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BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20251004T170000
DTEND;TZID=America/Los_Angeles:20251004T210000
DTSTAMP:20260404T135203
CREATED:20250903T005758Z
LAST-MODIFIED:20250923T174802Z
UID:77033-1759597200-1759611600@svec.org
SUMMARY:Legends of Engineering - Saturday\, October 4\, 2025 - 5PM - 9
DESCRIPTION:The Silicon Valley Engineering Hall of Fame is proud to present the “Legends of\nEngineering” speaker series\, a unique opportunity to hear from some of the most influential\nminds in engineering and technology today. \nIn the spirit of the remarkable accomplishments and contributions of our Hall of Fame inductees\,\nthis series will feature prominent speakers addressing today’s most important topics\nin engineering\, technology\, and society. Whether you’re a seasoned professional or an emerging\ntalent\, this is your chance to engage in thought-provoking discussions that shape the future of\ninnovation. \nWhat to Expect\n\nExpert Speakers: Learn from pioneers who are shaping the future of technology.\nNetworking Opportunities: Connect with colleagues\, peers\, and industry leaders.\nInspiration and Insight: Gain invaluable perspectives on the trends and challenges\ndriving the tech world forward.\n\nSpeakers\nRonjon Nag\, PhD\nProfessor Ronjon Nag is an inventor and entrepreneur. He is an Adjunct Professor in Genetics at the Stanford School of Medicine\, becoming a Stanford Distinguished Careers Institute Fellow in 2016.  He is a founder and advisor/board member of multiple start-ups. His companies have been sold to Apple\, BlackBerry\, and Motorola. More recently he has worked on the intersection of AI and Biology. He has been awarded the Mountbatten Medal in the Royal Institution by the Institution of Engineering and Technology\, and has been winner (as Chairman of Bounce Imaging) of the $1m Verizon Powerful Answers Award. He has been a pioneer of smartphones and the ‘app stores’ they depend on. He  was awarded the 2021 IEEE-SCV Outstanding Engineer Award and the 2021 IEEE-USA Leader in Entrepreneurship Spirit Award. \nProfessor Nag has a Ph.D from Cambridge\, an M.S from M.I.T and a B.Sc. from Birmingham in the UK\, and is an Adjunct Professor in Genetics at the Stanford School of Medicine.  Dr. Nag is a 2024 inductee to the Silicon Valley Engineering Hall of Fame. \nChandrakant Patel\, PE\nA former SVP\, Chief Engineer\, and Senior Fellow at HP Inc. – Chandrakant has been a Silicon Valley contributor for 42 years. Formerly leading HP Labs\, he has shaped advancements in data centers\, chips\, high performance computing systems\, storage\, networking\, 3D additive\nmanufacturing systems\, and software platforms. Pioneering energy-efficient data center\nsolutions\, he founded the Data Center research program at HP Laboratories that led to multi-billion-dollar data center infrastructure and services business. He is a recognized leader in AI\, energy efficient computing\, and sustainability. \nWith deep passion for fundamentals\, and workforce development\, he has also served as adjunct faculty in engineering at UC Berkeley\, San Jose State\, Santa Clara University and Chabot College for two decades. An IEEE Fellow\, ASME Fellow\, member of the National Academy of Engineering (NAE) and the Silicon Valley Engineering Hall of Fame\, Chandrakant holds 165 US patents and has published more than 150 papers. He is a registered professional mechanical engineer in the State of California. \nChandrakant has served on the company board of Mphasis\, an IT Services Company in India. He has also served on the Industrial Advisory Boards in EECS at UC Berkeley and ME at Santa Clara University. \nSuhas Patil\, ScD \nSuhas Patil is founder and retired Chairman of Cirrus Logic Inc.\, a leading semiconductor company. He is cofounder of The Indus Entrepreneurs (TiE)\, world’s largest nonprofit for fostering entrepreneurs with 60 chapters worldwide. \nBefore becoming an entrepreneur\, Dr. Patil was an Assistant Professor of Electrical Engineering at MIT from 1970 to 1975 and an Associate Professor at the University of Utah from 1975 to 1980. \nHe founded Cirrus Logic\, Inc. in 1981 based on his research at MIT and the University of Utah on computer aided design of semiconductor chips. He based Cirrus Logic on an innovative fabless model of semiconductor product company. \nHe received his B. Tech (Honors) in Electronics and Electrical Communications from the Indian Institute of Technology\, Kharagpur\, in 1965. He earned his Sc D degree in Electrical Engineering at MIT in 1970. \nJoin Us!\nBe part of these exciting conversations\, broaden your knowledge\, and expand your\nnetwork. Stay tuned for our upcoming speaker announcements and event details. Don’t miss out\non this opportunity to be at the forefront of engineering and technological advancements. \nStay Connected\, Stay Inspired.\nWe look forward to seeing you at the “Legends of Engineering” speaker series! \nRegistration/Tickets\n  \nTodd Mosher\, HoF@svec.org \nMarziya Hasan\, dir-marziya.hasan@svec.org \nKim Parnell\, Vice-President@svec.org \n 
URL:https://svec.org/event/legends-of-engineering-saturday-october-4-2025-5pm-9/
LOCATION:Santa Clary University – Sobrato Engineering Building\, 500 El Camino Real\, Santa Clara\, CA\, 95053\, United States
ORGANIZER;CN="Silicon Valley Engineering Council (SVEC)":MAILTO:info@svec.org
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20251004T140000
DTEND;TZID=America/Los_Angeles:20251004T170000
DTSTAMP:20260404T135203
CREATED:20250726T094841Z
LAST-MODIFIED:20250726T094841Z
UID:76773-1759586400-1759597200@svec.org
SUMMARY:Folsom Powerhouse Visit
DESCRIPTION:IEEE PES & YP – Folsom Powerhouse Visit\nEmpowering the Future of Energy\nJoin us for an exciting and educational visit to the historic Folsom Powerhouse\, where students and young professionals will experience the legacy and science of hydroelectric power firsthand.\nThis event is designed to connect students and youth with the professional world\, offering a unique opportunity to:\n– Explore how electricity was historically generated and transmitted.\n– Gain practical insights into hydroelectric power systems.\n– Interact directly with industry professionals and IEEE leaders.\n– Discover how engineering and innovation have evolved from past to present.\nWhether you're a student curious about the energy field or a young professional looking to expand your knowledge\, this visit promises to ignite your passion for power systems and build valuable industry connections.\nLet’s bridge the gap between education and profession — one powerhouse at a time!\nCo-sponsored by: R60035 – Sacramento Valley Section\nAgenda:\nAgenda (Tentative): Folsom Powerhouse Visit\nDate: 10/04/2025\nTime: 2:00 PM – 5:00 PM\nLocation: Folsom Powerhouse State Historic Park\n—————————————————————\n🕑 2:00 PM – Check-In & Welcome\n– Registration & welcome table\n– Light refreshments served\n– Introduction by IEEE PES & YP representatives\n– Overview of visit goals and schedule\n🕝 2:30 PM – Guided Tour of Folsom Powerhouse\n– Discover the history of one of California’s earliest hydroelectric plants\n– Learn how electricity was generated and transmitted in the early 1900s\n– View original turbines\, generators\, and control equipment\n🕓 4:15 PM – Networking & Refreshments\n– Engage in meaningful conversations with professionals and fellow attendees\n– Enjoy provided refreshments and snacks\n– Group photos\n🕔 5:00 PM – Closing & Departure\n– Final remarks from IEEE organizers\n– Feedback & follow-up info shared\n– Event concludes\n9980 Greenback Ln\, Folsom\, California\, United States\, 95630
URL:https://svec.org/event/folsom-powerhouse-visit/
LOCATION:9980 Greenback Ln\, Folsom\, California\, United States\, 95630
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20251002T183000
DTEND;TZID=America/Los_Angeles:20251002T200000
DTSTAMP:20260404T135203
CREATED:20250830T103329Z
LAST-MODIFIED:20250830T103329Z
UID:77014-1759429800-1759435200@svec.org
SUMMARY:Custom Silicon Beyond GPUs—Scaling Intelligence into the AGI Age
DESCRIPTION:The race toward Artificial General Intelligence (AGI) is accelerating\, powered by ever-larger and more capable LLMs. But as these models scale\, we are hitting the physical limits of general-purpose GPUs. Memory access is now slower and more energy-hungry than computation itself. Power demands are straining datacenter infrastructure. And as models span more chips\, interconnect delays—not compute—become the bottleneck.\nThis talk explores how custom silicon—such as AWS Trainium\, Google TPU\, Cerebras WSE\, and Groq LPU—is designed to overcome these barriers.\nBy keeping memory closer to compute\, optimizing data movement\, and delivering higher efficiency per watt\, domain-specific accelerators are reshaping the hardware stack around the needs of LLMs.\nAttendees will gain a clear framework for understanding why this shift matters\, how it breaks past the Memory\, Power\, and Interconnect walls\, and what it means for building a more scalable\, cost-effective\, and energy-efficient foundation on the road to AGI.\nSpeaker(s): Asheesh Goja\,\nSanta Clara University\, Santa Clara\, California\, United States\, Virtual: https://events.vtools.ieee.org/m/498701
