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BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20260425T093000
DTEND;TZID=America/Los_Angeles:20260425T110000
DTSTAMP:20260404T053333
CREATED:20260318T184811Z
LAST-MODIFIED:20260318T184811Z
UID:77893-1777109400-1777114800@svec.org
SUMMARY:SCV-EPS AdCom Meeting (APRIL 2026)
DESCRIPTION:Monthly AdCom meeting:\n1. Welcome – Hualiang\n2. Symposium status update – Annette/Paul/Hualiang\n3. Education outreach status – Masha/Azmat/Hualiang\n4. Chapter Storage – Hualiang XXXX NOT\n5. Monthly talk preparation – Chandan/Luu\n6. Chapter website update – XXXX NOT Venkatesh/Claire/Paul\n7. Senior member advancement – Dwayne\nXxxx NOT\n8: Election 2026\n9: Open discussion – All\nAgenda:\nMonthly AdCom meeting:\n1. Welcome – Hualiang\n2. Symposium status update – Annette/Paul/Hualiang\n3. Education outreach status – Masha/Azmat/Hualiang\n4. Chapter Storage – Hualiang XXXX NOT\n5. Monthly talk preparation – Chandan/Luu\n6. Chapter website update – XXXX NOT Venkatesh/Claire/Paul\n7. Senior member advancement – Dwayne\nXxxx NOT\n8: Election 2026\n9: Open discussion – All\nVirtual: https://events.vtools.ieee.org/m/549396
URL:https://svec.org/event/scv-eps-adcom-meeting-april-2026/
LOCATION:Virtual: https://events.vtools.ieee.org/m/549396
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20260507T120000
DTEND;TZID=America/Los_Angeles:20260507T130000
DTSTAMP:20260404T053333
CREATED:20260311T183306Z
LAST-MODIFIED:20260311T183306Z
UID:77858-1778155200-1778158800@svec.org
SUMMARY:Power Distribution in Heterogeneous Integrated Packaging for Data Center Computing
DESCRIPTION:[]Join us for an insightful webinar with Francesco Carobolante\, founder of IoTissimo® LLC and an EPS Distinguished Lecturer\, as he explores the critical challenges and innovative solutions that advanced packaging can provide to address the "Power Wall". With over 30 years of industry experience and a tenure at Intel’s Corporate Strategy Office\, Francesco will delve into the Heterogeneous Integration Roadmap (HIR) perspective on scaling high-power AI processors. This session will analyze how signal BW and energy requirements dictate the options available for architecting the package structure\, including Vertical Power Delivery\, integrated voltage regulators and advanced thermal management techniques. Discover how these architectural shifts are enabling the next generation of data center performance.\nSpeaker(s): Francesco Carobolante\,\nVirtual: https://events.vtools.ieee.org/m/546237
URL:https://svec.org/event/power-distribution-in-heterogeneous-integrated-packaging-for-data-center-computing/
LOCATION:Virtual: https://events.vtools.ieee.org/m/546237
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20260512T120000
DTEND;TZID=America/Los_Angeles:20260512T130000
DTSTAMP:20260404T053333
CREATED:20260120T174820Z
LAST-MODIFIED:20260120T174820Z
UID:77639-1778587200-1778590800@svec.org
SUMMARY:From Process to Performance: Challenges in uOLED and uLED Electronics Manufacturing
DESCRIPTION:As uOLED and uLED technologies transition from research to high-volume manufacturing\, system performance is increasingly constrained by process variability rather than design intent. Electrical\, thermal\, and mechanical decisions made during manufacturing directly translate into optical non-uniformity\, efficiency loss\, and reliability challenges. Understanding these process-to-performance linkages is critical for building scalable\, high-performance emissive display systems.\nVirtual: https://events.vtools.ieee.org/m/533601
URL:https://svec.org/event/from-process-to-performance-challenges-in-uoled-and-uled-electronics-manufacturing-2/
LOCATION:Virtual: https://events.vtools.ieee.org/m/533601
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20260512T170000
DTEND;TZID=America/Los_Angeles:20260512T193000
DTSTAMP:20260404T053333
CREATED:20260402T110335Z
LAST-MODIFIED:20260402T110335Z
UID:78240-1778605200-1778614200@svec.org
SUMMARY:The Intelligence of the Machine.. The Rigor of the Road!!
