IEEE-Electronics Packaging Society/SCV

Name: Chiplet Design & Heterogeneous Integration Packaging – John Lau, Unimicron
Start: 2023-03-09T12:00:00-08:00
End: 2023-03-09T13:00:00-08:00
Location: SEMI

Events
Organizers
IEEE-Electronics Packaging Society/SCV

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Events from this organizer

March 2023

March 9, 2023 @ 12:00 pm - 1:00 pm PST

Chiplet Design & Heterogeneous Integration Packaging – John Lau, Unimicron

SEMI 673 South Milpitas Boulevard Milpitas, CA 95035, Milpitas, CA, United States

Past Events

March 2023