URL:https://svec.org/event/custom-silicon-beyond-gpus-scaling-intelligence-into-the-agi-age/
LOCATION:Santa Clara University\, Santa Clara\, California\, United States\, Virtual: https://events.vtools.ieee.org/m/498701
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20251001T170000
DTEND;TZID=America/Los_Angeles:20251001T193000
DTSTAMP:20260404T135203
CREATED:20250917T110353Z
LAST-MODIFIED:20250917T110353Z
UID:77116-1759338000-1759347000@svec.org
SUMMARY:Generative audio and its applications
DESCRIPTION:Join Dr. Ivan Tashev\, Partner Software Architect at Microsoft Research\, for an insightful session on "Generative Audio and Its Applications." Explore the cutting-edge role of audio in generative AI\, from enhancing emotional connections to enabling multimodal experiences. Dr. Tashev will delve into innovative AI systems that generate and synchronize audio across different modalities\, with real-world applications in fields like accessibility\, entertainment\, and beyond. This talk will feature key research from the Audio and Acoustics Research Group at Microsoft Research\, shedding light on how generative audio is transforming the way we interact with technology.\nTopic: Generative audio and its applications\nDescription:\nAudio—including sound and music—has the power to foster emotional connections and promote social bonding. As a vital human sense that complements vision\, it remains relatively underexplored in generative AI research. By positioning audio as a key social-emotional layer of AI\, we underscore its transformative potential in building more inspiring and context-aware systems.\nThis talk presents an overview of key approaches within the broader generative AI landscape\, with a focus on the role of audio. Audio-language models can generate captions\, labels\, or free-form text from audio signals\, enabling applications such as question answering. Moreover\, generating audio from prior audio inputs or from other modalities—such as text\, images\, or video—opens the door to compelling multimodal models and experiences. For instance\, AI systems can synchronize audio and video streams or produce coordinated audio-visual outputs.\nThe talk will be illustrated with research projects from the Audio and Acoustics Research Group at Microsoft Research.\nBiography:\nDr. Ivan Tashev is a Partner Software Architect in Microsoft Research (MSR)\, Redmond\, WA\, USA\, where he leads the Audio and Acoustics Research Group. His interests include multichannel signal processing and machine learning and artificial intelligence for signal processing. Ivan Tashev also coordinates the Brain-Computer Interfaces project in MSR. Dr. Tashev have published two books\, two book chapters\, 100+ scientific papers\, listed as inventor in 50 US patents. Ivan Tashev is affiliate professor in the Department for Electrical and Computer Engineering of University of Washington in Seattle\, USA\, and honorary professor at Technical University of Sofia\, Bulgaria. Technologies created by Dr. Tashev are incorporated in many Microsoft products\, he served as the audio architect for Kinect and for HoloLens. He is an IEEE Fellow\, member of AES and ASA. More details about him can be found in his web page https://www.microsoft.com/en-us/research/people/ivantash/.\n[]\nAgenda:\n5 PM – 5.30 PM	Networking and light snacks\n5.30 PM – 6.30 PM	Guest Talk by Distinguished Speaker Dr. Ivan Tashev\n6.30 PM – 7.00 PM	Networking and Wrap up\nRoom: 629\, Bldg:  Bannan\, 901 12th Ave\, Seattle\, Washington\, United States\, 98109-5210\, Virtual: https://events.vtools.ieee.org/m/497967
URL:https://svec.org/event/generative-audio-and-its-applications/
LOCATION:Room: 629\, Bldg:  Bannan\, 901 12th Ave\, Seattle\, Washington\, United States\, 98109-5210\, Virtual: https://events.vtools.ieee.org/m/497967
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20250925T113000
DTEND;TZID=America/Los_Angeles:20250925T131500
DTSTAMP:20260404T135203
CREATED:20250914T110318Z
LAST-MODIFIED:20250914T110318Z
UID:77101-1758799800-1758806100@svec.org
SUMMARY:Re-engineering the World with Self-Assembly
DESCRIPTION:Re-engineering the World with Self Assembly\n[]\nAbstract:\nNature has evolved to self-assemble complex functional architectures in a sustainable bottom-up way. From bacteria to humans\, biological systems arise from a common set of atomically precise nanoscale building blocks such as proteins that give rise to complex functions such as sensing\, computation\, and actuation.\nIn contrast\, most human-made devices are composed of building blocks with much less precision\, and are assembled through a top-down process which is highly inflexible and unsustainable. Drawbacks aside\, these devices are highly useful and can often surpass their biological counterparts (e.g.\, computers playing chess). This success is largely due to a systematic and modular engineering approach where simple but well-understood components such as transistors are put together in a programmable way. Is it possible to develop a new approach to building complex devices that combines the strengths of biomolecular self-assembly and systematic engineering?\nIn this talk I will discuss recent work towards this goal using DNA as a nanoscale\, programmable building block . However\, despite being the most programmable molecule for information processing\, DNA lacks the basic physical attributes required for building high performance electronic devices.\nI will discuss ongoing work towards a new type of nanoscale building blocks in which DNA can be flexibly replaced with other materials such as metals and semiconductors. These nanoscale modules can be designed to self-assemble into a variety of plasmonic\, photonic\, and electronic architectures unattainable with any current nanofabrication techniques. This novel approach integrates the advantages of natural bottom-up assembly and engineered top-down programming and may lead to a host of new intelligent devices for technology and medicine. Two specific devices we are currently developing in our lab are single photon sensors with spectral resolution and electronic sensors for multiplexed detection of large biological targets.\nReferences:\n1. G. Tikhomirov\, S. Hoogland\, P. Lee\, A. Fisher\, E.H. Sargent\, S.O. Kelley “DNA-Based Programming of Quantum Dot Valency\, Self-Assembly\, and Luminescence” Nature Nanotechnology\, 2011\, 485-490\n2. G. Tikhomirov\, P. Petersen\, L. Qian “Fractal assembly of micrometre-scale DNA origami arrays with arbitrary patterns” Nature\, 2017\, 67-71\n3. G. Tikhomirov\, P. Petersen\, L. Qian “Programmable disorder in random DNA tilings” Nature Nanotechnology\, 2017\, 251-259\n4. P. Petersen\, G. Tikhomirov\, L. Qian. “Information-based autonomous reconfiguration in systems of interacting DNA nanostructures” Nature Communications\, 2018\, 5362\n5. G. Tikhomirov\, P. Petersen\, L. Qian “Triangular DNA origami tilings” JACS\, 2018\, 17361recision manufacturing at the nanoscale faces a fundamental energy bottleneck: achieving the resolution needed for next-generation devices requires laser powers so high they severely limit throughput and scalability.\nSpeaker:\nGrigory Tikhomirov\nAssistant Professor\nDepartment of Electrical Engineering and Computer Sciences\nUC Berkeley\nGreg a has longstanding dream to build systems approaching the complexity of life\, motivated by the realization that incomprehensible natural complexity arises from comprehensible fundamental laws.\nGreg is interested both in understanding the principles required to build such systems as well as in building practical devices using these principles.\nAGENDA:\nThursday September 25\, 2025\n11:30 AM: Networking\, Pizza & Drinks\nNoon — 1 pm: Seminar\nPlease register on Eventbrite before 9:30 AM on Thursday September 25\, 2025\n$4 IEEE members $6 non IEEE members\n(discounts for unemployed and students )\nSee examplesAdd\nCo-sponsored by: 636940-Santa Clara Valley Section Chapter\,EMB18\nBldg: ==> Use corner entrance: Kifer Road / San Lucar Court ==> Do not enter at main entrance on Kifer Road\, EAG Labs\, 810 Kifer Road\, Sunnyvale\, California\, California\, United States\, 95051
URL:https://svec.org/event/re-engineering-the-world-with-self-assembly/
LOCATION:Bldg: ==> Use corner entrance: Kifer Road / San Lucar Court ==> Do not enter at main entrance on Kifer Road\, EAG Labs\, 810 Kifer Road\, Sunnyvale\, California\, California\, United States\, 95051
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20250924T185000
DTEND;TZID=America/Los_Angeles:20250924T200000
DTSTAMP:20260404T135203
CREATED:20250828T103309Z
LAST-MODIFIED:20250828T103309Z
UID:77006-1758739800-1758744000@svec.org
SUMMARY:3D Micro/Nanoprinted Soft Robots: From Super Mario Bros. to Endovascular Surgery
