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DTSTART;TZID=America/Los_Angeles:20260109T180000
DTEND;TZID=America/Los_Angeles:20260109T190000
DTSTAMP:20260404T093134
CREATED:20251222T160319Z
LAST-MODIFIED:20251222T160319Z
UID:77533-1767981600-1767985200@svec.org
SUMMARY:2026 VTS Tech Talk: Driving Confidence at Scale: The Strategic Role of Simulation in Autonomous Systems
DESCRIPTION:As vehicles become increasingly software-defined\, advanced driver-assistance and autonomous systems must perform reliably across diverse environments and interact safely with a dynamic real world. Traditional validation methods\, such as road testing and closed-course evaluations are often too slow\, costly\, and limited in coverage to keep pace with modern development demands. To validate today’s highly complex\, machine learning–driven software architectures\, simulation has evolved from a testing tool into a core development platform.\nIn this talk\, the invited speaker Mr. Shuhan Yang will explore how simulation can be architected and applied to accelerate the design\, validation\, and deployment of advanced driver-assistance and autonomous technologies. Drawing from experience across multiple AV platforms\, he’ll walk through key types of simulation—from perception sensor modeling to behavioral and decision-making validation—and offer practical guidance on integrating simulation into the product development lifecycle. He will also highlight current limitations and challenges that engineers should be aware of.\nFinally\, the talk will cover how simulation boosts confidence across development stages\, improves system performance\, and reduces both time and cost to deployment. As global competition in software-defined mobility intensifies\, these capabilities underscore the growing importance of scalable and rigorous validation frameworks. Attendees will leave with a practical approach for selecting and applying simulation methods that align with their technical and organizational needs.\nSpeaker(s): Shuhan Yang\nAgenda:\n6:00-6:45pm Tech Talk\n6:45-7:00pm Q&A\nVirtual: https://events.vtools.ieee.org/m/524500
URL:https://svec.org/event/2026-vts-tech-talk-driving-confidence-at-scale-the-strategic-role-of-simulation-in-autonomous-systems/
LOCATION:Virtual: https://events.vtools.ieee.org/m/524500
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20260109T180000
DTEND;TZID=America/Los_Angeles:20260109T190000
DTSTAMP:20260404T093134
CREATED:20251222T160319Z
LAST-MODIFIED:20251222T160319Z
UID:77534-1767981600-1767985200@svec.org
SUMMARY:2026 VTS Tech Talk: Driving Confidence at Scale: The Strategic Role of Simulation in Autonomous Systems
DESCRIPTION:As vehicles become increasingly software-defined\, advanced driver-assistance and autonomous systems must perform reliably across diverse environments and interact safely with a dynamic real world. Traditional validation methods\, such as road testing and closed-course evaluations are often too slow\, costly\, and limited in coverage to keep pace with modern development demands. To validate today’s highly complex\, machine learning–driven software architectures\, simulation has evolved from a testing tool into a core development platform.\nIn this talk\, the invited speaker Mr. Shuhan Yang will explore how simulation can be architected and applied to accelerate the design\, validation\, and deployment of advanced driver-assistance and autonomous technologies. Drawing from experience across multiple AV platforms\, he’ll walk through key types of simulation—from perception sensor modeling to behavioral and decision-making validation—and offer practical guidance on integrating simulation into the product development lifecycle. He will also highlight current limitations and challenges that engineers should be aware of.\nFinally\, the talk will cover how simulation boosts confidence across development stages\, improves system performance\, and reduces both time and cost to deployment. As global competition in software-defined mobility intensifies\, these capabilities underscore the growing importance of scalable and rigorous validation frameworks. Attendees will leave with a practical approach for selecting and applying simulation methods that align with their technical and organizational needs.\nSpeaker(s): Shuhan Yang\nAgenda:\n6:00-6:45pm Tech Talk\n6:45-7:00pm Q&A\nVirtual: https://events.vtools.ieee.org/m/524500
URL:https://svec.org/event/2026-vts-tech-talk-driving-confidence-at-scale-the-strategic-role-of-simulation-in-autonomous-systems-2/
LOCATION:Virtual: https://events.vtools.ieee.org/m/524500
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20260108T190000
DTEND;TZID=America/Los_Angeles:20260108T203000
DTSTAMP:20260404T093134
CREATED:20251214T154816Z
LAST-MODIFIED:20251214T154816Z
UID:77491-1767898800-1767904200@svec.org
SUMMARY:2026 Impact of AI on Consumer Technology Products
DESCRIPTION:We are live hosting an IEEE CTSoc (Consumer Technology Society) event at the Advanced Engineering Building at the University of Nevada\, Las Vegas. Please register to attend the event on-line.\nAbstract: This event is an interactive panel examining the impact and challenges of AI on consumer technology products\, especially smart health devices and their ecosystems. The panel will feature corporate executives\, as follows:\n– (https://www.linkedin.com/in/praveenraja9/)\, VP Digital Health\, Samsung\n– (https://www.linkedin.com/in/migueladao/)\, CEO of Volersystems\n– (https://www.linkedin.com/in/adam-drobot-43a1412a/)\, Chairman of the Board\, OpenTechWorks\, Inc.\n– (https://www.linkedin.com/in/paolo-bonato-582890/)\, Director\, Motion Analysis Lab\, Spaulding Rehabilitation\n– (https://www.linkedin.com/in/michael-condry-79931a/)\, Former CTO\, Intel Corporation (retired)\n– (https://www.linkedin.com/in/stuart-lipoff-173288/) (Moderator)\, President\, IP Action Partners\nVirtual: https://events.vtools.ieee.org/m/522339
URL:https://svec.org/event/2026-impact-of-ai-on-consumer-technology-products/
LOCATION:Virtual: https://events.vtools.ieee.org/m/522339
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20251230T090000
DTEND;TZID=America/Los_Angeles:20251230T150000
DTSTAMP:20260404T093134
CREATED:20251220T160304Z
LAST-MODIFIED:20251220T160304Z
UID:77521-1767085200-1767106800@svec.org
SUMMARY:Winter Holiday Youth STEM Workshop
DESCRIPTION:Come join our STEM Winter Holiday Youth where you'll get hands-on experience with cool science\, tech\, engineering\, and math activities!\nDear Parents and Guardians\,\nLooking for something meaningful and and stimulating for your children to do in between the holidays? We invite you and your family to join us for an inspiring Cloudy With a Chance of Meatballs –Glad Tidings/IEEE Youth Winter STEM Workshop\, STEM (Science\, Technology\, Engineering\, and Math) educational experience designed specifically for students from underrepresented communities. This in-person event will be held at 27709 Tyrrell Ave\, where you can meet other curious minds and learn from experienced instructors. Don't miss out on this opportunity to explore the wonders of STEM in a supportive and engaging environment. Register now to secure your spot!\nScholarships available\, please email: benita.mclarin@gladtidingscogic.org\nEvent Details\nWhere: Glad Tidings Family Life Complex\nWhen: 12/30\, 9am to 3:00pm.\nWho: Students aged 8–17 (parents encouraged to attend)\nWhy STEM Education Matters for Your Child\nSTEM education is more than just learning about technology or engineering—it’s about developing critical thinking\, creativity\, and problem-solving skills that are essential in today’s world. By exposing your child to STEM:\n– Help them discover new interests and talents.\n– Prepare them for high-paying and rewarding careers.\n– Show them that they can be creators\, innovators\, and leaders.