valleyresearchpark.com/
URL:https://svec.org/event/latest-unique-tech-innovations-from-the-2026-consumer-electronics-show-ces/
LOCATION:Valley Research Park\, 319 N Bernardo Ave\, Mountain View\, CA\, 94043\, United States
ATTACH;FMTTYPE=image/jpeg:https://svec.org/wp-content/uploads/2026/04/1024x576-hVql9B.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=-07:00:20260529T130000
DTEND;TZID=-07:00:20260529T170000
DTSTAMP:20260609T165049
CREATED:20260503T213310Z
LAST-MODIFIED:20260503T213310Z
UID:78368-1780059600-1780074000@svec.org
SUMMARY:Internet Day SF 2026
DESCRIPTION:The goal of **Internet Day SF** is to provide training and thought leadership around any and all aspects of the Internet. \n[https://internetdaysf.org/](https://internetdaysf.org/) \n**This time\, we are virtual only.** We will go live with the material on May 29th. \nThis event is a partnership between the Internet Society San Francisco and SF Bay ACM. \n**Call for Presenters** \nWe are looking for both training and thought leadership presentations in support of the Internet. \nRequirements\, shared requirements for both training and thought leadership: \nSend following to Ronald Petty (DM here):\n* Title and Abstract (approval required)\n* Provide short bio of yourself\, and your email address (to sync later) \n* Speaker(s) **must live and work Bay area** (if you want to present and don’t live here\, we can guide you to related opportunities)\n* **Ability to produce and share video by May 20th** (audio matters to!)\n* Videos **must be under 30 minutes total** (shorter better\, we like things to the point!)\n* **Content must be open source (tools and techniques) and / or public (e.g. regulations)**\n* **No advertising allowed** (unless you are sponsor – requires approval) \nFurther requirements\, **if technical talk**: \n* You **must share a single document** that has all the steps to replicate (markdown is ideal and preferred)\, in addition to the recording. We know not all “devices” might be readily available (aka quantum computers\, but if you have the steps you might try one day!) This is required by 20th as well. \nFurther requirements\, **if thought leadership**: \n* If you are presenting on things like regulations\, you must **provide the links in advance** so others can read about them before the event (aka do their homework!). This is required by 20th as well. \nWe are open to all levels of talks. For example\, just learned a new technique in class to packet sniff\, share it. Want to show people how to be safer on some social application\, please do! Internet of things with AI! We are for it! \nIf you have any questions please DM me. Thank you for your time! \nRonald Petty\nChair – SF Bay ACM
URL:https://svec.org/event/internet-day-sf-2026/
LOCATION:Online event
ATTACH;FMTTYPE=image/jpeg:https://svec.org/wp-content/uploads/2026/05/1024x576-72GTDE.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20260605T163000
DTEND;TZID=America/Los_Angeles:20260605T173000
DTSTAMP:20260609T165049
CREATED:20260605T160458Z
LAST-MODIFIED:20260605T160458Z
UID:78468-1780677000-1780680600@svec.org
SUMMARY:2026 VTS Hybrid Distinguished Lecture: Twisted Signals for ISAC via OAM Vortex Beams
