Co-Packaged Optics: Heterogeneous Integration of Chiplets in Switches, Photonic ICs and Electronic ICs

[]Co-packaged optics (CPO) are heterogeneous integration packaging methods to integrate the optical engine (OE) which consists of photonic ICs (PIC) such as the photodiode laser, etc. and the electrical engine (EE) which consists of the electronic ICs (EIC) such as the laser driver, transimpedance amplifier, etc. as well as the switch ASIC (application specific IC). The advantages of CPO are: (a) to reduce the length of the electrical interface between the OE/EE (or PIC/EIC) and the ASIC, (b) to reduce the energy required to drive the signal, and (c) to cut the latency which leads to better electrical performance. In the next few years, we will see more implementations of a higher level of heterogeneous integration of switch, PIC and EIC, whether it is for performance, form factor, power consumption or cost. The content of this lecture:
— Silicon Photonics
— Data Centers
— Optical Transceivers
— Optical Engine (OE) and Electrical Engine (EE)
— OBO (on-board optics)
— NPO (near-board optics)
— CPO (co-packaged optics)
— 3D Integration of the PIC and EIC
— 3D Heterogeneous Integration of PIC and EIC
— 3D Heterogeneous Integration of ASIC Switch, PIC and EIC
— 3D Heterogeneous Integration of ASIC Switch, PIC and EIC with Bridges
— 3D Heterogeneous Integration of ASIC Switch, EIC and PIC embedded in Glass-core Substrate
— Various Forms of CPO
Speaker(s): John Lau,
Virtual: https://events.vtools.ieee.org/m/539468