Silicon Valley Engineering Council

Leadership Hike
2026-03-28 12:00 - 16:00 (America/Los_Angeles) | Hayward, 6000 California City Blvd, California City, CA, United States
Hike at Green Belt Trail
Hayward, California, United States

AMA (Ask me Anything) with Prof. Ethem Alpaydın
2026-04-02 10:00 - 11:55 (America/Los_Angeles) | Virtual: https://events.vtools.ieee.org/m/537179
Synopsis:
Please feel free to check out the work and thoughts of Prof. Ethem Alpaydın, Ph.D., https://mitpress.mit.edu/author/ethem-alpaydn-10375/ on Google Scholar at https://scholar.google.com/scholar?hl=en&as_sdt=0%2C5&q=%22Ethem+Alpayd%C4%B1n%22&btnG=, and generally on the Internet.
Then, please feel free to submit your questions to Prof. Ethem Alpaydın
– via Twitter by using the hashtag #ProfAlpaydinAMA and tagging @vishnupendyala
– emailing vspendyala(at)hotmail(dot)com with #ProfAlpaydinAMA in the subject
Selected questions will be answered by Prof. Alpaydin during the session. The audience may be able to ask follow-up questions during the session, using the Chat feature.
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By registering for this event, you agree that IEEE and the organizers are not liable to you for any loss, damage, injury, or any incidental, indirect, special, consequential, or economic loss or damage (including loss of opportunity, exemplary or punitive damages). The event will be recorded and will be made available for public viewing.
Co-sponsored by: Vishnu S. Pendyala, SJSU
Speaker(s): Dr. Vishnu S. Pendyala, Prof. Alpaydın
Virtual: https://events.vtools.ieee.org/m/537179

Heat-Assisted Magnetic-Recording: Characterization of Media Properties
2026-04-02 18:30 - 20:00 (America/Los_Angeles) | Quadrant Corp., 1120 Ringwood Ct., San Jose, California, United States, 95131, Virtual: https://events.vtools.ieee.org/m/544920
Pierre-Olivier Jubert of Western Digital will review the design and characterization of media used in heat-assisted magnetic recording (HAMR).
Speaker(s): Pierre-Olivier,
Agenda:
6:30 – 7:00 Socializing and Networking at Quadrant
6:55 Zoom session will be online with Waiting Room
7:00 – 7:45 Lecture begins, online and in person
7:45 – 8:00 Questions and Answers
Quadrant Corp., 1120 Ringwood Ct., San Jose, California, United States, 95131, Virtual: https://events.vtools.ieee.org/m/544920

Spring Speaker Series Start
2026-04-06 17:00 - 2026-04-07 18:00 (America/Los_Angeles) | Stanford, California, United States, 94305
Continuation of Stanford IEEE Speaker Series
Stanford, California, United States, 94305

Using Architectural Simulation to Investigate Chiplets for Scalable and Cost Effective HPC Beyond Exascale
2026-04-10 12:00 - 13:00 (America/Los_Angeles) | Virtual: https://events.vtools.ieee.org/m/539463
[]Chiplets have become a compelling approach to scaling and heterogeneous integration e.g. integrating workload-specific processors and massive bandwidth memory systems into computing systems; integrating die from multiple function-optimized process nodes into one product; integrating silicon from multiple businesses into one product. Chiplet-based products have been produced in high volume by multiple companies using proprietary chiplet ecosystems. Recently, the community has proposed several new standards (e.g., UCIe) to facilitate integration and interoperability of any compliant chiplet. Hyperscalers (e.g., Google, Amazon) are actively designing high volume products with chiplets through these open interfaces. Other communities are exploring the end-to-end workflow and tooling to assemble chiplet-based products. High performance computing can benefit from this trend. However, the performance, power, and thermal requirements unique to HPC, present many challenges to realizing a vision for affordable, modular HPC using this new approach. Architectural modeling and simulation will play a critical role in pathfinding for this new potential direction for HPC beyond Exascale.
Speaker(s): John Shalf,
Virtual: https://events.vtools.ieee.org/m/539463

Conversational AI: Practical Challenges in Talking to People
2026-04-14 19:00 - 21:00 (America/Los_Angeles) | 925 Thompson Place, Sunnyvale, California, United States, 94085, Virtual: https://events.vtools.ieee.org/m/541387
This is a hybrid in-person and online event. Pre-registration is required for either.
Conversational AI systems today speak with remarkable confidence, often giving the impression of understanding and reasoning. However, teams deploying these systems often quickly encounter familiar problems: drift, hallucinations, contradictory answers, and conversations that quietly lose their original purpose. Why do systems that seem so capable end up behaving so unpredictably?
In this talk, Elena Gostrer will examine these behaviors from a practical, product-engineering perspective. Rather than exploring model internals, this talk will focus on what actually happens when humans interact with probabilistic language models – and why traditional software assumptions fail in conversational settings.
Elena will also discuss what architectural patterns teams are adopting to keep in control, and she’ll highlight why combining generative AI with explicit structure, state, and constraints is becoming essential. Attendees will leave with a clearer understanding of why conversational AI breaks, what helps it behave more reliably, and how to think differently about designing human-AI interactions.
Speaker(s): Elena Gostrer,
925 Thompson Place, Sunnyvale, California, United States, 94085, Virtual: https://events.vtools.ieee.org/m/541387