DESCRIPTION:IEEE Event Agenda – Tuesday May 12\, 2026\n🔹 5:00 PM – 5:30 PM\nRegistration\, Refreshments\, Food & Networking (Meet & Greet)\nFeatured Speakers & Sessions\n🔹 5:30 PM – 6:15 PM\nTopic 1: Industry Talk – Standardizing Automotive Firmware for SDVs\nExperts from Mercedes-Benz\, Arm\, and Athos Silicon will discuss the urgent need for a standardized\, secure\, and vendor-agnostic firmware foundation.\nKey focus areas:\n– Overcoming fragmented firmware ecosystems\n– UEFI as a scalable automotive standard\n– Enabling functional safety\, cybersecurity\, and interoperability\n– Supporting chiplet-based and next-gen ADAS architectures\nSpeakers:\n– François Piednoël – (https://www.linkedin.com/in/francoispiednoel/)\n– Sachin Athanikar – (https://www.linkedin.com/in/sachin-athanikar-18ba5914/)\n– Dong Wei (https://www.linkedin.com/in/dongweimba/)\n🔹 6:15 PM – 6:45 PM\nTopic 2: Academic Keynote – Safe Embodied AI: From Theory to Deployment\nProf. Ding Zhao (Carnegie Mellon University)\nTopics include:\n– Rare-event safety in autonomous systems\n– Safe reinforcement and imitation learning\n– Generalizable and adaptive AI safety\n– Future of trustworthy embodied AI at scale\nSpeaker:\n– Ding Zhao – (https://www.linkedin.com/in/ding-zhao-01130730/)\n🔹 6:45 PM – 7:15 PM\nTopic 3: Industry Talk – Static Safety Is Dead: Continuous Risk & Compliance for SDVs\nAkshay Chalana (CEO & Co-founder\, Saphira AI)\nModern vehicles evolve continuously through software updates\, AI-driven functionality\, and increasing connectivity—yet safety and cybersecurity practices remain largely static.\nThis talk explores:\n– What breaks when traditional safety assumptions no longer hold\n– Real-world ADAS/autonomy failure propagation: dataset bias\, requirement drift\, and system boundary ambiguity\n– Cross-domain challenges between safety and cybersecurity\n– A new model for continuous\, system-aware risk assessment and compliance\n– Treating compliance artifacts as live infrastructure integrated into development pipelines\nThis session provides a practical path to maintaining certification-grade rigor while operating at software velocity.\nSpeaker:\n– Akshay Chalana – (https://www.linkedin.com/in/akshaychalana/)\n🔹 7:15 PM – 7:30 PM\nQ&A and open discussion – Aditi Ramadwar\nAbout This Technical Forum\nThis technical forum brings together OEMs\, Tier-1 suppliers\, semiconductor leaders\, researchers\, and innovators to address the challenge of fragmentation and define a unified\, future-ready mobility stack.\nWho Should Attend:\n– Automotive engineers and architects\n– Safety and cybersecurity specialists\n– Semiconductor and embedded systems professionals\n– Researchers in autonomous vehicles and AI safety\n– Technical decision-makers from OEMs and suppliers\n– Students in Automotive\, Compute\, Mechanical & Electrical Engineering\nWe would be delighted if you could join us and participate in shaping the future of intelligent transportation.\nSpeaker(s): Francois\, Wei \, Sachin\, Zhao\, Akshay\nSEMI\, 673 S Milpitas Blvd\, Milpitas\, California\, United States\, 95035
URL:https://svec.org/event/the-intelligence-of-the-machine-the-rigor-of-the-road/
LOCATION:SEMI\, 673 S Milpitas Blvd\, Milpitas\, California\, United States\, 95035
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BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20260517T170000
DTEND;TZID=America/Los_Angeles:20260518T180000
DTSTAMP:20260404T053333
CREATED:20260206T094815Z
LAST-MODIFIED:20260206T094815Z
UID:77706-1779037200-1779127200@svec.org
SUMMARY:Spring Speaker Series 3
DESCRIPTION:Continuation of Speaker Series at Stanford IEEE.\nStanford\, California\, United States\, 94305
URL:https://svec.org/event/spring-speaker-series-3/
LOCATION:Stanford\, California\, United States\, 94305
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20260519T080000
DTEND;TZID=America/Los_Angeles:20260520T170000
DTSTAMP:20260404T053333
CREATED:20260206T094815Z
