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DTSTART;TZID=America/New_York:20260713T110000
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SUMMARY:Next Generation Microelectronics for Sensing & Communication Systems: Challenges and Opportunities for Innovations from Novel Materials\, Devices & Circuits to Advanced Packaging & 3D Heterogenous Integration
DESCRIPTION:[]Microelectronics serve as the structural backbone for both global economic competitiveness and as our national defense strategy and forms the technical foundation for a wide array of applications. These include high-performance computing\, artificial intelligence\, autonomous systems\, communications networks\, and integrated sensing ecosystems. Next-generation microelectronic technologies are shifting away from traditional 2D silicon scaling by embracing 3D Heterogeneous Integration (3DHI)\, which vertically stacks and interconnects diverse materials. This leap enables unprecedented processing power\, miniaturization\, and energy efficiency crucial for advanced computing\, sensing and communication systems.\nThis talk will focus on this grand vision as well as recent advances in the next-generation microelectronics and manufacturing for sensing and communication systems. It will highlight challenges and opportunities for innovations to address traditional physical scaling limits.\nSpeaker(s): Hasan Sharifi\,\nBldg: WALC 2127\, Purdue University\, West Lafayette\, Indiana\, United States\, Virtual: https://events.vtools.ieee.org/m/564441
URL:https://svec.org/event/next-generation-microelectronics-for-sensing-communication-systems-challenges-and-opportunities-for-innovations-from-novel-materials-devices-circuits-to-advanced-packaging-3d-heter/
LOCATION:Bldg: WALC 2127\, Purdue University\, West Lafayette\, Indiana\, United States\, Virtual: https://events.vtools.ieee.org/m/564441
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