\nSchedule:\n8:15 – 9:00 AM | Breakfast Available· Light Breakfast including cereals\, fruit and juice for children· Coffee and pastries for volunteers· Meals Catered by Divine Purpose Catering\n9:00 – 9:20 AM | Welcome & Kickoff\n– Welcome\n– Overview of the workshop theme: “Cloudy With a Chance of Meatballs”\n– Review of safety rules\n– Introduction of volunteers\, experiment leads\, and technology demonstrators\n– Brief explanation of how technology connects to cooking (Instant Pot sensors\, microwaves & magnetrons)\n9:20 – 9:45 AM | Opening Technology Demonstration (Large Group)Tech Demo #1: How Microwaves Cook Food\nLed by IEEE-USA President Tim Lee\nSample Questions for Consideration:\n– What is a magnetron?\n– How microwaves heat water molecules\n– Demonstration: Heating different foods & observing heat distribution\n– Safety discussion: microwave-safe containers\n9:45 – 10:10 AM | Technology Demonstration #2 (Large Group)Tech Demo #2: The Science & Engineering Behind an Instant Pot\nLed by engineering guest (or enriched by Nirupama’s consulted mechanical engineer)\n– Pressure\, temperature regulation\, sensors\n– How smart cooking devices automate heat control\n– Demonstration using safe\, simple food item\n– Discussion: Technology innovations in home cooking\n10:10 – 10:20 AM | Transition & Break\n10:20 AM – 12:00 PM | Hands-On Experiment Rotations\nParticipants rotate through 3 stations (25 minutes each) Stations may include:\nExperiment Station\n– Make Your Own Cheese – Simple paneer or ricotta – Concepts: curdling\, heat\, protein structure\n– Pizza Dough Science – Yeast growth & temperature effects – Kneading and gluten formation\n– Microwave Mini-Experiments – Safe items – Observing heating patterns\n12:00 – 12:40 PM | Lunch & Informal STEM Challenge\n– Pizza or sandwiches and salads\n– STEM trivia led by teen volunteers\n– “Guess the Technology” game with simple household cooking tools\n12:40 – 1:00 PM | Group Activity: The Science of Meatballs\nA fun\, theme-based demonstration:\n– Why meatballs hold together (protein chemistry + binders)\n– Heat transfer demo using safe props\n– Link back to the workshop’s title\n1:00 – 2:45 PM | Hands-On Experiment Rotations (continued)Participants rotate through 4 stations (25 minutes each) Stations may include:\n– Candy Chemistry (Holiday-Themed) – Sugar crystallization\, supersaturation – Candy cane or lollipop demo\n– Cookie Engineering – How ingredient ratios change texture – Technology comparison: electric oven vs. Easy Bake\n– Hot Chocolate Lab – Emulsions\, heat transfer – Taste-testing temperature differences\n– Grow Sugar or Salt Crystals – Kids take home the starter jars\n2:45 – 3:00 PM | Closing\, Photos & Thank You\nOur Program’s Commitment\nThrough our partnership with the IEEE Oakland-East Bay Section\, TryEngineering\, and Glad Tidings\, we are dedicated to fostering a supportive and inclusive environment. Here’s why this program is unique:\nMentors Who Care: STEM professionals from your community will guide your child every step of the way.\n– Hands-On Learning: Engaging activities like designing bridges\, building robots\, and creating LED circuits make learning exciting.\nEquity in Education: Our goal is to provide access and opportunity to all children\, particularly those in underrepresented communities.\nParent Involvement\nWe understand the vital role parents play in their child’s success. During the event\, you’ll:\n– See firsthand how STEM activities boost confidence and teamwork.\n– Learn about free and affordable resources to continue your child’s STEM journey.\n– Meet other parents who share the same goal of empowering their children.\nDon’t Miss Out!\nThis is a chance to show your child that their dreams matter and that they belong in STEM fields. Secure your spot today!\nRegister by Dec. 26th\nTo ensure we have the proper supplies and resources\, please RSVP by end of day Dec. 26\, so we can better plan the workshop.\nTogether\, let’s inspire a generation of problem solvers\, innovators\, and dreamers. We look forward to seeing you there!\nWarm regards\,\nAaron Lin\, IEEE\nBenita McLarin\, Glad Tidings\nCo-sponsored by: Glad Tiding International\n27709 Tyrrell Ave\, Hayward\, California\, United States\, 94544
URL:https://svec.org/event/winter-holiday-youth-stem-workshop/
LOCATION:27709 Tyrrell Ave\, Hayward\, California\, United States\, 94544
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20251229T180000
DTEND;TZID=America/Los_Angeles:20251229T193000
DTSTAMP:20260404T093134
CREATED:20251210T151814Z
LAST-MODIFIED:20251210T151814Z
UID:77478-1767031200-1767036600@svec.org
SUMMARY:Digital Money and Payments 2025: Stablecoins\, CBDCs\, Tokenized Deposits After the GENIUS Act\, and IEEE Blockchain Volunteering
DESCRIPTION:[]In 2025\, the landscape of digital money is shifting rapidly as the GENIUS Act establishes a federal framework for payment stablecoins while U.S. CBDC efforts pause and other regions move ahead with their own digital currency projects. This event will provide a clear overview of how stablecoins\, CBDCs\, tokenized deposits\, and new payment rails are evolving in the U.S. and globally\, and what that means for technology and finance professionals. It will conclude with a session on how volunteering within the IEEE Blockchain Technical Community creates opportunities to build leadership\, grow networks across industry and academia\, and contribute to impactful work in the blockchain ecosystem.\nSpeaker(s): Marc Lijour\, Revanth Airre\,\nVirtual: https://events.vtools.ieee.org/m/521039
URL:https://svec.org/event/digital-money-and-payments-2025-stablecoins-cbdcs-tokenized-deposits-after-the-genius-act-and-ieee-blockchain-volunteering/
LOCATION:Virtual: https://events.vtools.ieee.org/m/521039
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20251222T115000
DTEND;TZID=America/Los_Angeles:20251222T130000
DTSTAMP:20260404T093134
CREATED:20251216T160312Z
LAST-MODIFIED:20251216T160312Z
UID:77502-1766404200-1766408400@svec.org
SUMMARY:Robust Multimodal Cough Detection with Optimized Out-of-Distribution Detection for Wearables
DESCRIPTION:Longitudinal and continuous monitoring of cough is crucial for early and accurate diagnosis of respiratory diseases. Recent developments in wearables provides at-home remote symptom monitoring with respect to more accurate and less frequent assessment in the clinics\, but face practical challenges such as speech privacy\, poor audio quality and background noise in uncontrolled real-world settings. Our work addresses these challenges by developing and optimizing a multimodal cough detection system\, enhanced with an Out-of-Distribution (OOD) detection algorithm. The cough sensing modalities include audio and Inertial Measurement Unit (IMU) signals. The system is optimized through training with an enhanced dataset and a weighted multi-loss approach for in-distribution classification\, while OOD detection is improved by reconstructing training data components. Experiments demonstrate robustness across window sizes from 1–5 seconds and effectiveness at low audio sampling rates\, where privacy is preserved. The optimized system achieves 90.1% accuracy at 16 kHz and 87.3% at 750 Hz\, even with half the inference data being OOD. Most misclassifications arise from nonverbal sounds (e.g.\, sneezes\, groans). Overall\, the proposed Audio-IMU multimodal model with OOD detection significantly improves cough detection performance and offers a practical solution for real-world wearable applications. Wearable devices with on-board neural acceleration capabilities have been developed to enable fusion of air and bone microphones\, and inertial measurements together with real-time processing.\nSpeaker(s): Prof. Dr. Edgar J Lobaton\nAgenda:\n11:50 am to 12:00 pm: Social\n12:00 pm to 12:45 pm: Talk\n12:45 pm to 1:00 pm: Q/A\nVirtual: https://events.vtools.ieee.org/m/523030
URL:https://svec.org/event/robust-multimodal-cough-detection-with-optimized-out-of-distribution-detection-for-wearables/
