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DTSTART;TZID=America/Los_Angeles:20260519T080000
DTEND;TZID=America/Los_Angeles:20260520T170000
DTSTAMP:20260404T073256
CREATED:20260206T094815Z
LAST-MODIFIED:20260206T094815Z
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SUMMARY:Third Annual IEEE Build-Up Substrate Symposium
DESCRIPTION:[]\n(More information will be added in early March. General Registration should open around March 1st. Sponsors may register at the link below.)\nWe are living in the era of heterogeneous integration driven by fast\, efficient and big data computing resources at our fingertips. The mega-monolithic silicon chip is a thing of the past\, replaced with 3D heterogeneous integration of chiplets onto a platform made of an organic build-up substrate. Volume manufacturers of build-up substrates are entirely based in Asia\, leaving a desert in the US. Volume build-up substrates used by major IDMs are manufactured in Asian countries including Taiwan\, Japan and China.\nHowever\, there are multiple activities starting up in the US\, and this is why a gathering of the US players is important. This symposium is geared for all those involved in the supply chain of build-up substrates in the US\, as well as users. This Symposium is an opportunity for all build-up substrate players to meet\, network and cohesively work with funding agencies who will be invited to this symposium to focus on onshoring build-up substrate production and utilization.\nSamsung\, San Jose\, California\, United States
URL:https://svec.org/event/third-annual-ieee-build-up-substrate-symposium/
LOCATION:Samsung\, San Jose\, CA\, United States
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DTSTART;TZID=America/Los_Angeles:20260519T090000
DTEND;TZID=America/Los_Angeles:20260520T170000
DTSTAMP:20260404T073256
CREATED:20260304T174831Z
LAST-MODIFIED:20260304T174831Z
UID:77832-1779181200-1779296400@svec.org
SUMMARY:IEEE Build-Up Substrate Symposium (BUSS)
DESCRIPTION:We are living in the era of heterogeneous integration driven by fast\, efficient and big data computing resources at our fingertips. The mega-monolithic silicon chip is a thing of the past\, replaced with 3D heterogeneous integration of chiplets onto a platform made of an organic build-up substrate. Volume manufacturers of build-up substrates are entirely based in Asia\, leaving a desert in the US. Volume build-up substrates used by major IDMs are manufactured in Asian countries including Taiwan\, Japan and China.\nHowever\, there are multiple activities starting up in the US\, and this is why a gathering of the US players is important. This symposium is geared for all those involved in the supply chain of build-up substrates in the US\, as well as users. As the US Congress debates H.R. 3249\, the Protecting Circuit Boards and Substrates (PCBS) Act\, this Symposium is an opportunity for all build-up substrate players to meet\, network and cohesively work with funding agencies who will be invited to this symposium to focus on onshoring build-up substrate production and utilization.\nlocation to be announced\, Milpitas\, California\, United States\, Virtual: https://events.vtools.ieee.org/m/544352
URL:https://svec.org/event/ieee-build-up-substrate-symposium-buss-2/
LOCATION:location to be announced\, Milpitas\, California\, United States\, Virtual: https://events.vtools.ieee.org/m/544352
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BEGIN:VEVENT
DTSTART;TZID=America/New_York:20260525T210000
DTEND;TZID=America/New_York:20260526T170000
DTSTAMP:20260404T073256
CREATED:20260226T173312Z
LAST-MODIFIED:20260226T173312Z
UID:77809-1779742800-1779814800@svec.org
SUMMARY:IEEE Canada Blockchain Forum 2026 (4th edition)
DESCRIPTION:The IEEE Blockchain Forum is returning for the fourth time as part of (https://www.torontotechweek.com/). The goal of this compact one-day event is to congregate BUIDLers\, researchers\, academics\, and engineers building blockchain protocols\, infrastructure\, and decentralized software applications.\nNote: (https://events.vtools.ieee.org/m/469545) counted with 200 participants and speakers from JP Morgan\, the Bank of Canada\, Mastercard\, the Ethereum Enterprise Alliance\, EY\, Starknet\, among others.\n[]\nCo-sponsored by: Government of Ontario\nAgenda:\nAgenda TBC\nOntario Investment and Trade Centre\, 250 Yonge Street\, 35th Floor\, Toronto\, Ontario\, Canada\, M5B 2L7