DESCRIPTION:During former President Barack Obama’s 2013 State of the Union Address\, he remarked on the potential for additive manufacturing—or colloquially\, “three-dimensional (3D) printing”—“to revolutionize the way we make almost everything.” Despite this potential\, progress has been impeded by broad challenges associated with 3D printing technologies at smaller length scales. Recent breakthroughs in 3D micro/nanoprinting\, however\, hold unique promise to overcome past barriers and enable new frontiers for fundamental and applied research. In this meeting\, Prof. Ryan D. Sochol will discuss how his Bioinspired Advanced Manufacturing (BAM) Laboratory is leveraging “Two-Photon Direct Laser Writing”—an additive manufacturing technique with printing resolutions down to the 100 nanometer range—for emerging biomedical applications\, including soft microrobotic surgical instruments for minimally invasive interventions.\nSpeaker(s): Ryan D. Sochol\, Ph.D\nAgenda:\n6:50 – 7 PM: Registration\n7-8 PM: Talk and Q&A\nVirtual: https://events.vtools.ieee.org/m/498436
URL:https://svec.org/event/3d-micro-nanoprinted-soft-robots-from-super-mario-bros-to-endovascular-surgery/
LOCATION:Virtual: https://events.vtools.ieee.org/m/498436
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20250923T190000
DTEND;TZID=America/Los_Angeles:20250923T200000
DTSTAMP:20260404T135203
CREATED:20250911T110412Z
LAST-MODIFIED:20250911T110412Z
UID:77076-1758654000-1758657600@svec.org
SUMMARY:Tech Talks: Managing Secrets at Scale & Natural Language Interaction Protocol
DESCRIPTION:The San Francisco Bay Area chapter of the IEEE Computer Society invites to our free and open Virtual Tech Talks (no IEEE membership required):\nFirst Speaker: Rakesh Keshava ((https://www.google.com/url?q=https://www.linkedin.com/in/rakeshkeshava/&sa=D&source=calendar&ust=1758000100316663&usg=AOvVaw0LIL5eCByYTRedaw9gSHS_))\nTitle: Managing Secrets at Scale in Traditional Enterprise\, Cloud\, and AI Systems\nAbstract: In modern architectures spanning enterprise data centers\, multi-cloud platforms\, and AI workloads\, secret management is both a security and engineering priority. This session examines patterns for securing API keys\, tokens\, and encryption keys at scale\, including automated rotation\, policy-driven access\, and zero-trust integration. We will discuss reference architectures and tooling choices that ensure secrets remain protected without slowing down development or deployment velocity.\nBio: Rakesh Keshava is a Senior Member of IEEE and a Software Architect\, Security at Okta Inc.\, specializing in identity\, access management\, cryptography\, and AI-driven security solutions. He has over 17 years of experience designing and delivering secure cloud architectures for global enterprises. Rakesh is the named inventor on three U.S. patents\, cited more than 200 times by major technology companies\, with innovations spanning identity-centric encryption\, automated key lifecycle management\, and scalable policy enforcement frameworks. He actively contributes to scholarly work as a reviewer for Elsevier journals and IEEE conferences\, and participates in technical program committees worldwide. Rakesh mentors professionals in the security community and collaborates on initiatives aimed at advancing cybersecurity practices. His current interests include post-quantum cryptography\, AI-enhanced identity systems\, and the integration of advanced security models into modern cloud-native environments. Driven by innovation and a commitment to secure digital ecosystems\, he continues to shape solutions that address emerging security challenges.\nSecond Speaker: Ranjan Sinha ((https://www.google.com/url?q=https://www.linkedin.com/in/sinharanjan/&sa=D&source=calendar&ust=1758000100316663&usg=AOvVaw0lQ8IZgmX3Sgs6g2EVdvKp))\nTitle: Natural Language Interaction Protocol: A Universal Application-Level Protocol for the Age of Generative AI\nAbstract: The advent of Large Language Models (LLMs) has made an interactive natural language interaction feasible between machines in a manner that did not exist before. An implication is that a natural language interface can replace many mobile applications that are used today. Just like the advent of the browser in 1990s simplified technology by replacing a plethora of client-side applications with a single standard application\, a common natural language interaction protocol can potentially replace the plethora of mobile applications that exists today\, providing a universal application layer protocol. Convergence to a universal application layer protocol would bring significant benefits to all segments of society – consumers can use a single application for various interactions\, businesses will have a simpler maintenance burden for their IT infrastructure\, and integration among different businesses can be streamlined.\nBio: Ranjan Sinha is an IBM Fellow and CTO for watsonx in IBM Research AI. He works at the intersection of Technology\, Research\, Product\, and Enterprise-scale use cases in AI. He is involved in cutting-edge initiatives in Data and AI and is on the front lines of transforming IBM itself into an AI Enterprise by infusing AI into real-world applications and helping IBM's clients navigate their data and AI journeys. From 2016–2023\, he built IBM’s Cognitive Enterprise Data Platform\, the backbone of IBM’s AI-driven transformation. He is passionate about promoting wellness\, safety and empowerment of vulnerable groups\, and an advocate for social and global issues.\nSpeaker(s): Rakesh Keshava\, Ranjan Sinha\nVirtual: https://events.vtools.ieee.org/m/500300
URL:https://svec.org/event/tech-talks-managing-secrets-at-scale-natural-language-interaction-protocol/
LOCATION:Virtual: https://events.vtools.ieee.org/m/500300
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/New_York:20250923T140000
DTEND;TZID=America/New_York:20250923T163000
DTSTAMP:20260404T135203
CREATED:20250513T022222Z
LAST-MODIFIED:20250513T022222Z
UID:70104-1758636000-1758645000@svec.org
SUMMARY:AUTONOMOUS DRIVING WITH ELECTRIC VEHICLES
DESCRIPTION:we are working on details for this amazing meeting. Meeting relocated to Sep 23rd 2025 from Apr 23rd 2025.\nDetails will come soon.\nBest regards\nNASHUA\, New Hampshire\, United States\, 03062\, Virtual: https://events.vtools.ieee.org/m/467311
URL:https://svec.org/event/autonomous-driving-with-electric-vehicles/
LOCATION:NASHUA\, New Hampshire\, United States\, 03062\, Virtual: https://events.vtools.ieee.org/m/467311
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=-07:00:20250922T190000
DTEND;TZID=-07:00:20250922T210000
DTSTAMP:20260404T135203
CREATED:20250809T190327Z
LAST-MODIFIED:20250809T190327Z
UID:76863-1758567600-1758574800@svec.org
SUMMARY:Deploying & Scaling LLM in the Enterprise: Architecting Mult-agent AI Systems
DESCRIPTION:*Deploying and Scaling Large Language Models in the Enterprise: Architecting Multi-Agent AI Systems Integrating Vision\, Data\, and Responsible AI* \nLOCATION ADDRESS (Hybrid\, in person or by zoom\, you choose)\nValley Research Park\n319 North Bernardo Avenue\nMountain View\, CA CA 93043\nIf you want to join remotely\, you can submit questions via Zoom Q&A. The zoom link:\nhttps://acm-org.zoom.us/\nJoin via YouTube:\nhttps://youtube.com/live/ \nAGENDA\n6:30 Door opens\, food and networking (we invite honor system contributions)\n**7:00** SFBayACM upcoming events\, introduce the speaker\n7:15 speaker presentation starts\n8:15 – 8:30 finish\, depending on Q&A \nJoin SF Bay ACM Chapter for an insightful discussion on: \n**Abstract:**\nLarge Language Models (LLMs) are rapidly reshaping enterprise AI\, but real-world deployments demand far more than fine-tuning and API calls. They require sophisticated architectures capable of scaling inference\, integrating multi-modal data streams\, and enforcing responsible AI practices—all under the constraints of enterprise SLAs and cost considerations.\nIn this session\, I’ll deliver a deep technical dive into architecting multi-agent AI systems that combine LLMs with computer vision and structured data pipelines. We’ll explore: \n* **Multi-Agent System Design:** Architectural patterns for decomposing enterprise workflows into specialized LLM-driven agents\, including communication protocols\, context sharing\, and state management.\n* **Vision-Language Integration:** Engineering methods to fuse embeddings from computer vision models with LLM token streams for tasks such as visual question answering\, document understanding\, and real-time decision support.\n* **Optimization for GPU Inference:** Detailed strategies for memory optimization\, quantization\, mixed-precision computation\, and batching to achieve high throughput and low latency in LLM deployment on modern GPU hardware (e.g.\, NVIDIA A100/H100).\n* **Observability and Responsible AI:** Techniques for building observability layers into LLM pipelines—capturing token-level traces\, detecting drift\, logging model confidence—and implementing fairness audits and risk mitigation protocols at runtime. \nDrawing on practical examples from large-scale enterprise deployments across retail\, healthcare\, and finance\, I’ll discuss the engineering trade-offs\, tooling stacks\, and lessons learned in translating research-grade LLMs into production-grade systems.