LOCATION:Virtual: https://events.vtools.ieee.org/m/523030
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/New_York:20251220T100000
DTEND;TZID=America/New_York:20251220T110000
DTSTAMP:20260404T093134
CREATED:20251215T154812Z
LAST-MODIFIED:20251215T154812Z
UID:77497-1766224800-1766228400@svec.org
SUMMARY:What Needs to Be in Place Before AI: Lessons from Large-Scale Insurance Platforms
DESCRIPTION:Artificial intelligence can only create real value when the underlying data\, architecture\, and governance are ready for it. In this talk\, as a system architect I will share practical lessons from experience of designing and leading large-scale insurance platforms at three startup insurance companies\, including quoting engines\, carrier integrations\, and cloud-native lead acquisition systems. Drawing on two decades of experience in insurance technology\, I will outline four key prerequisites for successful AI adoption in regulated industries: solid data foundations\, modular and API-driven architectures\, strong security and compliance practices\, and cross-functional teams and processes. The session is aimed at students\, engineers\, AI practitioners\, and business leaders who want a clear\, real-world view of how to prepare complex systems for AI at scale.\nSpeaker(s): Malar Kondappan\nVirtual: https://events.vtools.ieee.org/m/522134
URL:https://svec.org/event/what-needs-to-be-in-place-before-ai-lessons-from-large-scale-insurance-platforms/
LOCATION:Virtual: https://events.vtools.ieee.org/m/522134
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20251218T180000
DTEND;TZID=America/Los_Angeles:20251218T193000
DTSTAMP:20260404T093134
CREATED:20251207T151441Z
LAST-MODIFIED:20251207T151441Z
UID:77470-1766080800-1766086200@svec.org
SUMMARY:AI in Blockchain: Architecting Intelligent Systems and Building AI Careers in the Web3 Ecosystem
DESCRIPTION:[]Join us for this virtual meeting!\nThis event brings together two focused talks that connect the architecture of AI in Blockchain/Web3 with practical career guidance for professionals entering this fast-growing space. The first talk explores how intelligent systems are designed\, evaluated\, and governed in blockchain and fintech environments. The second outlines the skills\, roles\, and pathways for building a successful AI career in the Blockchain ecosystem. Together\, they provide a clear view of where the industry is heading and how to prepare for it.\nSpeaker(s): Raj Karan Gunukula \, Revanth Reddy Airre\nVirtual: https://events.vtools.ieee.org/m/520440
URL:https://svec.org/event/ai-in-blockchain-architecting-intelligent-systems-and-building-ai-careers-in-the-web3-ecosystem/
LOCATION:Virtual: https://events.vtools.ieee.org/m/520440
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/New_York:20251218T120000
DTEND;TZID=America/New_York:20251218T130000
DTSTAMP:20260404T093135
CREATED:20251215T154812Z
LAST-MODIFIED:20251215T154812Z
UID:77495-1766059200-1766062800@svec.org
SUMMARY:Accelerate Development with Gemini - AI Agent at your Terminal
DESCRIPTION:This workshop moves beyond web-based interfaces to demonstrate how Gemini API\, accessed directly via the CLI can function as a powerful AI development agent\, right inside your terminal. It eliminates context-switching and helps you go friction-free.\nAttendees will engage in hands-on exercises to leverage Gemini for real-time\, terminal-based tasks.\nSpeaker(s): Ramesh Rajini\nVirtual: https://events.vtools.ieee.org/m/521828
URL:https://svec.org/event/accelerate-development-with-gemini-ai-agent-at-your-terminal/
LOCATION:Virtual: https://events.vtools.ieee.org/m/521828
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20251216T123000
DTEND;TZID=America/Los_Angeles:20251216T133000
DTSTAMP:20260404T093135
CREATED:20251211T151830Z
LAST-MODIFIED:20251211T151830Z
UID:77482-1765888200-1765891800@svec.org
SUMMARY:Inertia\, Stability\, and Nonlinear Dynamics in a Grid with Inverter-Based Resources
DESCRIPTION:The dynamic behavior of the electric grid is changing rapidly as inverter-based resources (IBRs) replace traditional synchronous generators in delivering critical system services. This rapid shift—driven by the growth of distributed generation and energy storage—requires a fundamental re-evaluation of how we define and assess grid stability. In particular\, the traditional concept of grid “inertia” must be reconsidered to ensure that stability metrics accurately reflect modern system behavior.\nIn this presentation\, I will discuss the nonlinear dynamic nature of the power grid\, the influence of increasing IBR penetration on stability\, and our recent work on transient stability assessment. I will highlight examples involving grid-forming inverter models and our efforts to incorporate improved stability metrics into simulation frameworks. By combining physical intuition with practical modeling\, this ongoing work aims to inform new approaches to stability assessment for the future power grid.\nSpeaker(s): John Zhang\nAgenda:\n12:30pm – Event Starts\n1:30pm – Adjourn\nTimes are in PST.\nVirtual: https://events.vtools.ieee.org/m/521292
URL:https://svec.org/event/inertia-stability-and-nonlinear-dynamics-in-a-grid-with-inverter-based-resources/
LOCATION:Virtual: https://events.vtools.ieee.org/m/521292
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20251216T120000
DTEND;TZID=America/Los_Angeles:20251216T124500
DTSTAMP:20260404T093135
CREATED:20251129T144824Z
LAST-MODIFIED:20251129T144824Z
UID:77442-1765886400-1765889100@svec.org
SUMMARY:Product Safety and Compliance Meetup
DESCRIPTION:The Product Safety Engineering Society Bay Area Joint Section Chapter (SCV/SF/OEB) invites you to a virtual meetup of professionals interested in product safety and compliance. We will discuss the future of the chapter and plan future events.\nAgenda:\n– Business Meeting\n– Plan future activity of the chapter\n– New Officer Elections\nVirtual: https://events.vtools.ieee.org/m/518446
URL:https://svec.org/event/product-safety-and-compliance-meetup-2/
LOCATION:Virtual: https://events.vtools.ieee.org/m/518446
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20251213T100000
DTEND;TZID=America/Los_Angeles:20251213T143000
DTSTAMP:20260404T093135
CREATED:20251206T150305Z
LAST-MODIFIED:20251206T150305Z
UID:77466-1765620000-1765636200@svec.org
SUMMARY:Computer History Museum
DESCRIPTION:Student Branch Event for members of the CSU East Bay Branch only.\nIf you want to carpool to the venue\, meet at Campus parking lot F at 9:00 am.\nOtherwise drive yourself to the CHM.\nFree only for student members at CSUEB.\nYou must register to attend.\nComputer History Museum\, 1401 N Shoreline Blvd.\,  Mountain View\, California\, United States\, 94043
URL:https://svec.org/event/computer-history-museum/
LOCATION:Computer History Museum\, 1401 N Shoreline Blvd.\,  Mountain View\, California\, United States\, 94043
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20251211T120000
DTEND;TZID=America/Los_Angeles:20251211T130000
DTSTAMP:20260404T093135
CREATED:20250924T110400Z
LAST-MODIFIED:20250924T110400Z
UID:77148-1765454400-1765458000@svec.org
SUMMARY:Digital Lithography: Addressing Scaling Challenges in Advanced Packaging
DESCRIPTION:[]\nRequirements on the high-performance compute (HPC) systems from AI workloads necessitates transition to larger package sizes with 2.5D to 3.5D integration and density scaling at every level in the stack. Several competing packaging architectures are emerging to solve the compute and power efficiency challenge presented by AI workloads. Each presents unique lithography challenges such as >100×100 field size\, large chip placement deviations\, fine lines and tight overlay warped substrates. The conventional lithography tools are incapable of meeting all the requirements to achieve scaling.\nThe talk will preview Applied Materials’ Digital Lithography Technology (DLT) which enables highest resolution at production throughputs while ensuring CD uniformity and overlay accuracy across the entire panel.\nSpeaker(s): Niranjan Khasgiwale\,\nVirtual: https://events.vtools.ieee.org/m/502777
