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DTSTART;TZID=America/Los_Angeles:20260806T160000
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SUMMARY:Dual Seed Semi-Additive and Damascene Processes: Enabling Fine-Pitch Interconnects for Advanced Packaging
DESCRIPTION:[]\nAs AI\, high-performance computing\, and heterogeneous integration continue to scale\, advanced packaging is facing growing interconnect challenges across redistribution layers\, IC substrates\, HDI boards\, silicon vias\, and emerging glass-core platforms. Higher bandwidth and larger package form factors require finer wiring\, smaller vias\, higher fan-out density\, and more reliable vertical interconnects. In this context\, copper seed formation and via metallization are becoming increasingly important bottlenecks for next-generation package and substrate scaling.\nConventional copper deposition technologies\, including physical vapor deposition\, electroless plating\, and electroplating\, each play essential roles in today’s manufacturing flows. However\, as via structures become smaller\, deeper\, rougher\, or higher in aspect ratio\, limitations such as step coverage\, liquid circulation\, process uniformity\, and seed-layer continuity become more difficult to manage. These challenges are especially relevant across multiple interconnect layers\, including motherboard HDI PCBs\, IC substrates\, RDL\, memory and interposer silicon vias\, and Si BEOL metal\, etc.\nThis presentation will introduce Nano Copper Deposition as a solution family for AI-era interconnect scaling. The talk will cover DeepVia™ HDI for high-aspect-ratio via metallization in motherboard HDI PCBs\, DS-SAP™ for resolving the trade-off between thin surface seed layers and robust via coverage in IC substrates\, and other applications such as Dual Seed Damascene for fine and high-aspect-ratio damascene structures in BEOL and RDL applications\, and DeepVia™ Silicon for memory and interposer silicon vias. The discussion will highlight how these approaches can support higher I/O density\, improved escape routing\, reduced layer-count dependency\, and broader process flexibility for next-generation advanced packaging.\nSpeaker(s): Shinya Shimizu\,\nVirtual: https://events.vtools.ieee.org/m/565310
URL:https://svec.org/event/dual-seed-semi-additive-and-damascene-processes-enabling-fine-pitch-interconnects-for-advanced-packaging/
LOCATION:Virtual: https://events.vtools.ieee.org/m/565310
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DTSTART;TZID=-07:00:20260819T190000
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LAST-MODIFIED:20260506T213309Z
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SUMMARY:Modern Test Automation & Quality Engineering in Agile Systems
DESCRIPTION:LOCATION ADDRESS (Hybrid\, in person or by zoom\, you choose)\nValley Research Park\n319 North Bernardo Avenue\nMountain View\, CA CA 93043\nDon’t use the front door. When facing the front door\, turn right along the front of the building. Turn left around the building corner. The 2nd door should be open and have a banner and event registration. \nIf you want to join remotely\, you can submit questions via Zoom Q&A. The zoom link:\n[https://acm-org.zoom.us/j/95226212956?pwd=HnAedzSDGcYAYsCzTuavIvMYMFtILa.1](https://acm-org.zoom.us/j/95226212956?pwd=HnAedzSDGcYAYsCzTuavIvMYMFtILa.1)\nJoin via YouTube:\n[https://youtube.com/live/cu5TDl8N2Mk](https://youtube.com/live/cu5TDl8N2Mk) \nAGENDA\n6:30 Door opens\, food and networking (we invite honor system contributions)\n**7:00** SFBayACM upcoming events\, introduce the speaker\n7:15 speaker presentation starts\n8:15 – 8:30 finish\, depending on Q&A \nJoin SF Bay ACM Chapter for an insightful discussion on: \n**Talk Description**: \nAs software delivery accelerates\, traditional testing approaches struggle to keep pace with Agile and DevOps environments. Modern systems demand more than automated test cases—they require a shift toward quality engineering practices that embed reliability\, scalability\, and continuous feedback into every stage of development. \nThis talk explores how test automation has evolved from a validation activity into a core engineering discipline. We will examine how to design resilient automation frameworks\, integrate testing seamlessly into CI/CD pipelines\, and build quality signals that provide real-time insight into system health.\nThrough practical examples\, the session will highlight strategies for moving beyond UI-driven automation toward API\, integration\, and workflow-level validation. It will also cover key aspects such as test data management\, environment stability\, performance considerations\, and accessibility as part of continuous quality. \nAttendees will gain a clear understanding of how to align automation with Agile delivery\, reduce flaky tests\, and create scalable\, maintainable solutions that support rapid releases without compromising quality.\nThis session is designed for engineers and quality professionals who want to modernize their automation approach and build systems that are reliable by design\, not just tested after the fact. \n**Speaker Bio**:\nShri Lakshmi Rajagopal\, a Senior Quality Engineering Leader and Test Automation Architect. She has over 14 years of experience in software quality engineering\, automation architecture\, and engineering leadership. Her work focuses on designing maintainable automation frameworks\, enabling Agile quality practices\, and mentoring teams to adopt modern testing strategies. She is passionate about sharing practical insights that help teams build reliable and scalable software systems. \nLinkedIn:[https://www.linkedin.com/in/shri-lakshmi-rajagopal-a5012428](https://www.linkedin.com/in/shri-lakshmi-rajagopal-a5012428) \n— \nValley Research Park is a coworking research campus of 104\,000 square feet hosting 60+ life science and technology companies. VRP has over 100 dry labs\, wet labs\, and high power labs sized from 125-15\,000 square feet. VRP manages all of the traditional office elements: break rooms\, conference rooms\, outdoor dining spaces\, and recreational spaces. \nAs a plug-and-play lab space\, once companies have secured their next milestone and are ready to expand\, VRP has 100+ labs ready to expand into.\nhttps://www.valleyresearchpark.com/
URL:https://svec.org/event/modern-test-automation-quality-engineering-in-agile-systems/
LOCATION:Valley Research Park\, 319 N Bernardo Ave\, Mountain View\, CA\, 94043\, United States
ATTACH;FMTTYPE=image/jpeg:https://svec.org/wp-content/uploads/2026/05/1024x576-NfPn4j.jpg
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