The New Role of Solder Joints for AI and HPC Interconnects

Name: The New Role of Solder Joints for AI and HPC Interconnects
Start: 2025-10-23T12:00:00-07:00
End: 2025-10-23T13:00:00-07:00
Location: Virtual: https://events.vtools.ieee.org/m/501073

October 23 @ 12:00 pm - 1:00 pm

[](to be provided — please check back)
Speaker(s): Tae-Kyu Lee,
Virtual: https://events.vtools.ieee.org/m/501073