URL:https://svec.org/event/digital-lithography-addressing-scaling-challenges-in-advanced-packaging/
LOCATION:Virtual: https://events.vtools.ieee.org/m/502777
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20251211T090000
DTEND;TZID=America/Los_Angeles:20251211T100000
DTSTAMP:20260404T093135
CREATED:20251002T114828Z
LAST-MODIFIED:20251002T114828Z
UID:77182-1765443600-1765447200@svec.org
SUMMARY:AI for Thermal Management of Electronic Systems: A Pathway to Digital Twins
DESCRIPTION:[]The rapid rise in power density and complexity of electronic systems has made thermal management a critical challenge for ensuring reliability\, performance\, and sustainability. Artificial Intelligence (AI) offers transformative opportunities to address this challenge by enabling data-driven modeling\, optimization\, and predictive control of cooling systems. By integrating AI with experimental and physics-based approaches\, adaptive models can be developed to capture transient thermal behaviors\, and optimize system-level energy efficiency. This forms the foundation for digital twins\, virtual replicas that continuously interact with their physical counterparts to provide system specific real-time monitoring\, and data driven decision support. In this talk\, I will present recent and ongoing research activities at ES2 Binghamton on AI-enabled thermal management design\, with emphasis on cooling solutions for high-power chips in data centers. I will further highlight how these developments serve as a pathway towards creating digital twins\, dynamic virtual replicas that integrate real-time data\, physics\, and AI to enable system-level monitoring\, prediction\, and optimization. Together\, these advancements pave the way for reliable\, energy-efficient\, and sustainable electronic systems.\nSpeaker(s): Srikanth Rangarajan\,\nVirtual: https://events.vtools.ieee.org/m/504510
URL:https://svec.org/event/ai-for-thermal-management-of-electronic-systems-a-pathway-to-digital-twins/
LOCATION:Virtual: https://events.vtools.ieee.org/m/504510
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20251209T190000
DTEND;TZID=America/Los_Angeles:20251209T210000
DTSTAMP:20260404T093135
CREATED:20251115T141953Z
LAST-MODIFIED:20251115T141953Z
UID:77395-1765306800-1765314000@svec.org
SUMMARY:Size Really Does Matter: Biological Nanoparticles Are Changing Biomedicine
DESCRIPTION:This is a hybrid in-person and online event. Pre-registration is required for either.\nThe holy grail of medical diagnostics is a test that is accurate\, sensitive\, non-invasive\, and inexpensive. For solid tumors such as pancreatic cancer and for many neurological diseases\, current diagnostics come too little\, too late.\nAn exciting direction of research in this field relates to exosomes\, tiny biological nanoparticles around 100 nm in size. There are trillions of them in our body\, carrying a massive amount of valuable information about the health—or disorder—of our organs. They are\, however\, so small that they had eluded detection until quite recently.\nIn this talk\, Dr. Giacomo Vacca will discuss the challenges\, and the promise\, of exosomes in biomedical diagnostics. He will show how their abundance is a fantastic opportunity to use them as biomarkers—if you can detect them. As the attention of both technologists and researchers has focused on them\, new tools have emerged\, enabling new scientific findings—and the tantalizing possibility of much more powerful biomedical diagnostics.\nSpeaker(s): Giacomo Vacca\n925 Thompson Place\, Sunnyvale\, California\, United States\, 94085\, Virtual: https://events.vtools.ieee.org/m/514921
URL:https://svec.org/event/size-really-does-matter-biological-nanoparticles-are-changing-biomedicine/
LOCATION:925 Thompson Place\, Sunnyvale\, California\, United States\, 94085\, Virtual: https://events.vtools.ieee.org/m/514921
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20251204T183000
DTEND;TZID=America/Los_Angeles:20251204T200000
DTSTAMP:20260404T093135
CREATED:20251109T141827Z
LAST-MODIFIED:20251109T141827Z
UID:77379-1764873000-1764878400@svec.org
SUMMARY:Navigating your Career: Lessons Learned and Success Strategies
DESCRIPTION:Careers don’t always follow a straight line — and that’s a good thing! In this talk\, I’ll share lessons learned from my own journey and from others who’ve navigated career twists\, pauses\, and pivots. You’ll hear practical strategies for building confidence\, staying current\, and navigating transitions at every career stage. We’ll look at how to recognize\, build\, and communicate your value\, how to adapt to emerging technologies and new work cultures\, and how to re-enter the workforce after time away. Whether you’re early in your career\, returning after a pause\, or seeking your next chapter\, you’ll leave with practical strategies and encouragement to move forward with clarity and confidence.\n[]\nParking info:\n(1) There are some 2-hour and some 4-hour parking spaces on Benton / Sherman and Franklin streets.\n(2) There are a number of 2-hour parking spaces next to Bank of America / Starbucks and they are usually not crowded on weeknights. You have to walk across El-Camino traffic light pedestrian crossing. If you get there at 6:20 PM you can park until 8:20PM.\n(3) Enter at the door of the Sobrato building colored in YELLOW.\nSpeaker(s): \, Jill Gostin\nRoom: 1308\, Bldg: SCDI\, Santa Clara University\, Santa Clara\, California\, United States\, Virtual: https://events.vtools.ieee.org/m/513222
URL:https://svec.org/event/navigating-your-career-lessons-learned-and-success-strategies/
LOCATION:Room: 1308\, Bldg: SCDI\, Santa Clara University\, Santa Clara\, California\, United States\, Virtual: https://events.vtools.ieee.org/m/513222
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20251204T120000
DTEND;TZID=America/Los_Angeles:20251204T130000
DTSTAMP:20260404T093135
CREATED:20250911T110415Z
LAST-MODIFIED:20250911T110415Z
UID:77078-1764849600-1764853200@svec.org
SUMMARY:Characterization and Application of a New Chip-Level Air Pump
DESCRIPTION:[]Trends in consumer goods are leaning towards thinner\, more compact products with higher performance than their predecessors. Today’s consumer wants lightweight\, portable\, battery-operated gear that is powerful enough to satisfy their needs for speed and ease of use. One of the biggest challenges facing product design is thermal management. Case temperature limits for products that come in contact with user’s skin place constraints on internal power dissipation and increase the need for improved thermal management. With the introduction of locally processed AI and higher compact portable device processing loads thermal issues are critical for avoiding throttling.\nµCooling: A new device has been invented that changes the way thermal engineers are approaching system cooling design. µCooling is a new concept in air movers. It is small\, and thin and is a complete departure from rotating mass fans. This MEMS-based invention can move air through very small spaces\, used directly on a chip or package\, placed remotely through tiny ducts\, or mounted outside of a product. In fact\, the versatility of µCooling changes the way we can manage heat at the package\, SoC\, or bare-chip level. This talk will introduce µCooling\, a MEMS-based\, all-silicon\, micro-sized air pump. The device will be described in terms of how it works\, performance characteristics\, and application examples.\nSpeaker(s): Tom Tarter\,\nVirtual: https://events.vtools.ieee.org/m/500418
URL:https://svec.org/event/characterization-and-application-of-a-new-chip-level-air-pump/
LOCATION:Virtual: https://events.vtools.ieee.org/m/500418