\nThis talk is designed for AI engineers and researchers eager to understand the technical complexities—and solutions—behind scaling multi-modal\, responsible AI systems that deliver real business value. \n**Speaker Bio:**\n**Dhanashree** is a Senior Machine Learning Engineer and AI Researcher with over a decade of experience designing and deploying advanced AI systems at scale. Her expertise spans architecting multi-agent solutions that integrate Large Language Models (LLMs)\, computer vision pipelines\, and structured data to solve complex enterprise challenges across industries including retail\, healthcare\, and finance.\nAt Albertsons\, Deloitte\, and Fractal\, Dhanashree has led the development of production-grade AI applications\, focusing on optimization\, model observability\, and responsible AI practices. Her work includes designing scalable inference architectures for LLMs on modern GPU infrastructures\, building hybrid pipelines that fuse vision and language models\, and engineering systems that balance performance with ethical and regulatory considerations. \nShe actively collaborates with research institutions like the University of Illinois. Dhanashree actively engages with the research community and frequently speaks on bridging advanced AI research and production systems.\n[https://www.linkedin.com/in/karanluniya](https://www.linkedin.com/in/karanluniya) \n— \nValley Research Park is a coworking research campus of 104\,000 square feet hosting 60+ life science and technology companies. VRP has over 100 dry labs\, wet labs\, and high power labs sized from 125-15\,000 square feet. VRP manages all of the traditional office elements: break rooms\, conference rooms\, outdoor dining spaces\, and recreational spaces. \nAs a plug-and-play lab space\, once companies have secured their next milestone and are ready to expand\, VRP has 100+ labs ready to expand into.\nhttps://www.valleyresearchpark.com/
URL:https://svec.org/event/deploying-scaling-llm-in-the-enterprise-architecting-mult-agent-ai-systems/
LOCATION:Valley Research Park\, 319 N Bernardo Ave\, Mountain View\, CA\, 94043\, United States
ATTACH;FMTTYPE=image/jpeg:https://svec.org/wp-content/uploads/2025/08/1024x576-pElGtp.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20250919T080000
DTEND;TZID=America/Los_Angeles:20250919T170000
DTSTAMP:20260404T135203
CREATED:20250618T053313Z
LAST-MODIFIED:20250618T053313Z
UID:75967-1758268800-1758301200@svec.org
SUMMARY:REIMAGINING THE FUTURE OF THE ELECTRIC GRID
DESCRIPTION:SAVE THE DATE:\nThe Santa Clara University School of Engineering invites you to a full day of presentations from experts in academia and industry on the future of the electric grid.\n·\n·\nCo-sponsored by: Santa Clara University\nAgenda:\nRoom: SCDI 1302/1308\, Bldg: Sobrato Campus for Discovery and Innovation (SCDI)\, 500 El Camino Real\, Santa Clara\, California\, United States\, 95053
URL:https://svec.org/event/reimagining-the-future-of-the-electric-grid/
LOCATION:Room: SCDI 1302/1308\, Bldg: Sobrato Campus for Discovery and Innovation (SCDI)\, 500 El Camino Real\, Santa Clara\, California\, United States\, 95053
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20250918T173000
DTEND;TZID=America/Los_Angeles:20250918T203000
DTSTAMP:20260404T135203
CREATED:20250514T023343Z
LAST-MODIFIED:20250514T023343Z
UID:70119-1758216600-1758227400@svec.org
SUMMARY:Developing a Vehicle-to-Grid Strategy: Standards\, Charging Considerations & More
DESCRIPTION:The idea that your car can do more than get you from point A to point B is still a novel concept. The fact that EV charge management can strengthen grid resilience through as well as fortify the economic and societal benefits are undeniable. Charging as well as discharging EVs\, also known as vehicle-to-grid (V2G) unlocks a range of benefits for drivers\, utilities\, as well as the broader community.\nThis presentation will discuss:\n– Strategy for V2G\n– Trends in the bidirectional EV charging space\n– Integrations and interfaces with programs and providing grid support\n– Regulatory and market considerations\nSpeaker(s): Frances Bell\,\nAgenda:\nNo-host social at 5:30pm\nPresentation at 6:00pm\nDinner at 7:00pm\nPresentation continues at 7:45pm\nAdjourn by 8:30pm\nZio Fraedo’s\, 611 Gregory Lane\, Pleasant Hill\, California\, United States\, 94523
URL:https://svec.org/event/developing-a-vehicle-to-grid-strategy-standards-charging-considerations-more/
LOCATION:Zio Fraedo’s\, 611 Gregory Lane\, Pleasant Hill\, California\, United States\, 94523
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20250918T120000
DTEND;TZID=America/Los_Angeles:20250918T130000
DTSTAMP:20260404T135203
CREATED:20250417T020327Z
LAST-MODIFIED:20250417T020327Z
UID:68682-1758196800-1758200400@svec.org
SUMMARY:Digital Twins for Printed Electronics for 3D Packaging\, High-performance Sensors\, and High-capacity Batteries
DESCRIPTION:[]Printed electronics has emerged as a versatile technique for on-demand fabrication of passives\, interconnects\, and active devices. Our group has recently extended this technique to create freeform devices in Three-Dimensional space that have opened exciting application areas for this technology. The manufacturing process for printed electronics\, however\, can suffer from process drifts and does not have an active feedback loop to fix errors. In this research\, we develop a digital twin for aerosol jet 3D printing\, a jetting-based method to create printed electronics to address this concern. This work\, done in collaboration with an ECE faculty at CMU\, matches observations with outcomes expected from a physics-based process model\, and continuously updates the hidden variables to minimize this error via probabilistic estimation techniques.\nWe then use the aerosol jet 3D printing to demonstrate devices with extraordinary performances that cannot be achieved by any other method. Specifically\, we show 3D electrodes by this technique that enable detection of pathogens and breast cancer biomarkers in 10-12 seconds at femtomolar levels (fastest detection yet reported). We also show fully customizable brain-computer interfaces (BCIs) that record electrical signals between neurons at densities of thousands of electrodes/cm2\, which is 5-10× the current state-of-the-art technologies. We also demonstrated the printing of high-capacity Li-ion batteries and thin flexible robotic skins with embedded sensors.\nSpeaker(s): Rahul Panat\,\nVirtual: https://events.vtools.ieee.org/m/481231
URL:https://svec.org/event/digital-twins-for-printed-electronics-for-3d-packaging-high-performance-sensors-and-high-capacity-batteries/
LOCATION:Virtual: https://events.vtools.ieee.org/m/481231
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=-07:00:20250917T190000
DTEND;TZID=-07:00:20250917T210000
DTSTAMP:20260404T135203
CREATED:20250817T195044Z
LAST-MODIFIED:20250817T195044Z
UID:76899-1758135600-1758142800@svec.org
SUMMARY:From Collision to Discovery: Machine Learning at the Large Hadron Collider
DESCRIPTION:How do we solve the universe’s biggest secrets? At the [Large Hadron Collider (LHC)](https://home.cern/science/accelerators/large-hadron-collider) – a 27-kilometer ring beneath the French-Swiss border – protons collide at nearly the speed of light\, recreating conditions like just after the Big Bang. These collisions have led to groundbreaking insights\, including the discovery of the [Higgs boson](https://home.cern/science/physics/higgs-boson) in 2012\, yet the greatest mysteries remain: what is the nature of dark matter and dark energy\, which make up 95% of the universe’s energy but have never been observed directly. \nHunting for these elusive phenomena requires extraordinary algorithms and data analysis. The detectors at the LHC have access to data at an incredible rate of 60 terabytes per second – a perfect challenge for fast\, high‑precision data analysis and machine learning (ML). In this talk\, we’ll explore how ML powers countless stages of the scientific process: from real‑time event selection and particle reconstruction to the data analyses that lead to published discoveries. \nJoin us for a virtual visit to the LHC\, where scientists push the limits of data and algorithms to shed light on the 95% of the universe that still lies in the dark. \n— \nDennis Noll is a postdoctoral researcher in physics at Stanford University. As a member of Prof. Nachman’s research group\, he uses the latest and most advanced computing techniques to tackle some of the most significant challenges in Particle Physics. Dennis’s research focuses on the development and implementation of smart\, fast\, and reproducible physics analyses\, leveraging machine learning\, high performance computing\, and graph-based computing workflows. He is an expert in Higgs boson research and is pioneering AI-driven methodologies to detect anomalies within the extensive datasets generated by the Large Hadron Collider (LHC) at CERN. Outside of his research\, Dennis fosters collaboration and inclusion in the local postdoc community and optimizes his coffee consumption using Bayesian optimization.