DESCRIPTION:Electromagnetic waves are characterized by their amplitude\, frequency\, and state of polarization — also referred to as spin angular momentum (SAM)\, associated with circular polarization and recognized for over two centuries. In contrast\, over the past three decades\, growing attention has been directed toward orbital angular momentum (OAM)\, which arises from helical (twisted) phase fronts and provides an additional degree of freedom through its orthogonal modal structure. In this talk\, we explore the use of OAM for integrated sensing and communications (ISAC)\, with the goal of enhancing spectral efficiency and spatial resolution in automotive scenarios. Unlike conventional uniform circular array (UCA)-based implementations\, our approach employs a uniform linear array (ULA) with traveling-wave antennas to synthesize multiple Laguerre-Gaussian vortex beams. The proposed system embeds communication data within radar waveforms while enabling joint estimation of target position and velocity using radar-only frames. An OAM-based mode-division multiplexing strategy is used to separate sensing and communication functionalities\, ensuring reliable parameter recovery. We conclude with perspectives on the future of ISAC systems.\nSpeaker(s): Dr. Mishra\nAgenda:\n4:30-5:30 PM Lecture and Q&A\nRoom: Seminar Room B \, Bldg: San Diego Mission Valley Branch Library\, 1F\, 2123 Fenton Pkwy\, San Diego\, California\, United States\, 92108\, Virtual: https://events.vtools.ieee.org/m/562094
URL:https://svec.org/event/2026-vts-hybrid-distinguished-lecture-twisted-signals-for-isac-via-oam-vortex-beams/
LOCATION:Room: Seminar Room B \, Bldg: San Diego Mission Valley Branch Library\, 1F\, 2123 Fenton Pkwy\, San Diego\, California\, United States\, 92108\, Virtual: https://events.vtools.ieee.org/m/562094
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20260608T180000
DTEND;TZID=America/Los_Angeles:20260608T190000
DTSTAMP:20260609T165049
CREATED:20260605T160458Z
LAST-MODIFIED:20260605T160458Z
UID:78470-1780941600-1780945200@svec.org
SUMMARY:SCV WIE May 2026 ExCom Meeting
DESCRIPTION:Topic: SCV WIE Mar ExCom Meeting\nTime: Mar 26\, 2026 06:00 PM Pacific Time (US and Canada)\nEvery month on the 26 of the month\, 36 occurrence(s)\nMonthly: https://zoom.us/meeting/tJArfumopzkpHtaky1j5fYpqwMUeY7hSmBWs/ics?icsToken=DLAvxr8efHNhT92mFgAALAAAAICuIz08PSYY6dBYKGdyAmG9V8apUVN2a4qZ15xYs4WT3mV-sSkt5z2I4R9S5HnEoBhV7EWs81CyNNkybzAwMDAwMQ&meetingMasterEventId=GF3_gS3WTzuUZDIP3DGSlw\nJoin Zoom Meeting\nhttps://zoom.us/j/94690092342?pwd=7PGwqJDSorXhy8TcYD9alL0bucCPEc.1\nMeeting ID: 946 9009 2342\nPasscode: 9yPaX9\nAgenda:\n– New member introductions\n– Past Events\n– Upcoming Events\n– Other agenda items\nVirtual: https://events.vtools.ieee.org/m/561477
URL:https://svec.org/event/scv-wie-may-2026-excom-meeting/
LOCATION:Virtual: https://events.vtools.ieee.org/m/561477
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20260609T190000
DTEND;TZID=America/Los_Angeles:20260609T210000
DTSTAMP:20260609T165049
CREATED:20260605T160458Z
LAST-MODIFIED:20260605T160458Z
UID:78472-1781031600-1781038800@svec.org
SUMMARY:Data Storage in Outer Space: Overcoming the Obstacles
DESCRIPTION:This is a hybrid in-person and online event. Pre-registration is required for either.\nAfter a 50-year hiatus\, multiple countries are racing to be the first to return to the Moon. Lower launch costs are enabling more satellites to be put into low earth orbit\, and data centers in space and on the moon are being planned. In addition\, preparations are afoot for harvesting and mining the moon and asteroids\, as well as for colonizing Mars.\nIt appears that we are on the brink of a new industrial revolution with development beyond our planet\, and reliable data storage and processing will be key requirements to make all of this the new reality. However\, these harsh environments present obstacles that must be overcome for the ambitious plans to become reality.\nIn this talk\, Dr. Tom Coughlin will discuss many of the requirements for this new revolution\, and some of the technologies that look to make this possible.\nSpeaker(s): Dr. Tom Coughlin\,\n925 Thompson Place\, Sunnyvale\, California\, United States\, 94085\, Virtual: https://events.vtools.ieee.org/m/562084