LAST-MODIFIED:20260206T094815Z
UID:77708-1779177600-1779296400@svec.org
SUMMARY:Third Annual IEEE Build-Up Substrate Symposium
DESCRIPTION:[]\n(More information will be added in early March. General Registration should open around March 1st. Sponsors may register at the link below.)\nWe are living in the era of heterogeneous integration driven by fast\, efficient and big data computing resources at our fingertips. The mega-monolithic silicon chip is a thing of the past\, replaced with 3D heterogeneous integration of chiplets onto a platform made of an organic build-up substrate. Volume manufacturers of build-up substrates are entirely based in Asia\, leaving a desert in the US. Volume build-up substrates used by major IDMs are manufactured in Asian countries including Taiwan\, Japan and China.\nHowever\, there are multiple activities starting up in the US\, and this is why a gathering of the US players is important. This symposium is geared for all those involved in the supply chain of build-up substrates in the US\, as well as users. This Symposium is an opportunity for all build-up substrate players to meet\, network and cohesively work with funding agencies who will be invited to this symposium to focus on onshoring build-up substrate production and utilization.\nSamsung\, San Jose\, California\, United States
URL:https://svec.org/event/third-annual-ieee-build-up-substrate-symposium/
LOCATION:Samsung\, San Jose\, CA\, United States
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20260519T090000
DTEND;TZID=America/Los_Angeles:20260520T170000
DTSTAMP:20260404T053333
CREATED:20260304T174831Z
LAST-MODIFIED:20260304T174831Z
UID:77832-1779181200-1779296400@svec.org
SUMMARY:IEEE Build-Up Substrate Symposium (BUSS)
DESCRIPTION:We are living in the era of heterogeneous integration driven by fast\, efficient and big data computing resources at our fingertips. The mega-monolithic silicon chip is a thing of the past\, replaced with 3D heterogeneous integration of chiplets onto a platform made of an organic build-up substrate. Volume manufacturers of build-up substrates are entirely based in Asia\, leaving a desert in the US. Volume build-up substrates used by major IDMs are manufactured in Asian countries including Taiwan\, Japan and China.\nHowever\, there are multiple activities starting up in the US\, and this is why a gathering of the US players is important. This symposium is geared for all those involved in the supply chain of build-up substrates in the US\, as well as users. As the US Congress debates H.R. 3249\, the Protecting Circuit Boards and Substrates (PCBS) Act\, this Symposium is an opportunity for all build-up substrate players to meet\, network and cohesively work with funding agencies who will be invited to this symposium to focus on onshoring build-up substrate production and utilization.\nlocation to be announced\, Milpitas\, California\, United States\, Virtual: https://events.vtools.ieee.org/m/544352
URL:https://svec.org/event/ieee-build-up-substrate-symposium-buss-2/
LOCATION:location to be announced\, Milpitas\, California\, United States\, Virtual: https://events.vtools.ieee.org/m/544352
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/New_York:20260525T210000
DTEND;TZID=America/New_York:20260526T170000
DTSTAMP:20260404T053333
CREATED:20260226T173312Z
LAST-MODIFIED:20260226T173312Z
UID:77809-1779742800-1779814800@svec.org
SUMMARY:IEEE Canada Blockchain Forum 2026 (4th edition)
DESCRIPTION:The IEEE Blockchain Forum is returning for the fourth time as part of (https://www.torontotechweek.com/). The goal of this compact one-day event is to congregate BUIDLers\, researchers\, academics\, and engineers building blockchain protocols\, infrastructure\, and decentralized software applications.\nNote: (https://events.vtools.ieee.org/m/469545) counted with 200 participants and speakers from JP Morgan\, the Bank of Canada\, Mastercard\, the Ethereum Enterprise Alliance\, EY\, Starknet\, among others.\n[]\nCo-sponsored by: Government of Ontario\nAgenda:\nAgenda TBC\nOntario Investment and Trade Centre\, 250 Yonge Street\, 35th Floor\, Toronto\, Ontario\, Canada\, M5B 2L7