URL:https://svec.org/event/from-collision-to-discovery-machine-learning-at-the-large-hadron-collider/
LOCATION:Valley Research Park\, 319 N Bernardo Ave\, Mountain View\, CA\, 94043\, United States
ATTACH;FMTTYPE=image/jpeg:https://svec.org/wp-content/uploads/2025/08/1024x576-iM2Tqo.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20250917T190000
DTEND;TZID=America/Los_Angeles:20250917T203000
DTSTAMP:20260404T135203
CREATED:20250804T094811Z
LAST-MODIFIED:20250804T094811Z
UID:76820-1758135600-1758141000@svec.org
SUMMARY:It’s a Bit More Than Warming
DESCRIPTION:Abstract:\n2015: A Solution\, Difficult\, But Feasible…\nhttps://tinyurl.com/yafgmlmd\n2025 – No More Time\nMethane releases from natural sinks like tundra\, are larger than our well leakages. This is now in positive feedback (releases breed more releases) independent of us. Siberian and US/Canadian tundra\, for instance\, are releasing CH4 at accelerating rates partly due to our past CO2 emissions. What we must know to prevent oceanic extinctions\, especially of O2 producers & CO2 sequesters\, on track to occur by 2050.\nSpeaker(s): Alex\,\nAgenda:\nThis is a virtual presentation via zoom.\nIt will be followed with a Q-A.\nVirtual: https://events.vtools.ieee.org/m/495528
URL:https://svec.org/event/its-a-bit-more-than-warming/
LOCATION:Virtual: https://events.vtools.ieee.org/m/495528
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20250917T183000
DTEND;TZID=America/Los_Angeles:20250917T200000
DTSTAMP:20260404T135203
CREATED:20250906T104903Z
LAST-MODIFIED:20250906T104903Z
UID:77058-1758133800-1758139200@svec.org
SUMMARY:Test-and-Measurement Signal Generators: Current Status and Future Trends
DESCRIPTION:The signal generator is a key instrument of virtually any RF/microwave system . It generates a stimulus signal on the transmitter side or is used as a local oscillator in a variety of up- and down-conversion schemes. Signal generators are also one of the fastest growing segments in the test-and-measurement market with an annual growth rate of about 7% . Demand is driven by the wireless communications\, aerospace and defense\, and automotive industries as well as by new technologies such as 6G . The principal driver behind the 6G technology is the ever-increasing need for more capacity and higher data rates in wireless networks. Due to the heavy use of existing frequency bands\, there is a strong interest to use higher frequencies to enable more bandwidth. This is generating the interest to move to beyond 100 GHz carrier frequencies and to the Terahertz domain. Aside from the frequency coverage\, phase noise remains one of the most critical parameters that impose the ultimate limit in the system’s ability to resolve signals of small amplitude. Furthermore\, today the industry demands more complex waveforms to transmit more information over available frequency bands.\nSignal Generator characteristics depend heavily on particular architectures that can be classified into a few main groups\, namely direct analog\, direct digital\, and indirect schemes . As of today\, traditional indirect phase-lock-loop (PLL) architectures still dominate. On the other hand\, direct analog synthesis is the most advanced approach that demonstrates extremely fast switching speed and low phase noise. Future developments\, however\, are associated with direct digital synthesis (DDS) due to the rapid progress in solid-state technologies. The extension of usable DDS bandwidth to several tens of gigahertz with its spurious content reduction is expected. Arbitrary waveform generators (AWG) are utilized to generate more complex waveforms. Similar to DDS technologies\, the extension of AWG usable bandwidth is expected. Such complex signals can be further up-converted to millimeter-wave and sub-THz frequencies targeting future communications systems such as 6G. Current architectures\, new market trends and future solutions are going to be discussed.\nSpeaker(s): Alexander Chenakin\,\nVirtual: https://events.vtools.ieee.org/m/499679
URL:https://svec.org/event/test-and-measurement-signal-generators-current-status-and-future-trends/
LOCATION:Virtual: https://events.vtools.ieee.org/m/499679
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=US/Pacific:20250917T180000
DTEND;TZID=US/Pacific:20250917T190000
DTSTAMP:20260404T135203
CREATED:20250729T094857Z
LAST-MODIFIED:20250729T094857Z
UID:76781-1758132000-1758135600@svec.org
SUMMARY:Panel discussion - From Prompt to Production: Operationalizing Agentic LLM Systems
DESCRIPTION:Free Registration (with a Zoom account; you can get one for free if you don't already have it. This requirement is to avoid Zoom bombing. Please sign in using the email address tied to your Zoom account — not necessarily the one you used to register for the event.):\nhttps://sjsu.zoom.us/meeting/register/i6n2sgjLQFelwXCNz4-YGQ\nSynopsis:\nAs large language models (LLMs) evolve from static\, prompt-based tools into autonomous\, agentic systems capable of reasoning\, planning\, and acting with minimal human oversight\, organizations face an exciting yet complex frontier. These advanced systems hold the potential to revolutionize enterprise workflows\, developer tools\, and customer-facing applications—but realizing that potential requires navigating a host of technical and ethical challenges.\nThis panel brings together leading voices from AI research\, infrastructure engineering\, and real-world application domains to discuss how agentic LLM systems are moving from lab experiments to production-grade deployments. Panelists will explore critical topics such as orchestration\, safety\, observability\, and evaluation\, while offering hard-earned lessons from deploying these systems at scale.\nWhether you're building tools for developers\, integrating LLM agents into enterprise pipelines\, or shaping the next wave of intelligent products\, this discussion will equip you with the strategic and technical know-how to bring agentic AI into impactful\, everyday use. Don’t miss this opportunity to learn what it truly takes to operationalize the future of AI.\n—————————————————————\nBy registering for this event\, you agree that IEEE and the organizers are not liable to you for any loss\, damage\, injury\, or any incidental\, indirect\, special\, consequential\, or economic loss or damage (including loss of opportunity\, exemplary or punitive damages). The event will be recorded and will be made available for public viewing.\nSpeaker(s): Yubin Kim\, Gautam Solaimalai\, Shaleen Kumar Gupta\, Vishal Jain\, Rahul Raja\, Harsh Varshney\nVirtual: https://events.vtools.ieee.org/m/494702
URL:https://svec.org/event/panel-discussion-from-prompt-to-production-operationalizing-agentic-llm-systems/
LOCATION:Virtual: https://events.vtools.ieee.org/m/494702
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20250916T090000
DTEND;TZID=America/Los_Angeles:20250917T170000
DTSTAMP:20260404T135203
CREATED:20250828T103309Z
LAST-MODIFIED:20250828T103309Z
UID:77004-1758013200-1758128400@svec.org
SUMMARY:Special $25 IEEE member registration fees (a $935 value) for attending Wearable Technologies Conference USA at the Computer History Museum on September 16 - 17
DESCRIPTION:Hosted by IEEE SFBA CTSoC and EMBS Chapters\nWe’re thrilled to invite you to the Wearable Technologies Conference 2025 USA\, happening September 16–17 at the iconic Computer History Museum in Mountain View\, CA.\nEvent: (https://wearable-technologies.com/events/wt-wearable-technologies-conference-2025-usa)\nLocation: Computer History Museum\, Mountain View\, CA\nAgenda: (https://wearable-technologies.com/e-agenda/wt-conference-us-2025—agenda)\nIEEE Member Discounted Ticket price: Just $25! (Regular: $935)\nTo get the discounted price\, in the ticket store: https://store.wearable-technologies.com/product-selection.html?e=WTUS_25 (valid for both conference days and the evening reception). Select "Are you an IEEE member?"\, fill out your name\, email and IEEE membership number. A special IEEE discount code will be email to you.\n(Thanks to joint sponsorship from SFBA CTSoc & EMBS\, to make this incredible discount possible)\nFeatured Speakers Include:\n– Daniel Kraft\, M.D. – Founder\, NextMed Health & Digital Health\n– Angela McIntyre – Executive Director\, Stanford eWEAR\n– Walter Greenleaf\, PhD – Neuroscientist & Medical Technology Developer\, Stanford University\n– Adrian Condon – CTO\, B-Secur\n– Alen Juginovic – Postdoctoral Researcher\, Harvard Medical School\n– Catherine Liao – Chief Strategy Officer\, Cardiex\n– Pieris Berreitter – Director of Engineering\, HP\n– John Rootenberg – Principal Director\, Digital Safety & Decision Support\, Genentech/Roche\nExpect a stellar lineup of speakers\, engaging sessions\, and excellent networking opportunities. Special thanks to our dedicated officers for their outreach and efforts in securing this opportunity—please take full advantage!\nWhy Attend?\nConnect – Network with top innovators\, researchers\, and industry leaders across the wearable tech ecosystem.\nLearn – Gain cutting-edge insights from global experts on topics like digital health\, AI in wearables\, smart patches\, and longevity tech.\nDiscover – Explore the latest breakthroughs in wearable technology—from biosensors to AI-powered devices—through live demos and exhibits.\nGrow – Leverage the WT platform for unique business development opportunities and lead generation.\nBe Seen – Engage with international media and elevate your brand visibility in the global wearable tech space.\nDon't miss this opportunity to engage with the future of wearable tech!\nBest regards\,\nIEEE SFBA CTSoc and EMBS Chapters\nCo-sponsored by: Wearable Technologies Conference\nAgenda:\nAgenda: (https://wearable-technologies.com/e-agenda/wt-conference-us-2025—agenda)\n1401 N Shoreline Blvd.\,\, Mountain View\, California\, United States\, 94043
URL:https://svec.org/event/special-25-ieee-member-registration-fees-a-935-value-for-attending-wearable-technologies-conference-usa-at-the-computer-history-museum-on-september-16-17/
LOCATION:1401 N Shoreline Blvd.\,\, Mountain View\, California\, United States\, 94043
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20250913T100000
DTEND;TZID=America/Los_Angeles:20250913T110000
DTSTAMP:20260404T135203
CREATED:20250825T101822Z
LAST-MODIFIED:20250825T101822Z
UID:76992-1757757600-1757761200@svec.org
SUMMARY:Join Us for the Launch of IEEE WIE SF's Exciting New Affinity Group!