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20251202T180000
DTEND;TZID=America/Los_Angeles:20251202T190000
DTSTAMP:20260404T093135
CREATED:20251122T141809Z
LAST-MODIFIED:20251122T141809Z
UID:77413-1764698400-1764702000@svec.org
SUMMARY:High Performance Inferencing for LLMs
DESCRIPTION:Inferencing has become ubiquitous across cloud\, regional\, edge\, and device environments\, powering a wide spectrum of AI use cases spanning vision\, language\, and traditional machine learning applications. In recent years\, Large Language Models (LLMs)\, initially developed for natural language tasks\, have expanded to multimodal applications including vision speech\, reasoning and planning each demanding distinct service-level objectives (SLOs). Achieving high-performance inferencing for such diverse workloads requires both model-level and system-level optimizations.\nThis talk focuses on system-level optimization techniques that maximize token throughput \, achieve user experience metrics and inference service-provider efficiency. We review several recent innovations including KV caching\, Paged/Flash/Radix Attention\, Speculative Decoding\, P/D Disaggregation\, KV Routing and Parallelism\, and explain how these mechanisms enhance performance by reducing latency\, memory footprint\, and compute overhead. These techniques are implemented in leading open-source inference frameworks such as vLLM\, SGLang\, Hugging Face TGI\, and NVIDIA’s TensorRT-llm\, which form the backbone of large-scale public and private LLM serving platforms.\nAttendees will gain a practical understanding of the challenges in delivering scalable\, low-latency LLM inference\, and of the architectural and algorithmic innovations driving next-generation high-performance inference systems.\nVirtual: https://events.vtools.ieee.org/m/516797
URL:https://svec.org/event/high-performance-inferencing-for-llms-2/
LOCATION:Virtual: https://events.vtools.ieee.org/m/516797
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20251120T173000
DTEND;TZID=America/Los_Angeles:20251120T203000
DTSTAMP:20260404T093135
CREATED:20250923T110336Z
LAST-MODIFIED:20250923T110336Z
UID:77139-1763659800-1763670600@svec.org
SUMMARY:Modernizing Power System Design with IEC 61850: Breaking Free from Hardware Constraints
DESCRIPTION:The power industry is under pressure to rapidly expand infrastructure to meet growing demands from both consumers and producers. But sticking to traditional design and construction methods may no longer be enough. One of the biggest bottlenecks? Hardware dependencies—like waiting on control wiring or specific components—that delay commissioning and inflate project timelines.\nThis presentation explores how embracing IEC 61850\, a globally recognized standard for power system communication and configuration\, can unlock new efficiencies. By shifting more functionality into software and adopting a standardized\, vendor-neutral approach\, engineers can accelerate deployment\, improve system quality\, and simplify integration.\nWe will demystify the IEC 61850 data model and show how it builds intuitive\, scalable protection and control systems. You will learn how it reduces vendor lock-in\, streamlines troubleshooting\, and supports a more agile design process. Real-world case studies will highlight successful implementations\, and we will share a practical roadmap to help you begin your journey toward a fully digitized power system.\nSpeaker(s): Darren De Ronde\,\nAgenda:\nNo-host social at 5:30pm\nPresentation at 6:00pm\nDinner at 7:00pm\nPresentation continues at 7:45pm\nAdjourn by 8:30pm\nZio Fraedo’s\, 611 Gregory Lane\, Pleasant Hill\, California\, United States\, 94523
URL:https://svec.org/event/modernizing-power-system-design-with-iec-61850-breaking-free-from-hardware-constraints/
LOCATION:Zio Fraedo’s\, 611 Gregory Lane\, Pleasant Hill\, California\, United States\, 94523
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20251120T073000
DTEND;TZID=America/Los_Angeles:20251121T170000
DTSTAMP:20260404T093135
CREATED:20250805T094840Z
LAST-MODIFIED:20250805T094840Z
UID:76825-1763623800-1763744400@svec.org
SUMMARY:IEEE Symposium on Reliability for Electronics and Photonics Packaging
DESCRIPTION:[]\nThis symposium will focus on quantified reliability\, accelerated testing and probabilistic assessments of the useful lifetime of electronic\, photonic\, MEMS and MOEMS materials\, assemblies\, packages and systems in electronics and photonics packaging. This includes failure modes\, mechanisms\, testing schemes\, accelerated testing\, stress levels\, and environmental stresses.\nVisit our website for details\, for our Advance Program\, and to register. https://attend.ieee.org/repp.\nMilpitas\, California\, United States\, Virtual: https://events.vtools.ieee.org/m/495693
URL:https://svec.org/event/ieee-symposium-on-reliability-for-electronics-and-photonics-packaging/
LOCATION:Milpitas\, California\, United States\, Virtual: https://events.vtools.ieee.org/m/495693
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20251119T185000
DTEND;TZID=America/Los_Angeles:20251119T200000
DTSTAMP:20260404T093135
CREATED:20251116T141805Z
LAST-MODIFIED:20251116T141805Z
UID:77399-1763578200-1763582400@svec.org
SUMMARY:Translational Multimodal Bioelectronics: From Biosymbiotic Devices to Clinically Integrated Digital Health
DESCRIPTION:Abstract: Advances in soft materials\, low-power circuits\, and wireless energy harvesting now allow imperceptible\, long-lived bioelectronic systems that are practical beyond the lab bench. This talk presents translational pathways for multimodal bioelectronics that bridge engineering innovation with clinical impact. We highlight epidermal and implantable platforms that acquire high-fidelity biosignals—EEG/IMU for neonatal seizure risk and sleep\, ECG–SCG–PCG for cardiopulmonary coordination\, and oral ISFET-based pH sensors for chemo- physiological context—and describe the materials\, packaging\, and system architectures that enable stable\, week-scale wear. Beyond device physics\, we emphasize translation: firmware that guarantees sub-10 ms synchronization across channels\, analytics pipelines that integrate signal quality indices with explainable ML models\, and HIPAA-compliant clinician dashboards that transform continuous raw streams into actionable insights. Case studies from NICU deployments and adult cohorts illustrate how biosymbiotic devices can support seizure detection\, brain–heart dysregulation screening\, and personalized therapy planning. By uniting materials\, systems\, and AI with real clinical use\, these efforts outline a roadmap for multimodal digital healthcare that is both technically rigorous and translatable to patient care.\nReferences: PNAS June 2025 122 (23) e2501220122; Nature Medicine (under review); Nature BME (under submission)\n[]\nSpeaker(s): Assist. Prof. Yayun Du\nAgenda:\n6:50 – 7 PM: Registration\n7-8 PM: Talk and Q&A\nVirtual: https://events.vtools.ieee.org/m/515108
URL:https://svec.org/event/translational-multimodal-bioelectronics-from-biosymbiotic-devices-to-clinically-integrated-digital-health/
LOCATION:Virtual: https://events.vtools.ieee.org/m/515108
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20251119T180000
DTEND;TZID=America/Los_Angeles:20251119T200000
DTSTAMP:20260404T093135
CREATED:20251009T120449Z
LAST-MODIFIED:20251009T120449Z
UID:77210-1763575200-1763582400@svec.org
SUMMARY:Stability & Biasing in mmWave GaAs/GaN PAs: Challenges and Solutions
