IEEE Symposium on Reliability for Electronics and Photonics Packaging

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This symposium will focus on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging. This includes failure modes, mechanisms, testing schemes, accelerated testing, stress levels, and environmental stresses.
Visit our website for details, for our Advance Program, and to register. https://attend.ieee.org/repp.
Milpitas, California, United States, Virtual: https://events.vtools.ieee.org/m/495693