DESCRIPTION:Join Us for the Launch of IEEE WIE SF's Exciting New Affinity Group!\nDear IEEE Women in Engineering San Francisco Members\,\nWe are thrilled to invite you to the launch for our brand-new affinity group – IEEE WIE SF chapter! This is a momentous occasion as we expand our community and create new opportunities for professional growth\, networking\, and collaboration.\nEvent Details\nWhat: IEEE WIE SF Chapter Launch\nWhen: Saturday\, September 13 · 10:00 – 11:00am PST\nWhere: WIE SF Chapter Launch\nGoogle Meet joining info\nVideo call link: https://meet.google.com/iot-sxqt-wdp\nOr dial: ‪(US) +1 336-914-1177‬ PIN: ‪859 461 984‬#\nMore phone numbers: https://tel.meet/iot-sxqt-wdp?pin=5371246670807\nWho: All IEEE WIE SF chapter members are welcome!\nWhat to Expect :\n–\n– Welcome and introductions from Chair Sneha Vasudevan and Vice-Chair Ammara Ghani\n– Member introductions and networking session\n– Collaborative discussion to share experiences and professional backgrounds\n– Overview of the chapter's vision and goals for the upcoming year\nWhy Join?\nThis new affinity group represents an exciting opportunity to:\n– Connect with like-minded women engineers in the SF area\n– Access specialized professional development resources\n– Participate in targeted networking events and workshops\n– Contribute to shaping the future of women in engineering locally\n– Build lasting professional relationships and mentorship opportunities\nWe can't wait to see you there and begin this exciting new chapter together! Your participation and enthusiasm will be instrumental in making this affinity group a tremendous success.\nFor questions or additional information\, please contact:\nSneha Vasudevan\, Chair\, IEEE WIE SF Chapter at snehav@ieee.org.\nLet's come together to strengthen our WIE community and empower the next generation of women engineers!\nAgenda:\nAgenda for the 1 hour launch event :\n–\n– Welcome and introductions from Chair Sneha Vasudevan and Vice-Chair Ammara Ghani\n– Member introductions and networking session\n– Collaborative discussion to share experiences and professional backgrounds\n– Overview of the chapter's vision and goals for the upcoming year\nVirtual: https://events.vtools.ieee.org/m/498076
URL:https://svec.org/event/join-us-for-the-launch-of-ieee-wie-sfs-exciting-new-affinity-group/
LOCATION:Virtual: https://events.vtools.ieee.org/m/498076
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20250911T183000
DTEND;TZID=America/Los_Angeles:20250911T200000
DTSTAMP:20260404T135203
CREATED:20250701T084928Z
LAST-MODIFIED:20250701T084928Z
UID:76704-1757615400-1757620800@svec.org
SUMMARY:Tape Roadmap and Challenges with using new High Areal Density Tapes
DESCRIPTION:As the LTO tape roadmap advances toward significantly higher capacities\, the industry is undergoing a paradigm shift in how those gains are achieved. Traditionally\, increased capacity came from expanding tape length and increasing linear bit and track densities together\, enabled by larger recorded bits on thicker media. However\, beginning with LTO-8\, the focus has shifted to higher track densities and thinner\, longer tape substrates—a transformation that brings both opportunity and complexity.\nThis transition introduces a new set of engineering and operational challenges. With thinner media and smaller recorded bit dimensions\, the number of wraps and head passes per full volume increases significantly. As a result\, tape systems are becoming more sensitive to environmental conditions\, including temperature\, humidity\, and airborne debris. These changes mainly due to smaller bit dimensions place added pressure on Tape Dimensional Stability (TDS) control mechanisms and contribute to elevated Tape Alerts and Drive Errors\, especially in real-world usage scenarios.\nInnovations in LTO-10\, such as the tilted head and servo format architecture (the Pisa head) and new cleaning mechanisms\, represent a major leap in addressing these challenges. This new format allows precise compensation for tape dimensional changes\, improving tape-to-head alignment. However\, such innovations are just one part of the broader strategy needed to ensure reliable tape performance at scale.\nIn parallel\, modern data architectures are redefining tape’s role. Tapes are no longer just archival media stored offsite for disaster recovery. In today’s tiered storage ecosystems\, data on tape must be randomly accessible\, highly durable\, and maintain multi-9s reliability over lifespans exceeding ten years. This shift requires that tapes perform reliably not just at write time\, but throughout their lifecycle as active data assets.\nTo meet these demands\, the industry must adopt:\n– Advanced host-level tape and drive management algorithms\n– Researching and implementing ML based algorithms for Real world tape Alerts and errors and estimating data durability and availability\n– Integration of erasure coding\, redundancy models with new RAIL based Library architectures\nThis presentation will focus into the magnetic data tape technological innovations\, real-world tape alerts and errors\, and architectural changes shaping the next generation of tape storage. Emphasis will be placed on understanding the interplay between environmental variables and system performance\, and how innovation at system and Library level is essential to ensuring long-term reliability in this new era of high-capacity tape systems.\nSpeaker(s): Turguy\,\nAgenda:\n6:30 – 7:00	Socializing and Networking at Quadrant\n6:55	Zoom session will be online with Waiting Room\n7:00 – 7:45	Lecture begins\, online and in person\n7:45 – 8:00	Questions and Answers\n1120 Ringwood Ct\, San Jose\, California\, United States\, 95131\, Virtual: https://events.vtools.ieee.org/m/491103
URL:https://svec.org/event/tape-roadmap-and-challenges-with-using-new-high-areal-density-tapes/
LOCATION:1120 Ringwood Ct\, San Jose\, California\, United States\, 95131\, Virtual: https://events.vtools.ieee.org/m/491103
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20250911T173000
DTEND;TZID=America/Los_Angeles:20250911T183000
DTSTAMP:20260404T135203
CREATED:20250828T103308Z
LAST-MODIFIED:20250828T103308Z
UID:77002-1757611800-1757615400@svec.org
SUMMARY:Oregon ComSoc: The Next Leap in Wireless: Inside the Evolution from Wi-Fi 7 to 8
DESCRIPTION:[]\nAbstract:\nThe arrival of Wi-Fi 7 in early 2024\, based on IEEE 802.11be\, marks a paradigm shift in wireless networking—moving from single-link connections toward collaborative multi-link operation\, enabling greater capacity and lower latency. With multi-link operation\, Wi-Fi 7 can achieve a maximum throughput of 30 Gbps.\nWhile this peak throughput supports most existing applications\, it falls short of meeting the strict reliability demands of emerging use cases such as the metaverse\, augmented and virtual reality\, robotics\, and industrial automation. These challenges are driving the development of the next generation—Wi-Fi 8.\nTo address these needs\, the IEEE 802.11 Task Group bn has been established to define Ultra High Reliability (UHR) PHY and MAC layers. Their goal is to improve WLAN reliability\, reduce latency\, enhance manageability\, and increase throughput across varying signal-to-noise ratios (SNRs).\nIn this talk\, we will identify and describe the key PHY and MAC elements that will shape Wi-Fi 8\, which will operate in the 2.4 GHz\, 5 GHz\, and 6 GHz bands. We will also discuss the enabling mechanisms under design and present performance results where appropriate.\nBio:\nDr. Cheng Chen is a Senior Staff Wireless Standards Engineer at Intel Corporation. He leads Intel's standardization efforts on Wi-Fi sensing (802.11bf) and integrated millimeter wave (802.11bq) within the IEEE 802.11 Working Group\, as well as Intel's Wi-Fi certification programs within the Wi-Fi Alliance. He currently serves as Editor for the IEEE 802.11bq Task Group\, Technical Editor for the Wi-Fi 7 Technical Task Group\, and Vice Chair of the Wi-Fi Sensing Task Group in the Wi-Fi Alliance. He previously served as Technical Editor for the Wi-Fi 6 Technical Task Group (July 2021–June 2022).\nDr. Chen is a Senior Member of the IEEE and an IEEE ComSoc Distinguished Lecturer for the 2025–2026 term. He is an active contributor and voting member of multiple IEEE 802.11 standards\, including 802.11ay (Next-generation 60 GHz Wi-Fi)\, 802.11be (Extremely High Throughput)\, 802.11bf (WLAN Sensing)\, 802.11bn (Ultra High Reliability)\, and 802.11bq (Integrated Millimeter Wave). He also contributes to several Wi-Fi Alliance certification programs\, including Wi-Fi 6\, Wi-Fi 6E\, Wi-Fi 7\, and Wi-Fi sensing.\nIn recognition of his outstanding contributions across standards forums\, Dr. Chen has received multiple awards\, including the IEEE Standards Association Award for Outstanding Contributions to IEEE 802.11ay and the Wi-Fi Alliance Leadership Recognition Award for the Wi-Fi 6 launch.\nDr. Chen earned his B.E. degree in Electronics and Information Engineering from Huazhong University of Science and Technology\, Wuhan\, China\, in 2011\, and his M.S. and Ph.D. degrees in Electrical Engineering from Northwestern University\, Evanston\, IL\, in 2013 and 2016\, respectively.\nCo-sponsored by: Pradeep Kumar\nVirtual: https://events.vtools.ieee.org/m/497970
URL:https://svec.org/event/oregon-comsoc-the-next-leap-in-wireless-inside-the-evolution-from-wi-fi-7-to-8/
LOCATION:Virtual: https://events.vtools.ieee.org/m/497970
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=-07:00:20250911T130000
DTEND;TZID=-07:00:20250911T150000
DTSTAMP:20260404T135203
CREATED:20250811T191833Z
LAST-MODIFIED:20250811T191833Z
UID:76871-1757595600-1757602800@svec.org
SUMMARY:Coding's Evolving Future
DESCRIPTION:**[RSVP here – https://rsvp.withgoogle.com/events/coding-s-evolving-future-with-ronald-petty](https://rsvp.withgoogle.com/events/coding-s-evolving-future-with-ronald-petty)** \nCoding has revolutionized our world. From Ada Lovelace’s early ideas in the 1800s to today’s sophisticated\, automated code\, we’ve witnessed an extraordinary transformation. \nWe’ve moved from painstakingly writing every instruction to simply telling computers what we want them to achieve. \nBut as our tech gets smarter\, it’s worth asking: What are we gaining\, and what might we be losing in this rapid evolution? \nJoin tech consultant Ronald Petty as we explore how our relationship with code and machines has changed through history. We’ll delve into technology’s expanding accessibility\, the shifting landscape of creativity\, and what it truly means to be a coder when powerful tools can write software for anyone. \nIn this engaging session we’ll cover: \n* **The evolution of coding tools:** From early punch cards to intuitive drag-and-drop interfaces and advanced automation helpers.\n* **Participation in the evolution:** Who gets to join the tech world and why it still matters that everyone has an opportunity.\n* **The shifting meaning of code:** How coding has transitioned from corporate control to today’s open\, community-led projects.\n* **Influences on innovation:** The impact of regulations\, education\, and business trends on how and why we code.\n* **Live demos and surprising stories:** Discover why coding has always been more human than we think.