URL:https://svec.org/event/ieee-canada-blockchain-forum-2026-4th-edition/
LOCATION:Ontario Investment and Trade Centre\, 250 Yonge Street\, 35th Floor\, Toronto\, Ontario\, Canada\, M5B 2L7
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BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20260624T080000
DTEND;TZID=America/Los_Angeles:20260625T170000
DTSTAMP:20260404T053333
CREATED:20260319T184817Z
LAST-MODIFIED:20260319T184817Z
UID:77896-1782288000-1782406800@svec.org
SUMMARY:Center for Advanced Signal and Image Sciences (CASIS) 29th Annual Workshop
DESCRIPTION:We are thrilled to host LLNL’s 30th Center for Advanced Signal and Image Sciences (CASIS) workshop. The workshop returns with a full 2-day in-person schedule on Wednesday and Thursday\, June 24-25\, 2026.\nWe encourage a broad range of technical topics at the workshop and being non-archival apart from original work\, we are also considering intermediate results from ongoing efforts as well as recently published publications for presentation as a talk and/or a poster. The goal of the workshop is to provide a platform for the exchange of ideas and network with peers across disciplines to foster collaboration and build community. Please submit your abstract by Friday\, May 15\, 2026. Authors will be notified of the review decisions one week later on May 22\, 2026.\nApart from the regular presentation track we will feature parallel tutorials\, hands-on mini workshops and a dedicated student track to introduce career opportunities at LLNL.\nThe workshop will be held in-person at the (https://uclcc.org/) and requires pre-registration until June 18\, 2026. As this is a 2-day whole-day workshop\, we will provide coffee and snacks in morning and afternoon breaks as well as a lunch on both days. As this is our 30th anniversary\, we will also host a Happy Hour following the regular program on Wednesday\, June 24\, 2026.\n(https://engineering.llnl.gov/centers/casis/workshops)\nThis year’s workshop features presentations in the following tracks\, moderated by the Program Chairs:\n– AI/Machine Learning (PhanNguyen\, Kowshik Thopalli)\n– National Ignition Facility (Eugene Kur\, Christopher Miller)\n– Non-Destructive Evaluation (Seemeen Karimi\, Harry Martz)\n– Quantum Sensing & Quantum Computing (Kristi Beck)\n– Remote Sensing\, Non-Invasive Imaging & Inverse Problems (Sean Lehman\, Viacheslav Li)\n– Robotics & Automation (Aldair Gongora\, Abhik Sarkar)\n– Student Track: All topics (Poster only) (Ted Bauman\, Min Priest)\nBecome part of this great experience and submit your talk proposal at https://engineering.llnl.gov/centers/casis/workshops before May 15\, 2025!\nCheck out (https://www.llnl.gov/article/53041/annual-workshop-brings-together-signal-image-science-community) for last year’s amazing event to see what to expect!\nThe no-fee CASIS Workshop is sponsored by the (https://engineering.llnl.gov/) and held at the (https://uclcc.org/). It is organized by the (https://engineering.llnl.gov/centers/casis)\, and is a joint meeting with the local chapters of the (https://www.ewh.ieee.org/r6/oeb/SigProc/sigproc.html) and (https://r6.ieee.org/sfoeb-cs/). supported by the (https://r6.ieee.org/oeb/).\nCo-sponsored by: Lawrence Livermore National Laboratory – Center for Advanced Signal and Image Sciences\nBldg: Building 661 L-794\, University of California Livermore Collaboration Center\, 7000 East Ave\, Livermore\, California\, United States\, 94550
URL:https://svec.org/event/center-for-advanced-signal-and-image-sciences-casis-29th-annual-workshop-2/
LOCATION:Bldg: Building 661 L-794\, University of California Livermore Collaboration Center\, 7000 East Ave\, Livermore\, California\, United States\, 94550
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