Heterogeneous Integration Innovations Enabled by Glass-Core Packaging and 3D Technologies
Virtual: https://events.vtools.ieee.org/m/400217In recent years, the field of advanced packaging has taken center stage as the semiconductor […]
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In recent years, the field of advanced packaging has taken center stage as the semiconductor […]
5:30pm: food and drink 6:15pm: presentation In recent years, there has been a surge in […]
P*anel discussion “Taking Generative AI Enterprise Models to Production”* AI User Conference 2024 - Developer […]
Abstract: Access to nanoscale piezoelectric transducers in advanced semiconductor processes enables realization of acoustic resonators […]
This talk will cover major developments within additive manufacturing as applied towards electronics packaging needs […]
Wireless communication is fundamental to our digital society, with radio spectrum the key enabling resource. […]
This is the annual IEEE SFBA Consumer Technology Society (CTSoc) event providing a summary of […]
It's time for another fabulous Bots & Beer (or beverages :) - Open mic for […]
Join us for robotics networking - thanks to food and beverages sponsor Jiga.io and host […]
The core objective of this presentation is to acquaint technology leaders with an effective framework […]
Celebrate Engineers Week 2024 with ASCE SJ YMF by supporting our efforts in providing STEM […]
Monthly Program: Tuesday, February 13 More Event Details DirectionsLocation PARC's George E. Pake Auditorium 3333 Coyote […]