URL:https://svec.org/event/data-storage-in-outer-space-overcoming-the-obstacles/
LOCATION:925 Thompson Place\, Sunnyvale\, California\, United States\, 94085\, Virtual: https://events.vtools.ieee.org/m/562084
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=-07:00:20260610T183000
DTEND;TZID=-07:00:20260610T190000
DTSTAMP:20260609T165049
CREATED:20260602T223306Z
LAST-MODIFIED:20260602T223306Z
UID:78455-1781116200-1781118000@svec.org
SUMMARY:Election && General Meeting
DESCRIPTION:The SF Bay ACM annual election and general meeting will occur at 6:30 PM on the 10th of June. This meeting will be followed up by our General Computing presentation starting at 7 PM. \nThe proposed slate of candidates will be shared after this week’s council meeting on the 3rd of June (Wednesday). \nDue note\, this is earlier than our normal starting time at 7 PM. Doors will open at VRP by 6 PM. \n69th Birthday Cake from Sheng Kee Bakery will be served. \nDetails on eligibility to vote will be sent as follow up message via our email list and via meetup. If there are any questions please dm me. \nRegards.\nRonald Petty – Chair\, SF Bay ACM
URL:https://svec.org/event/election-general-meeting/
LOCATION:Valley Research Park\, 319 N Bernardo Ave\, Mountain View\, CA\, 94043\, United States
ATTACH;FMTTYPE=image/jpeg:https://svec.org/wp-content/uploads/2026/06/1024x576-4ySQeH.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=-07:00:20260610T190000
DTEND;TZID=-07:00:20260610T210000
DTSTAMP:20260609T165049
CREATED:20260502T213303Z
LAST-MODIFIED:20260502T213303Z
UID:78363-1781118000-1781125200@svec.org
SUMMARY:The IEEE Mass Storage Roadmap 2026 Update
DESCRIPTION:LOCATION ADDRESS (Hybrid\, in person or by zoom\, you choose)\nValley Research Park\n319 North Bernardo Avenue\nMountain View\, CA CA 93043\nIf you want to join remotely\, you can submit questions via Zoom Q&A. The zoom link:\n[https://acm-org.zoom.us/j/](https://acm-org.zoom.us/j/99320216248?pwd=hmIZXJbNiS0F4hrJerx0ffnI8rbYOr.1)\nJoin via YouTube:\nhttps://youtube.com/live/sJ38lsfLfeU \nAGENDA\n6:30 Door opens\, SFBAY ACM 68 anniversary Cake and networking (we invite honor system contributions)\n**7:00** SFBay ACM 2026 Slate of board members and annual election\, upcoming events.\n7:15 Dr. Tom Coughlin :”The IEEE Mass Storage Roadmap 2026 Update”\n8:25- 8:40 finish\, depending on Q&A \nJoin SF Bay ACM Chapter for an insightful discussion on: \nAbstract\nA group of experts recently completed a roadmap for all types of digital storage technology out 15 years into the future. This includes NAND flash and new non-volatile memories\, hard disk drives\, magnetic tape\, optical storage and DNA storage. Come to this talk to get a glimpse of the future of something that people can’t get enough of\, digital storage technology. \nSpeaker Bio:\nTom Coughlin\, President\, Coughlin Associates is a digital storage analyst and business/ technology consultant. He has over 40 years in the data storage industry with engineering and senior management positions. Coughlin Associates consults\, publishes books and market and