URL:https://svec.org/event/codings-evolving-future/
LOCATION:Google Visitor Experience\, Google Visitor Experience 2000 N Shoreline Blvd US\,\, Mountain View\, CA\, 94043\, United States
ATTACH;FMTTYPE=image/jpeg:https://svec.org/wp-content/uploads/2025/08/1024x576-dYaLsA.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20250910T090000
DTEND;TZID=America/Los_Angeles:20250912T170000
DTSTAMP:20260404T135203
CREATED:20250731T095141Z
LAST-MODIFIED:20250731T095141Z
UID:76796-1757494800-1757696400@svec.org
SUMMARY:IEEE International Symposium on Technology and Society (ISTAS25)
DESCRIPTION:The IEEE International Symposium on Technology and Society (ISTAS) is the flagship conference of the IEEE’s Society on Social Implications of Technology (SSIT).\nISTAS is a multi/inter/trans‐disciplinary forum for engineers\, policy makers\, entrepreneurs\, philosophers\, researchers\, social scientists\, technologists\, and polymaths to collaborate\, exchange experiences\, and discuss the social implications of technology.\nHosted by the Santa Clara University (California\, USA)\, ISTAS25 runs from 10-12 September\, and will be live and virtual.\nSpeaker(s): \, \,\nBldg: Sobrato Innovation Building (SCDI – Building 402).\, Santa Clara University\, 500 El Camino Real\, Santa Clara\, California\, United States\, 95053\, Virtual: https://events.vtools.ieee.org/m/494179
URL:https://svec.org/event/ieee-international-symposium-on-technology-and-society-istas25/
LOCATION:Bldg: Sobrato Innovation Building (SCDI – Building 402).\, Santa Clara University\, 500 El Camino Real\, Santa Clara\, California\, United States\, 95053\, Virtual: https://events.vtools.ieee.org/m/494179
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20250909T190000
DTEND;TZID=America/Los_Angeles:20250909T210000
DTSTAMP:20260404T135203
CREATED:20250812T094816Z
LAST-MODIFIED:20250812T094816Z
UID:76875-1757444400-1757451600@svec.org
SUMMARY:Startup Funding & Trends in Silicon Valley and Beyond
DESCRIPTION:This is a hybrid in-person and online event. Pre-registration is required for either.\nAbout 40% of all venture capital is invested in Silicon Valley and the Bay Area\, making it the leading global startup hub. It is thus a magnet for founders looking for a deep pool of technical talent\, and for investors looking for the next unicorn. AI has intensified this effect\, with a staggering 73% of all AI-related venture funding coming into this area since the beginning of 2024.\nIn this presentation\, Dawn DeBruyn will discuss how things are playing out this year for investment across AI and other sectors. This will include why 2024 was a funding “nuclear winter” for many startups\, how exits (acquisitions and IPOs) – or lack thereof – drove that trend\, plus the impact of ZIRP (Zero Interest-Rate Policy) and the effects of Covid on venture capital and funding. She will close with a discussion of key factors that have changed in 2025\, and her outlook for Q4 and 2026.\nSpeaker(s): Dawn DeBruyn Novarina\,\n567 Yosemite Dr\, Milpitas\, California\, United States\, 95035\, Virtual: https://events.vtools.ieee.org/m/496564
URL:https://svec.org/event/startup-funding-trends-in-silicon-valley-and-beyond/
LOCATION:567 Yosemite Dr\, Milpitas\, California\, United States\, 95035\, Virtual: https://events.vtools.ieee.org/m/496564
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20250907T100000
DTEND;TZID=America/Los_Angeles:20250907T170000
DTSTAMP:20260404T135203
CREATED:20250731T095140Z
LAST-MODIFIED:20250731T095140Z
UID:76794-1757239200-1757264400@svec.org
SUMMARY:SSIT’s Pre-Conference STEM Workshop Day Aboard the USS Hornet Museum
DESCRIPTION:We're loooking for YP Volunteers to help instruct on this STEM Day!\nJoin us aboard the legendary USS Hornet Sea\, Air & Space Museum for a special STEM-Workshop Day\, an event organized by the IEEE Society on Social Implications of Technology (SSIT). The IEEE REACH program and the USS Hornet related technologies will be showcased in this effort. This full-day experience is designed to engage young students (ages 12-18) and their teachers with hands-on learning\, historical exploration\, and interactive STEM activities; all set aboard one of the most storied aircraft carriers in U.S. history.\nhttps://attend.ieee.org/istas-2025/ssit-stem-day/ for more information and a registration link.\nSpeaker(s): \, \,\nUSS Hornet Sea\, Air & Space Museum\, 707 W. Hornet Ave.\, Alameda\, California\, United States\, 94501
URL:https://svec.org/event/ssits-pre-conference-stem-workshop-day-aboard-the-uss-hornet-museum/
LOCATION:USS Hornet Sea\, Air & Space Museum\, 707 W. Hornet Ave.\, Alameda\, California\, United States\, 94501
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20250904T190000
DTEND;TZID=America/Los_Angeles:20250904T200000
DTSTAMP:20260404T135203
CREATED:20250814T094823Z
LAST-MODIFIED:20250814T094823Z
UID:76885-1757012400-1757016000@svec.org
SUMMARY:Adjustments at the Half in 2025 to Prepare for 2026
DESCRIPTION:Sean Murphy\, consultant at SKMurphy\, Inc. will facilitate a peer-to-peer discussion for engineering managers that will help you to look back at 2025 to gather lessons learned and apply them to your plans for 2026.\nThink back over projects you have delivered in 2025 and your impact on business. Are there projects that took less effort that had a large positive impact? Are there projects that took a lot of effort but seemed to have little impact? What strategies or approaches do you want to use again in 2026? Are there experiments you are going to try?\nSpeaker(s): Sean Murphy\,\nVirtual: https://events.vtools.ieee.org/m/496840
URL:https://svec.org/event/adjustments-at-the-half-in-2025-to-prepare-for-2026/
LOCATION:Virtual: https://events.vtools.ieee.org/m/496840
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20250903T080000
DTEND;TZID=America/Los_Angeles:20250903T130000
DTSTAMP:20260404T135203
CREATED:20250803T094834Z
LAST-MODIFIED:20250803T094834Z
UID:76813-1756886400-1756904400@svec.org
SUMMARY:International Symposium on Computational Intelligence (ISCI) 2025 - Ethical AI
DESCRIPTION:Join us for the International Symposium on Computational Intelligence (ISCI) 2025\, a premier virtual half-day event dedicated to advancing the field of Ethical AI. This symposium brings together leading researchers\, practitioners\, and thought leaders to explore cutting-edge developments in trustworthy\, explainable\, and responsible artificial intelligence.\nWhat to Expect\n– Expert Presentations – 30-45 minute talks from internationally recognized speakers\n– Interactive Q&A Sessions – 15-minute discussion periods following each presentation\n– Global Perspective – Speakers from India\, UK\, North America\, and beyond\n– Live Streaming – Real-time access via YouTube with archived sessions on IEEE.tv\n—————————————————————\nStay tuned for updates on our distinguished speaker lineup.\nSpeaker(s): Dr. Ann Blandford\,\nVirtual: https://events.vtools.ieee.org/m/495321
URL:https://svec.org/event/international-symposium-on-computational-intelligence-isci-2025-ethical-ai/
LOCATION:Virtual: https://events.vtools.ieee.org/m/495321
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20250828T173000
DTEND;TZID=America/Los_Angeles:20250828T200000
DTSTAMP:20260404T135203
CREATED:20250808T095026Z
LAST-MODIFIED:20250808T095026Z
UID:76844-1756402200-1756411200@svec.org
SUMMARY:IEEE Young Professional Happy Hour