Spring Speaker Series 2
2026-04-15 17:00 - 18:00 (America/Los_Angeles) | Stanford, California, United States, 94305
Continuation of Speaker Series at Stanford IEEE.
Stanford, California, United States, 94305

Quarterly social meeting and program
2026-04-22 11:00 - 14:00 (America/Los_Angeles) | Bldg, Livermore, CA, United States
Reserve this date for a social gathering and a program of general interest to be determined. IEEE member fee is subsidized.
Agenda:
Social meeting, presentation, and lunch. Select from buffet or order from menu depending on the number of registrations.
Bldg: Golf course restaurant, not pro shop, Beeb's Sports Bar and Grill, 915 Club House Drive, Livermore, California, United States

From Process to Performance: Challenges in uOLED and uLED Electronics Manufacturing
2026-05-12 12:00 - 13:00 (America/Los_Angeles) | Virtual: https://events.vtools.ieee.org/m/533601
As uOLED and uLED technologies transition from research to high-volume manufacturing, system performance is increasingly constrained by process variability rather than design intent. Electrical, thermal, and mechanical decisions made during manufacturing directly translate into optical non-uniformity, efficiency loss, and reliability challenges. Understanding these process-to-performance linkages is critical for building scalable, high-performance emissive display systems.
Virtual: https://events.vtools.ieee.org/m/533601

Spring Speaker Series 3
2026-05-17 17:00 - 2026-05-18 18:00 (America/Los_Angeles) | Stanford, California, United States, 94305

Third Annual IEEE Build-Up Substrate Symposium
2026-05-19 08:00 - 2026-05-20 17:00 (America/Los_Angeles) | Samsung, San Jose, CA, United States
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(More information will be added in early March. General Registration should open around March 1st. Sponsors may register at the link below.)
We are living in the era of heterogeneous integration driven by fast, efficient and big data computing resources at our fingertips. The mega-monolithic silicon chip is a thing of the past, replaced with 3D heterogeneous integration of chiplets onto a platform made of an organic build-up substrate. Volume manufacturers of build-up substrates are entirely based in Asia, leaving a desert in the US. Volume build-up substrates used by major IDMs are manufactured in Asian countries including Taiwan, Japan and China.
However, there are multiple activities starting up in the US, and this is why a gathering of the US players is important. This symposium is geared for all those involved in the supply chain of build-up substrates in the US, as well as users. This Symposium is an opportunity for all build-up substrate players to meet, network and cohesively work with funding agencies who will be invited to this symposium to focus on onshoring build-up substrate production and utilization.
Samsung, San Jose, California, United States

IEEE Build-Up Substrate Symposium (BUSS)
2026-05-19 09:00 - 2026-05-20 17:00 (America/Los_Angeles) | location to be announced, Milpitas, California, United States, Virtual: https://events.vtools.ieee.org/m/544352
We are living in the era of heterogeneous integration driven by fast, efficient and big data computing resources at our fingertips. The mega-monolithic silicon chip is a thing of the past, replaced with 3D heterogeneous integration of chiplets onto a platform made of an organic build-up substrate. Volume manufacturers of build-up substrates are entirely based in Asia, leaving a desert in the US. Volume build-up substrates used by major IDMs are manufactured in Asian countries including Taiwan, Japan and China.
However, there are multiple activities starting up in the US, and this is why a gathering of the US players is important. This symposium is geared for all those involved in the supply chain of build-up substrates in the US, as well as users. As the US Congress debates H.R. 3249, the Protecting Circuit Boards and Substrates (PCBS) Act, this Symposium is an opportunity for all build-up substrate players to meet, network and cohesively work with funding agencies who will be invited to this symposium to focus on onshoring build-up substrate production and utilization.
location to be announced, Milpitas, California, United States, Virtual: https://events.vtools.ieee.org/m/544352

IEEE Canada Blockchain Forum 2026 (4th edition)
2026-05-25 21:00 - 2026-05-26 17:00 (America/New_York) | Ontario Investment and Trade Centre, 250 Yonge Street, 35th Floor, Toronto, Ontario, Canada, M5B 2L7
The IEEE Blockchain Forum is returning for the fourth time as part of (https://www.torontotechweek.com/). The goal of this compact one-day event is to congregate BUIDLers, researchers, academics, and engineers building blockchain protocols, infrastructure, and decentralized software applications.
Note: (https://events.vtools.ieee.org/m/469545) counted with 200 participants and speakers from JP Morgan, the Bank of Canada, Mastercard, the Ethereum Enterprise Alliance, EY, Starknet, among others.
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Co-sponsored by: Government of Ontario
Agenda:
Agenda TBC
Ontario Investment and Trade Centre, 250 Yonge Street, 35th Floor, Toronto, Ontario, Canada, M5B 2L7