technology reports and puts on digital storage and memory-oriented events. He is a regular contributor for forbes.com and M&E organization websites. He is an IEEE Fellow\, an ACM Senior Member\, 2024 IEEE President\, Past-President IEEE-USA\, Past Director IEEE Region 6 and Past Chair Santa Clara Valley IEEE Section\, and is also active with SNIA\, SMPTE and CNSV. For more information on Tom Coughlin go to [www.tomcoughlin.com](http://www.tomcoughlin.com/). \n— \nValley Research Park is a coworking research campus of 104\,000 square feet hosting 30+ life science and technology companies. VRP has over 100 dry labs\, wet labs\, and high power labs sized from 125-15\,000 square feet. VRP manages all of the traditional office elements: break rooms\, conference rooms\, outdoor dining spaces\, and recreational spaces. \nAs a plug-and-play lab space\, once companies have secured their next milestone and are ready to expand\, VRP has 100+ labs ready to expand into.\nhttps://www.valleyresearchpark.com/
URL:https://svec.org/event/the-ieee-mass-storage-roadmap-2026-update/
LOCATION:Valley Research Park\, 319 N Bernardo Ave\, Mountain View\, CA\, 94043\, United States
ATTACH;FMTTYPE=image/jpeg:https://svec.org/wp-content/uploads/2026/05/1024x576-VmveU3.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=-07:00:20260611T170000
DTEND;TZID=-07:00:20260611T200000
DTSTAMP:20260609T165049
CREATED:20260603T223309Z
LAST-MODIFIED:20260603T223309Z
UID:78464-1781197200-1781208000@svec.org
SUMMARY:Platform Engineering & AI @ Intuit
DESCRIPTION:Intuit is committed to open source. We maintain and contribute to many tools and actively participate in communities including CNCF\, Istio\, GraphQL\, Web\, and Mobile ecosystems. Let’s meetup\, devs! \nJoin us for an evening focused on the tools and cultural shifts driving the industry forward. We’ll dive into **AI\, Platform Engineering\, and Open Source**. With practical demos\, talks\, and time to connect with other builders. \nThis is an in-person only event\, you must register here. \n[https://luma.com/intuitossmtvjun2026](https://www.linkedin.com/safety/go?url=https%3A%2F%2Fluma.com%2Fintuitossmtvjun2026&trk=flagship-messaging-web&messageThreadUrn=urn%3Ali%3AmessagingThread%3A2-NDg1NDNjNTctYjk5MC00ZTNmLTk3NTMtNjIzYmUwOTc0ZGViXzEwMA%3D%3D&lipi=urn%3Ali%3Apage%3Ad_flagship3_messaging_conversation_detail%3BNjPuXmQxR%2BKfVWclsoDg5A%3D%3D) \n* ​[Kevin Niparko](https://www.linkedin.com/in/kevin-niparko-5ab86b54/?lipi=urn%3Ali%3Apage%3Ad_flagship3_profile_view_base%3B6r%2FvmRNlQeS5rd7085PqSQ%3D%3D&utm_source=luma) | Product Lead @ [Cursor](https://cursor.com/get-started?utm_source=google_paid&utm_campaign=%5BSearch%5D%20%5BBrand%5D%20%5BEN%5D%20%5BCore%20T1%5D%20%5BBroad%5D%20%5BVBB%5D%20Brand&utm_term=cursor&utm_medium=paid&utm_content=798404224783&cc_platform=google&cc_campaignid=23656700841&cc_adgroupid=195242436478&cc_adid=798404224783&cc_keyword=cursor&cc_matchtype=b&cc_device=c&cc_network=g&cc_placement=&cc_location=9032185&cc_adposition=&gad_source=1&gad_campaignid=23656700841&gbraid=0AAAABAkdGgR8rTR8C000M8i69wLyQXqmB&gclid=Cj0KCQjw_vnQBhCxARIsADcZyxLq9Ic01uENBECQCbdAVm7YwjMGm708m-CJb5p1lkL8qDK4-N_jly0aAnJWEALw_wcB)\n* ​[Amber Bennoui](https://www.linkedin.com/in/amber-bennoui/?utm_source=luma) | Principal Product Manager for DevRel @ [DataRobot](https://www.datarobot.com/?utm_source=luma)\n* ​[Ronald Petty](https://www.linkedin.com/in/ronaldpetty/?utm_source=luma) | Principal Consultant @ [RX-M](https://rx-m.com/?utm_source=luma) (SF Bay ACM!!!)