DESCRIPTION:Millimeter-wave (mmWave) power amplifiers (PAs) are critical building blocks in next-generation radar\, satellite\, defense\, and 6G communication systems\, where output power\, bandwidth\, and efficiency must be achieved under stringent size\, weight\, and power (SWaP) constraints. Among the enabling technologies\, Gallium Arsenide (GaAs) and Gallium Nitride (GaN) continue to dominate due to their complementary strengths in linearity\, noise performance\, and high-power density.\nThis talk will focus on design considerations unique to mmWave GaAs and GaN PAs\, with particular emphasis on stability and biasing challenges at frequencies above 20 GHz. Unlike lower microwave designs\, mmWave PAs are highly susceptible to low-frequency oscillations\, odd-mode instabilities\, and bias-induced resonances. To mitigate these\, stability networks—ranging from RC shunt loading and resistive feedback to series loading and quarter-wave stabilization—must be co-optimized with matching and biasing schemes. Special attention will be given to the integration of stability networks with bias networks\, where parasitics from bias chokes\, decoupling capacitors\, and high-impedance bias lines can introduce additional poles/zeros in the response\, affecting both gain flatness and unconditional stability.\nThe presentation will review practical approaches to stabilizing mmWave PAs without compromising efficiency or bandwidth\, including the use of lossy transmission lines\, broadband bias tees\, and RC filtering strategies tailored for GaAs vs. GaN processes. Case studies will illustrate how bias network design impacts stability margins and overall PA performance\, and how distributed versus lumped stabilization choices evolve with frequency. The session will conclude with a discussion of packaging and integration considerations\, where bondwire inductances\, via transitions\, and LTCC/SiP bias routing play a defining role in amplifier stability at mmWave frequencies.\nSpeaker(s): Asmita Dani\,\nRoom: 4021\, Bldg: Sobrato Campus for Discovery and Innovation\, Santa Clara University\, 500 El Camino Real\, Santa Clara\, California\, United States\, 95054\, Virtual: https://events.vtools.ieee.org/m/505939
URL:https://svec.org/event/stability-biasing-in-mmwave-gaas-gan-pas-challenges-and-solutions-2/
LOCATION:Room: 4021\, Bldg: Sobrato Campus for Discovery and Innovation\, Santa Clara University\, 500 El Camino Real\, Santa Clara\, California\, United States\, 95054\, Virtual: https://events.vtools.ieee.org/m/505939
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20251119T180000
DTEND;TZID=America/Los_Angeles:20251119T200000
DTSTAMP:20260404T093135
CREATED:20251009T120448Z
LAST-MODIFIED:20251009T120448Z
UID:77209-1763575200-1763582400@svec.org
SUMMARY:Stability & Biasing in mmWave GaAs/GaN PAs: Challenges and Solutions
DESCRIPTION:Millimeter-wave (mmWave) power amplifiers (PAs) are critical building blocks in next-generation radar\, satellite\, defense\, and 6G communication systems\, where output power\, bandwidth\, and efficiency must be achieved under stringent size\, weight\, and power (SWaP) constraints. Among the enabling technologies\, Gallium Arsenide (GaAs) and Gallium Nitride (GaN) continue to dominate due to their complementary strengths in linearity\, noise performance\, and high-power density.\nThis talk will focus on design considerations unique to mmWave GaAs and GaN PAs\, with particular emphasis on stability and biasing challenges at frequencies above 20 GHz. Unlike lower microwave designs\, mmWave PAs are highly susceptible to low-frequency oscillations\, odd-mode instabilities\, and bias-induced resonances. To mitigate these\, stability networks—ranging from RC shunt loading and resistive feedback to series loading and quarter-wave stabilization—must be co-optimized with matching and biasing schemes. Special attention will be given to the integration of stability networks with bias networks\, where parasitics from bias chokes\, decoupling capacitors\, and high-impedance bias lines can introduce additional poles/zeros in the response\, affecting both gain flatness and unconditional stability.\nThe presentation will review practical approaches to stabilizing mmWave PAs without compromising efficiency or bandwidth\, including the use of lossy transmission lines\, broadband bias tees\, and RC filtering strategies tailored for GaAs vs. GaN processes. Case studies will illustrate how bias network design impacts stability margins and overall PA performance\, and how distributed versus lumped stabilization choices evolve with frequency. The session will conclude with a discussion of packaging and integration considerations\, where bondwire inductances\, via transitions\, and LTCC/SiP bias routing play a defining role in amplifier stability at mmWave frequencies.\nSpeaker(s): Asmita Dani\,\nRoom: 4021\, Bldg: Sobrato Campus for Discovery and Innovation\, Santa Clara University\, 500 El Camino Real\, Santa Clara\, California\, United States\, 95054\, Virtual: https://events.vtools.ieee.org/m/505939
URL:https://svec.org/event/stability-biasing-in-mmwave-gaas-gan-pas-challenges-and-solutions/
LOCATION:Room: 4021\, Bldg: Sobrato Campus for Discovery and Innovation\, Santa Clara University\, 500 El Camino Real\, Santa Clara\, California\, United States\, 95054\, Virtual: https://events.vtools.ieee.org/m/505939
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20251119T180000
DTEND;TZID=America/Los_Angeles:20251119T190000
DTSTAMP:20260404T093135
CREATED:20251018T123319Z
LAST-MODIFIED:20251018T123319Z
UID:77293-1763575200-1763578800@svec.org
SUMMARY:Talk - Systems with Intent: Designing Agentic AI for Financial Decisioning
DESCRIPTION:Hosted via Google Meet – https://meet.google.com/pqw-trcy-xpg\nThe financial industry is entering a new phase of intelligence—one where AI systems are no longer just analytical tools but autonomous collaborators capable of interpreting goals\, reasoning over complex data\, and taking context-aware actions. This talk explores the emergence of agentic AI systems in finance—AI architectures designed with intent\, memory\, and decision agency at their core.\nWe’ll examine how these systems differ from traditional automation by introducing the concept of goal-driven autonomy: agents that plan\, execute\, and self-reflect across dynamic financial environments. Drawing from real-world applications such as loan underwriting\, portfolio monitoring\, and compliance intelligence\, the session will unpack how planners\, executors\, and reflectors interact within an agentic loop to make transparent\, auditable decisions.\nThe discussion will also highlight enabling technologies—large language models as reasoning engines\, retrieval-augmented generation (RAG+) for contextual grounding\, and knowledge graphs for structured memory—and how they converge to form adaptive decision frameworks. Finally\, we’ll address the critical dimensions of safety\, alignment\, and regulatory oversight required to operationalize agentic AI responsibly in financial ecosystems.\nParticipants will gain a systems-level understanding of how to engineer intent into AI\, design autonomous yet trustworthy financial agents\, and prepare for a future where decision-making is increasingly shared between humans and intelligent systems.\n—————————————————————\nBy registering for this event\, you agree that IEEE and the organizers are not liable to you for any loss\, damage\, injury\, or any incidental\, indirect\, special\, consequential\, or economic loss or damage (including loss of opportunity\, exemplary or punitive damages). The event will be recorded and will be made available for public viewing.\nSpeaker(s): Dhivya Nagasubramanian\nVirtual: https://events.vtools.ieee.org/m/508173
URL:https://svec.org/event/talk-systems-with-intent-designing-agentic-ai-for-financial-decisioning/
LOCATION:Virtual: https://events.vtools.ieee.org/m/508173
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20251118T173000
DTEND;TZID=America/Los_Angeles:20251118T203000
DTSTAMP:20260404T093135
CREATED:20251013T235520Z
LAST-MODIFIED:20251014T002612Z
UID:77224-1763487000-1763497800@svec.org
SUMMARY:2025 SVEC Open House  - "New Pathways to Improve Healthcare"