DESCRIPTION:IEEE Bay Area Summer Social\nCome join us for a fun Thursday evening at Tempest SF (Dive Bar)! Network with local IEEE young professionals and students in the area for internships\, while enjoying delicious food and drinks. This in-person event is the perfect opportunity to relax\, unwind\, and connect with like-minded professionals in a casual setting. Don't miss out on this chance to make new friends and build connections to help you navigate the transition from student to working professional.\nSpecial Invite: SHPE SFBA Professional Chapter!\nFirst drink is free\, and we will provide appetizers to share. Price of admission (including drink and food) is $5 for young professionals and $3 for students/interns. See you there!\nWhy Connect with Young Professionals?\nGetting involved with your local IEEE Young Professional (YP) organization is a great way to bridge the transition between academic life and a full-fledged professional career. A few key benefits of being involved in your local YP section include:\n– Networking Opportunities: IEEE YP events bring together like-minded individuals from diverse technical backgrounds. It's a perfect platform to expand your professional network\, potentially connecting you with future collaborators\, mentors\, or employers.\n– Professional Development: Gain valuable insights and skills through workshops\, seminars\, and panel discussions tailored to enhance your professional growth. These events often cover topics ranging from technical advancements to career advancement strategies.\n– Transition from Student to Professional: For students/interns transitioning into full-time roles\, IEEE YP provides a supportive environment helping navigate this crucial career phase successfully.\n– Friendship and Camaraderie: Beyond professional benefits\, IEEE YP fosters friendships and camaraderie among its members. Building a strong network of peers who share your interests can make your professional journey more fulfilling and enjoyable.\nPublic Transportaion.\nTake Bart and get off at Powell Station\, it is about a 7min walk from Bart.\nAgenda:\n5:30 PM-Check in\n6:00 PM-Ice Breaker\n7:00 PM-Group Picture\n2940 431 Natoma Street \, San Francisco\, California\, United States\, 94103
URL:https://svec.org/event/ieee-young-professional-happy-hour/
LOCATION:2940 431 Natoma Street \, San Francisco\, California\, United States\, 94103
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20250828T120000
DTEND;TZID=America/Los_Angeles:20250828T131500
DTSTAMP:20260404T135203
CREATED:20250802T094830Z
LAST-MODIFIED:20250802T094830Z
UID:76807-1756382400-1756386900@svec.org
SUMMARY:Advances in Vertical Wire Technology for Wire Bond Applications
DESCRIPTION:[]Advances in smart response-based processes have significantly improved wire bond reliability and further strengthened the use of the technology in high-volume manufacturing (HVM). Wire bonding technology remains a staple choice in vast majority of semiconductor packages due to its low cost\, increased flexibility\, and high yield rate. A traditional wire bond process consists of a wire loop with a ball bond on die and a wedge bond on substrate. Vertical Wires are an emerging interconnect solution formed using a unique process on the same ball bond equipment. Vertical Wires can be used as an alternative to the traditional wire bond processes or in conjunction with the traditional wire loops in SiPs. Although initially developed for interconnection applications\, Vertical Wire technology was introduced in HVM for EMI shielding in SiP and RF packages. This presentation will detail new advances in Vertical Wire Technology to further reduce wire pitch\, increase I/O density\, and reduce package footprint. An overview of application range\, capability and design rules for the technology will be discussed.\nSpeaker(s): Basil Milton\,\nVirtual: https://events.vtools.ieee.org/m/495344
URL:https://svec.org/event/advances-in-vertical-wire-technology-for-wire-bond-applications/
LOCATION:Virtual: https://events.vtools.ieee.org/m/495344
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20250828T113000
DTEND;TZID=America/Los_Angeles:20250828T131000
DTSTAMP:20260404T135203
CREATED:20250814T094811Z
LAST-MODIFIED:20250814T094811Z
UID:76883-1756380600-1756386600@svec.org
SUMMARY:Extremely Power-Dense Solar Panels for the Extremes of Space
DESCRIPTION:Extremely Power-Dense Solar Panels for the Extremes of Space\nhttps://www.eventbrite.com/e/1539115508919?aff=oddtdtcreator\nAbstract:\nUltrathin photovoltaic devices based on two-dimensional (2D) transition metal dichalcogenides (TMDs) have emerged as promising candidates for next-generation solar power in weight- and volume-constrained environments.\nIn this talk\, I will present flexible TMD solar cells that integrate semitransparent contacts and engineered interfacial layers to enhance charge collection\, optical absorption\, and environmental stability.\nCompared to traditional thin-film and III-V technologies\, these 2D devices offer superior specific power\, mechanical flexibility\, and potential resilience under extreme operating conditions.\nI will also discuss pathways for transitioning TMD photovoltaics from laboratory demonstrations to real-world deployment in aerospace\, mobile\, and off-grid systems.\nThis includes recent efforts through Arinna\, a spin-out focused on advancing 2D solar technologies for mission-ready applications across space\, mobility\, and distributed energy sectors.\nRead More:\n(https://www.arinna.xyz/)\n(https://www.nature.com/articles/s41467-021-27195-7)\n(https://www.cell.com/device/fulltext/S2666-9986(25)00036-5)\n[]\nBio:\nDr. Koosha Nassiri Nazif is a leading expert in high-specific-power photovoltaics\, with over a decade of experience in thin films and two-dimensional (2D) materials.\nHe earned his Ph.D. in Electrical Engineering from Stanford University\, where he led foundational research on flexible transition metal dichalcogenide (TMD) solar cells\, resulting in multiple publications and patents. His postdoctoral work at Stanford focused on scalable manufacturing and radiation resilience of these materials.\nHe is now co-founder and CEO of Arinna\, where he is building on this foundation to commercialize breakthrough solar technologies for advanced power and mobility systems.\nIn-Person Meeting\nThursday\, August 28\, 2025\n11:30 AM: Networking\, Pizza & Drinks\nNoon — 1 pm: Seminar\n——–\nPlease register on Eventbrite before 9:30 AM on Thursday August 28\nCo-sponsored by: SCV/SF Jt. Section Chapter\, ED15 Joint Chapter\nAgenda:\n11:30 AM: Networking\, Pizza & Drinks\nNoon — 1 pm: Seminar\nBreak & Networking\n1 pm — 1:30 pm\nOptional Lab Tour\n1:30 pm – 2:00 pm\nCovalent Metrology\, 923 Thompson Pl\, Sunnyvale\, California\, United States\, 94085
URL:https://svec.org/event/extremely-power-dense-solar-panels-for-the-extremes-of-space/
LOCATION:Covalent Metrology\, 923 Thompson Pl\, Sunnyvale\, California\, United States\, 94085
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20250826T185000
DTEND;TZID=America/Los_Angeles:20250826T200000
DTSTAMP:20260404T135203
CREATED:20250807T094840Z
LAST-MODIFIED:20250807T094840Z
UID:76835-1756234200-1756238400@svec.org
SUMMARY:Wearable ultrasound technology
DESCRIPTION:The use of wearable electronic devices that can acquire vital signs from the human body noninvasively and continuously is a significant trend for healthcare. The combination of materials design and advanced microfabrication techniques enables the integration of various components and devices onto a wearable platform\, resulting in functional systems with minimal limitations on the human body. Physiological signals from deep tissues are particularly valuable as they have a stronger and faster correlation with the internal events within the body compared to signals obtained from the surface of the skin. In this presentation\, I will demonstrate a soft ultrasonic technology that can noninvasively and continuously acquire dynamic information about deep tissues and central organs. I will also showcase examples of this technology's use in recording blood pressure and flow waveforms in central vessels\, monitoring cardiac chamber activities\, and measuring core body temperatures. The soft ultrasonic technology presented represents a platform with vast potential for applications in consumer electronics\, defense medicine\, and clinical practices.\nSpeaker(s): Dr. Sheng Xu\nAgenda:\n6:50 – 7 PM: Registration\n7-8 PM: Talk and Q&A\nVirtual: https://events.vtools.ieee.org/m/495898
URL:https://svec.org/event/wearable-ultrasound-technology/
LOCATION:Virtual: https://events.vtools.ieee.org/m/495898
END:VEVENT
END:VCALENDAR