URL:https://svec.org/event/platform-engineering-ai-intuit/
LOCATION:Intuit Bldg 6\, 2750 Coast Ave\, 2750 Coast Ave\, Mountain View\, CA\, United States
ATTACH;FMTTYPE=image/jpeg:https://svec.org/wp-content/uploads/2026/06/1024x576-D8lrqG.jpg
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BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20260615T090000
DTEND;TZID=America/Los_Angeles:20260615T100000
DTSTAMP:20260609T165049
CREATED:20260605T160459Z
LAST-MODIFIED:20260605T160459Z
UID:78474-1781514000-1781517600@svec.org
SUMMARY:Biodegradable Electronics in the Semiconductor Era
DESCRIPTION:[]\nCo-Sponsored by the OEB/SCV SSIT Chapter and the SCV/OEB/SF EPS Chapter\nThe semiconductor era has transformed modern life\, yet\, as electronic technologies become increasingly pervasive\, their environmental footprint\, short product lifecycles\, and growing contribution to global e-waste present a critical challenge. In this context\, biodegradable electronics is emerging as a complementary paradigm for specific classes of future devices where transient operation\, material sustainability\, and responsible end-of-life are essential.\nThis talk will examine how biodegradable electronics can be positioned within the broader semiconductor ecosystem through innovations in functional materials\, low-temperature processing\, flexible device platforms\, and sustainable integration strategies. Particular emphasis will be placed on biodegradable and bio-derived substrates\, piezoelectric and conductive material systems\, as well as their relevance to packaging\, sensor platforms\, and distributed electronic applications. The discussion will highlight how principles from semiconductor science and engineering can be extended beyond the chip toward greener system-level design\, including interface materials\, encapsulation\, and degradation-aware architectures.\nSpeaker(s): Shweta Agarwala\,\nVirtual: https://events.vtools.ieee.org/m/558051
URL:https://svec.org/event/biodegradable-electronics-in-the-semiconductor-era/
LOCATION:Virtual: https://events.vtools.ieee.org/m/558051
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BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20260615T173000
DTEND;TZID=America/Los_Angeles:20260615T190000
DTSTAMP:20260609T165049
CREATED:20260605T160459Z
LAST-MODIFIED:20260605T160459Z
UID:78476-1781544600-1781550000@svec.org
SUMMARY:Women Engineering Legends: A Pioneering Legacy
DESCRIPTION:A Panel Discussion by some of the co-editors and authors of Springer Nature Publishing's\nWomen Engineering Legends 1952-1976\nSpeaker(s): Debra\, Jan\nAgenda:\nAgenda\n– Introductions\n– Inspiration\n– Chapter Reviews\n– Summary\n– Conclusions\n– Give-Aways\nVirtual: https://events.vtools.ieee.org/m/554759
URL:https://svec.org/event/women-engineering-legends-a-pioneering-legacy/
LOCATION:Virtual: https://events.vtools.ieee.org/m/554759
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20260616T100000
DTEND;TZID=America/Los_Angeles:20260616T140000
DTSTAMP:20260609T165049
CREATED:20260609T163320Z
LAST-MODIFIED:20260609T163320Z
UID:78503-1781604000-1781618400@svec.org
SUMMARY:Watts at Stake: Silicon Valley’s Energy Crossroads
DESCRIPTION:Santa Clara Valley IEEE Power & Energy and Industry Applications Societies invites you to a Cal Alumni of Silicon Valley Energy Forum\nJoin us in person June 16 in Palo Alto for a half day energy forum:\nTime: 10:00 AM TO 2:00 PM PST\nCost: $30 LESS 25% IEEE discount\nRSVP Registration is at the Cal Alumni site: [](https://www.eventbrite.com/e/energy-at-a-crossroads-a-cal-alumni-of-silicon-valley-energy-forum-tickets-1988570674418)\nHint: Enter the code CASVJUNE25 during Eventbrite registration in the “discount code” box at the bottom of the Eventbrite/payment page for and click “apply” before completing payment.\nNote: 7 day cancellation period begins Tuesday June 9. The Eventbrite site needs your title and company name for badges\, but it is your option to join the Cal Alumni mailing list.