IEEE/EPS Hybrid Bonding Symposium
SEMI World Headquarters, 673 South Milpitas Blvd, Milpitas, California, United States, Virtual: https://events.vtools.ieee.org/m/495346[] Hybrid Bonding has emerged as the technology of choice in the semiconductor industry for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device performance, it will become widely adopted for a broad range of high-performance semiconductor devices in the years to come. The success of Hybrid Bonding technology for high-volume manufacturing depends critically […]