Characterization and Application of a New Chip-Level Air Pump

[]Trends in consumer goods are leaning towards thinner, more compact products with higher performance than their predecessors. Today’s consumer wants lightweight, portable, battery-operated gear that is powerful enough to satisfy their needs for speed and ease of use. One of the biggest challenges facing product design is thermal management. Case temperature limits for products that come in contact with user’s skin place constraints on internal power dissipation and increase the need for improved thermal management. With the introduction of locally processed AI and higher compact portable device processing loads thermal issues are critical for avoiding throttling.
µCooling: A new device has been invented that changes the way thermal engineers are approaching system cooling design. µCooling is a new concept in air movers. It is small, and thin and is a complete departure from rotating mass fans. This MEMS-based invention can move air through very small spaces, used directly on a chip or package, placed remotely through tiny ducts, or mounted outside of a product. In fact, the versatility of µCooling changes the way we can manage heat at the package, SoC, or bare-chip level. This talk will introduce µCooling, a MEMS-based, all-silicon, micro-sized air pump. The device will be described in terms of how it works, performance characteristics, and application examples.
Speaker(s): Tom Tarter,
Virtual: https://events.vtools.ieee.org/m/500418