Third Annual IEEE Build-Up Substrate Symposium

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(More information will be added in early March. General Registration should open around March 1st. Sponsors may register at the link below.)
We are living in the era of heterogeneous integration driven by fast, efficient and big data computing resources at our fingertips. The mega-monolithic silicon chip is a thing of the past, replaced with 3D heterogeneous integration of chiplets onto a platform made of an organic build-up substrate. Volume manufacturers of build-up substrates are entirely based in Asia, leaving a desert in the US. Volume build-up substrates used by major IDMs are manufactured in Asian countries including Taiwan, Japan and China.
However, there are multiple activities starting up in the US, and this is why a gathering of the US players is important. This symposium is geared for all those involved in the supply chain of build-up substrates in the US, as well as users. This Symposium is an opportunity for all build-up substrate players to meet, network and cohesively work with funding agencies who will be invited to this symposium to focus on onshoring build-up substrate production and utilization.
Samsung, San Jose, California, United States