DESCRIPTION:Silicon Valley Engineering Council’s annual Open House features networking with refreshments and a Biotech panel discussion\, including engineering’s role in healthcare futures.\n\nThe population in the United States and many Western countries is aging. The cost for developing and using healthcare is rising so much that one wonders if it is sustainable. New ways of thinking are needed for development. Engineers and scientists play a critical role in these fields. Learn from these biotech leaders how their companies are charting new pathways to improve health and healthcare in the future.\n\n\nSPEAKERS\nChristin Glorioso\, CEO & Co-Founder\, NeuroAge Therapeutics\nChristin Glorioso\, MD\, Ph.D.\, is the CEO and Cofounder of NeuroAge Therapeutics and the Founder and Executive Director of Longevity Global. She is an Epidemiologist\, Physician-Scientist\, and Serial Entrepreneur with expertise in Neuroscience\, AI\, and Computational Modeling.\n\nLesley Telford\, QA Manager\, TauTona Group\nLesley Telford has focused her career on engineering in the healthcare field. Beginning at Abbott Vascular\, after earning a BS in Biomedical Engineering from Cal Poly\, San Luis Obispo\, she joined TauTona Group  in Redwood City over eight years ago. She is currently the Quality Assurance Manager for this biotech incubator. Telford is an active member of the Society of Women Engineers (SWE)\, serving as a leader both locally and internationally\, and was recognized by SWE as an Outstanding Collegiate Member in 2010.\n\nDATE: November 8\, 2025 – 5:30 – 8:30PM\n\nAGENDA\n5:30 – 6:45  Networking & Snacking\n6:45 – 7:00  Introductions of SVEC\n7:00 – 8:30  Panel\n\nLOCATION: Eurofins EAG – 810 Kiefer Rd.\, Sunnyvale\n\nThe Open House event is offers a great opportunity to recognize our member organizations and promote their programs and events\, This event features the speakers panel and offers refreshments with networking time for attendees to meet other Silicon Valley engineers.\n\nREGISTRATION: luma.com/SVECOpenHouse
URL:https://svec.org/event/2025-svec-open-house-new-pathways-to-improve-healthcare/
LOCATION:Eurofins/EAG\, 810 Kifer Rd.\, Sunnyvale\, CA\, 94086\, United States
ORGANIZER;CN="Silicon Valley Engineering Council (SVEC)":MAILTO:info@svec.org
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20251115
DTEND;VALUE=DATE:20251116
DTSTAMP:20260404T093135
CREATED:20251014T050815Z
LAST-MODIFIED:20251014T175606Z
UID:77244-1763164800-1763251199@svec.org
SUMMARY:Towards Agentic Intelligence: Architectures for Multi-Agent AI Systems
DESCRIPTION:Building on the tremendous response to Dhanashree Lele’s ACM talk on Multi-Agent Architectures for Enterprise AI\, this 2-day\, research-caliber\, hands-on workshop is designed to advance the state of practice in Agentic AI system design\, evaluation\, and optimization. \nThis workshop will guide participants through theory-to-deployment workflows for constructing next-generation multi-agent frameworks\, benchmarking agentic behaviors\, and applying compute-efficient orchestration strategies. The curriculum draws heavily from recent breakthroughs presented at NeurIPS\, ICLR\, and KDD\, grounding hands-on engineering in rigorous scientific principles and reproducible experimentation. \nBy bridging academic research and production-grade engineering\, this workshop is ideal for applied researchers\, industry practitioners\, graduate students\, and technical leaders seeking to design reliable\, interpretable\, and high-performance LLM-based agentic systems. \nLearning Format and Structure\nThis intensive two-day workshop follows a progressive “build-as-you-learn” methodology. Each module introduces core research concepts followed by guided implementation in Jupyter/Google Colab\, enabling participants to translate theory directly into working systems. \n📅 Day 1 — Architecting Multi-Agent Systems\n4 hands-on labs focused on: \n\n\n\nBuilding multi-agentic systems/use-cases from first principles\nExploring agent tools\, MCP operability\, and orchestration strategies\nConverting agentic prototypes into robust\, production-ready cognitive pipelines\nImplementing coordination\, planning\, and tool-use protocols across agents\n\n\n\n📅 Day 2 — Deep Dive: Research Frontiers and Reproduction\n\nAnalytical walkthroughs of seminal and frontier papers in Agentic AI from NeurIPS\, ICLR\, and KDD\nStructured methodology for paper-to-prototype translation: reproducing cutting-edge research through practical labs\nDiscussions on evaluation benchmarks\, alignment frameworks\, and emergent behavior analysis\nRoadmapping techniques for embedding research-grade systems into real-world enterprise use cases\n\nKey Outcomes\nTheoretical Foundations:Understand the mathematical and algorithmic underpinnings of multi-agent LLM architectures\, orchestration\, and alignment. \nHands-On Mastery:Gain practical experience in building agentic systems from scratch\, configuring MCP operability\, and scaling prototypes into production-grade deployments. \nEvaluation & Governance:Learn to design and apply alignment and evaluation frameworks to ensure robustness\, interpretability\, and responsible deployment of multi-agent systems. \nPractical Assets:Walk away with fully functional notebooks\, baseline reference architectures\, curated reading lists\, and reproducible workflows to accelerate implementation in your own organization. \nRegistration:\nEventbrite tickets
URL:https://svec.org/event/towards-agentic-intelligence-architectures-for-multi-agent-ai-systems/
LOCATION:Valley Research Park\, 319 North Bernardo Ave\, Mountain View\, CA.\, Valley Research Park\, 319 North Bernardo Ave\, Mountain View\, CA\, United States
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20251114T100000
DTEND;TZID=America/Los_Angeles:20251114T110000
DTSTAMP:20260404T093135
CREATED:20251025T130323Z
LAST-MODIFIED:20251025T130323Z
UID:77339-1763114400-1763118000@svec.org
SUMMARY:EMC for Missiles
DESCRIPTION:This virtual meeting can accommodate up to 100 attendees.\nWhile military systems in general have to operate in tough electromagnetic environments\, missile programs require special attention and considerations from an EMI/EMC perspective. From environments to requirements to best practices\, this presentation will discuss key focuses of EMI/EMC engineering in relation to missile programs and systems and how best to achieve success.\nSpeaker(s): Flynn Lawrence\, Flynn Lawrence\nVirtual: https://events.vtools.ieee.org/m/508800
URL:https://svec.org/event/emc-for-missiles/
LOCATION:Virtual: https://events.vtools.ieee.org/m/508800
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20251113T120000
DTEND;TZID=America/Los_Angeles:20251113T130000
DTSTAMP:20260404T093135
CREATED:20250829T103326Z
LAST-MODIFIED:20250829T103326Z
UID:77010-1763035200-1763038800@svec.org
SUMMARY:AI-Enhanced Multimodal Approaches for Electronics Metrology and Failure Analysis
DESCRIPTION:The rapid growth of 3D advanced packaging introduces new challenges in inspection and failure analysis\, where complex structures such as microbumps\, redistribution layers (RDLs)\, and through-silicon vias (TSVs) demand reliable non-destructive testing (NDT). Conventional approaches\, including Scanning Acoustic Microscopy (SAM) and X-ray imaging\, are limited by noise\, resolution\, and defect visibility\, creating barriers for reproducible and scalable analysis. To address these challenges\, our work advances an AI-powered multimodal inspection framework that couples physics-informed machine learning with structured data infrastructure. A Physics-Informed Neural Network (PINN) approach enhances SAM imaging by embedding acoustic wave physics into reconstructions\, producing higher-fidelity images validated through structural similarity and physical accuracy metrics. Complementing this\, multimodal data fusion across SAM\, X-ray laminography\, optical microscopy\, and CT establishes richer defect detection and cross-validation. Central to this effort is the creation of multimodality benchmark datasets built on standardized acquisition protocols\, structured metadata schemas\, and annotation pipelines. These datasets provide not only a foundation for AI model training but also enable reproducibility\, traceability\, and interoperability across future programs.\nSpeaker(s): Navid Asadi\,\nVirtual: https://events.vtools.ieee.org/m/498529