\nPES/IAS Chapter Page: (https://r6.ieee.org/scv-pesias/%20)\nReservation URL: https://www.eventbrite.com/e/energy-at-a-crossroads-a-cal-alumni-of-silicon-valley-energy-forum-tickets-1988570674418\nAbout the talk:\nCalifornia sits at the center of three colliding forces: surging electricity demand driven by data centers and electrification\, rising costs that are squeezing households and businesses\, and wildfire risk that is reshaping how utilities build\, maintain\, and protect the grid.\nWhat does this mean for rates\, reliability\, and the future of the state's energy system? And what can actually be done about it?\nCal Alumni of Silicon Valley is hosting a half-day energy forum bringing together academic research\, alumni perspectives\, and industry experience. Professor Severin Borenstein\, Faculty Director of the Energy Institute at Haas\, will deliver a keynote on how data centers are affecting electricity markets and what practical steps exist to make energy more affordable. An alumni panel will explore energy topics from across the Cal community. And PG&E will present on the wildfire mitigation strategies they are deploying to protect California's grid.\nWhether you work in energy\, tech\, policy\, or are simply a ratepayer who wants to understand what is driving your bill\, this is a conversation worth being part of.\nDate: Tuesday\, June 16\, 2026\nTime: 10:00 a.m. – 2:00 p.m.\nLocation: Morgan Lewis & Bockius LLP\nAddress: 1400 Page Mill Rd\, Palo Alto\, CA 94304\n(https://r6.ieee.org/scv-pesias/)\nSpeaker(s): Prof. Borenstein\,\nAgenda:\n10:00 – 10:30 a.m.: Arrival\, seating\, and light refreshments\n10:30 – 11:15 a.m.: Keynote by Professor Severin Borenstein\n11:15 – 12:00 p.m.: Alumni Panel Discussion\n12:00 – 1:00 p.m.: Lunch hosted by Morgan Lewis\n1:00 – 1:45 p.m.: PG&E presentation\n1:45 – 2:00 p.m.: Closing remarks and networking\nBldg: Morgan Lewis & Brockius\, 1400 Page Mill Rd\, Palo Alto\, California\, United States\, 94304
URL:https://svec.org/event/watts-at-stake-silicon-valleys-energy-crossroads/
LOCATION:Bldg: Morgan Lewis & Brockius\, 1400 Page Mill Rd\, Palo Alto\, California\, United States\, 94304
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BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20260616T103000
DTEND;TZID=America/Los_Angeles:20260616T141500
DTSTAMP:20260609T165049
CREATED:20260605T160459Z
LAST-MODIFIED:20260605T160459Z
UID:78478-1781605800-1781619300@svec.org
SUMMARY:Santa Clara Valley EMC Chapter: Testing and Compliance Seminar at the New CKC Laboratories!
DESCRIPTION:[]\nJoin us for a day of technical insights\, professional networking\, and a first look at the CKC Laboratories new facility in Fremont!\nEnjoy free technical seminars hosted by Randy Clark and Steve Behm\, along with a catered lunch compliments of\n[]\nStick around for your chance to win over $500 in prizes\, including a JBL speaker\, Igloo cooler\, SF Giants tickets\, and gift cards!\nThere is no charge to attend\, but you must register by Friday\, June 12!\nIEEE members and non-members are welcome!!\nSpeaker(s): Randy Clark\, Steve Behm\nAgenda:\n10:30 AM – 11:00 AM | Coffee & Check-In\n11:00 AM – 11:45 AM | Nerve Stimulation Seminar hosted by Randy Clark\, CKC Labs\n12:00 PM – 1:00 PM | Catered Lunch Courtesy of ETS-Lindgren & Facility Tour\n1:15 PM – 2:00 PM | Grounding & Shielding Seminar hosted by Steve Behm\, CKC Labs\n2:00 PM | Closing Comments and Raffle\nCKC Laboratories\, Inc.\, 46025 Warm Springs Blvd\, Fremont\, California\, United States\, 94539
URL:https://svec.org/event/santa-clara-valley-emc-chapter-testing-and-compliance-seminar-at-the-new-ckc-laboratories/
LOCATION:CKC Laboratories\, Inc.\, 46025 Warm Springs Blvd\, Fremont\, California\, United States\, 94539
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END:VCALENDAR