URL:https://svec.org/event/ieee-canada-blockchain-forum-2026-4th-edition/
LOCATION:Ontario Investment and Trade Centre\, 250 Yonge Street\, 35th Floor\, Toronto\, Ontario\, Canada\, M5B 2L7
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DTSTART;TZID=America/Los_Angeles:20260624T080000
DTEND;TZID=America/Los_Angeles:20260625T170000
DTSTAMP:20260404T073256
CREATED:20260319T184817Z
LAST-MODIFIED:20260319T184817Z
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SUMMARY:Center for Advanced Signal and Image Sciences (CASIS) 29th Annual Workshop
DESCRIPTION:We are thrilled to host LLNL’s 30th Center for Advanced Signal and Image Sciences (CASIS) workshop. The workshop returns with a full 2-day in-person schedule on Wednesday and Thursday\, June 24-25\, 2026.\nWe encourage a broad range of technical topics at the workshop and being non-archival apart from original work\, we are also considering intermediate results from ongoing efforts as well as recently published publications for presentation as a talk and/or a poster. The goal of the workshop is to provide a platform for the exchange of ideas and network with peers across disciplines to foster collaboration and build community. Please submit your abstract by Friday\, May 15\, 2026. Authors will be notified of the review decisions one week later on May 22\, 2026.\nApart from the regular presentation track we will feature parallel tutorials\, hands-on mini workshops and a dedicated student track to introduce career opportunities at LLNL.\nThe workshop will be held in-person at the (https://uclcc.org/) and requires pre-registration until June 18\, 2026. As this is a 2-day whole-day workshop\, we will provide coffee and snacks in morning and afternoon breaks as well as a lunch on both days. As this is our 30th anniversary\, we will also host a Happy Hour following the regular program on Wednesday\, June 24\, 2026.\n(https://engineering.llnl.gov/centers/casis/workshops)\nThis year’s workshop features presentations in the following tracks\, moderated by the Program Chairs:\n– AI/Machine Learning (PhanNguyen\, Kowshik Thopalli)\n– National Ignition Facility (Eugene Kur\, Christopher Miller)\n– Non-Destructive Evaluation (Seemeen Karimi\, Harry Martz)\n– Quantum Sensing & Quantum Computing (Kristi Beck)\n– Remote Sensing\, Non-Invasive Imaging & Inverse Problems (Sean Lehman\, Viacheslav Li)\n– Robotics & Automation (Aldair Gongora\, Abhik Sarkar)\n– Student Track: All topics (Poster only) (Ted Bauman\, Min Priest)\nBecome part of this great experience and submit your talk proposal at https://engineering.llnl.gov/centers/casis/workshops before May 15\, 2025!\nCheck out (https://www.llnl.gov/article/53041/annual-workshop-brings-together-signal-image-science-community) for last year’s amazing event to see what to expect!\nThe no-fee CASIS Workshop is sponsored by the (https://engineering.llnl.gov/) and held at the (https://uclcc.org/). It is organized by the (https://engineering.llnl.gov/centers/casis)\, and is a joint meeting with the local chapters of the (https://www.ewh.ieee.org/r6/oeb/SigProc/sigproc.html) and (https://r6.ieee.org/sfoeb-cs/). supported by the (https://r6.ieee.org/oeb/).\nCo-sponsored by: Lawrence Livermore National Laboratory – Center for Advanced Signal and Image Sciences\nBldg: Building 661 L-794\, University of California Livermore Collaboration Center\, 7000 East Ave\, Livermore\, California\, United States\, 94550
URL:https://svec.org/event/center-for-advanced-signal-and-image-sciences-casis-29th-annual-workshop-2/
LOCATION:Bldg: Building 661 L-794\, University of California Livermore Collaboration Center\, 7000 East Ave\, Livermore\, California\, United States\, 94550
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