URL:https://svec.org/event/ai-enhanced-multimodal-approaches-for-electronics-metrology-and-failure-analysis/
LOCATION:Virtual: https://events.vtools.ieee.org/m/498529
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20251113T113000
DTEND;TZID=America/Los_Angeles:20251113T131500
DTSTAMP:20260404T093135
CREATED:20250930T114826Z
LAST-MODIFIED:20250930T114826Z
UID:77174-1763033400-1763039700@svec.org
SUMMARY:Rethinking Chip Design to deliver Faster\, Smarter\, More Compact Solutions
DESCRIPTION:Rethinking Chip Design to deliver Faster\, Smarter\, More Compact Solutions\n[]\nAbstract:\nCDimension is rethinking chip design from the ground up\, delivering solutions that are faster\, smarter\, and more compact.\nWe’re moving beyond the limitations of traditional technology.\nOur foundational innovations in advanced materials and semiconductor integration unlock unprecedented gains in performance\, efficiency\, and scalability – ranging from 10x to 1\,000x times greater than current approaches.\nOur first milestone: the commercial release of ultra-thin 2D semiconductor materials — a foundational step toward our vision of vertically integrated systems that unify compute\, memory\, and power.\n[]\nSpeaker:\nDr. Jiadi Zhu\nCEO\nCDimension\nJiadi Zhu is the CEO and founder of CDimension\, a company rethinking chip design to deliver faster\, smarter\, more compact solutions for the most demanding and complex computing workloads. His vision is to redefine how chips are designed\, not just for higher performance\, but for fundamentally better structure and efficiency.\nJiadi’s technical foundation spans over a decade of work at the frontier of 2D materials\, monolithic 3D integration\, and device scaling. He earned his Ph.D. in Electrical Engineering from the Massachusetts Institute of Technology and has been recognized across both academia and industry for his originality in device design\, novel semiconductor materials\, and integration.\nHis research–from MIT to the lab bench of CDimension–has focused on how to break architectural bottlenecks through physics-aware\, layout-driven design. Jiadi’s research has been widely cited in the field and published and presented in top-tier journals and conferences\, including Nature Nanotechnology and IEEE’s International Electron Devices Meeting.\nJiadi’s transition from research into startup leadership has drawn attention from leaders in semiconductors\, high-performance computing\, and next-generation AI hardware. Today\, under Jiadi’s leadership\, CDimension is overcoming the limitations of traditional chip architectures and delivering significantly better performance\, efficiency\, and scalability across modern computing environments.\nAGENDA:\nThursday November 13\, 2025\n11:30 AM: Networking\, Pizza & Drinks\nNoon — 1 pm: Seminar\nPlease register on Eventbrite before 9:30 AM on Thursday November 13\, 2025\n$4 IEEE members $6 non IEEE members\n(discounts for unemployed and students )\nSee examplesAdd\nCo-sponsored by: 636940-Santa Clara Valley Section Chapter\,EMB18\nBldg: ==> Use corner entrance: Kifer Road / San Lucar Court ==> Do not enter at main entrance on Kifer Road\, EAG Labs\, 810 Kifer Road\, Sunnyvale\, California\, California\, United States\, 95051
URL:https://svec.org/event/rethinking-chip-design-to-deliver-faster-smarter-more-compact-solutions/
LOCATION:Bldg: ==> Use corner entrance: Kifer Road / San Lucar Court ==> Do not enter at main entrance on Kifer Road\, EAG Labs\, 810 Kifer Road\, Sunnyvale\, California\, California\, United States\, 95051
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DTSTART;TZID=America/Los_Angeles:20251112T190000
DTEND;TZID=America/Los_Angeles:20251112T200000
DTSTAMP:20260404T093135
CREATED:20251106T134807Z
LAST-MODIFIED:20251106T134807Z
UID:77371-1762974000-1762977600@svec.org
SUMMARY:Tech Talks: Overlap Between Classical Statistics and Modern AI & AI in Human Resources
DESCRIPTION:The San Francisco Bay Area chapter of the IEEE Computer Society invites to our free and open Virtual Tech Talks (no IEEE membership required):\nFirst Speaker: Swetha Manohar RM ((https://www.linkedin.com/in/-swethavbenchsales))\nTitle: Artificial Intelligence HR: Candidature for Foreign Job Recruitment and India Recruitment\nAbstract: In international job markets\, artificial intelligence (AI) is transforming HR recruitment. Language translation\, automated resume screening\, cultural fit evaluation\, and international talent acquisition are all made possible by AI-powered solutions. AI broadens the talent pool\, offers individualized assistance\, and forecasts talent requirements using predictive analytics. The advantages include cost savings\, better hiring decisions\, enhanced candidate experience\, and higher efficiency. Integration with current HR systems\, bias prevention\, and data quality are among the difficulties. Businesses may improve the efficacy\, efficiency\, and candidate experience of recruitment by utilizing AI. AI-powered HR tools\, including standalone programs and comprehensive platforms\, streamline HR functions like hiring\, payroll\, performance reviews\, and employee engagement\, enhancing efficiency\, accuracy\, and allowing HR professionals to focus on strategic initiatives.\nBio: I am a dedicated and results-driven professional with over 16 years of experience in end-to-end Technical Recruitment\, Bench Sales\, Consultant and Vendor Management\, and Training & Development. I have provided services to top U.S. IT companies\, helping them acquire the best resources for their job requirements. My expertise lies in handling all types of technical requirements\, identifying top consultants\, and successfully placing our H1B candidates in leading IT firms across the U.S. Skilled in technologies such as Java\, .NET\, Oracle\, and Clinical SAS\, I take pride in building strong vendor relations and driving organizational growth.\nSecond Speaker: Sri Budaraju ((http://linkedin.com/in/ambareesh-b-323b98270))\nTitle: Can Simple Regression Compete with Artificial Intelligence? Exploring the Overlap Between Classical Statistics and Modern AI\nAbstract: This talk explores the comparison of classical regression models\, often taught in an introductory statistics course\, compared with the modern AI and machine learning models in predicting real-world outcomes. Using real datasets from reputed sources like Kaggle\, this research dives into comparing the accuracy of simple linear and logistic regression methods to the more complex AI systems. This highlights the surprising power of simple statistical techniques and situations in which they are more applicable compared to bigger models for their interpretability and how they play a vital role in the realm of Artificial Intelligence.\nBio: Sri Budaraju (Ambareesh) is an honors student at Las Positas where he is an avid researcher in fields of mathematics & computer science. Sri is experienced in the realm of research as he previously was researching micropropagation and organogenesis in the field of Biotechnology. Sri has been invited and presented his research works at various conferences such as Mission College Symposium & Expo and other ASDRP associated online conferences as well.\nSpeaker(s): Sri Budaraju\, Swetha Manohar\nVirtual: https://events.vtools.ieee.org/m/512749
URL:https://svec.org/event/tech-talks-overlap-between-classical-statistics-and-modern-ai-ai-in-human-resources/
LOCATION:Virtual: https://events.vtools.ieee.org/m/512749
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