Events for May 20, 2026

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Third Annual IEEE Build-Up Substrate Symposium

Samsung San Jose

[] (More information will be added in early March. General Registration should open around March 1st. Sponsors may register at the link below.) We are living in the era of heterogeneous integration driven by fast, efficient and big data computing resources at our fingertips. The mega-monolithic silicon chip is a thing of the past, replaced […]

IEEE Build-Up Substrate Symposium (BUSS)

location to be announced, Milpitas, California, United States, Virtual: https://events.vtools.ieee.org/m/544352

We are living in the era of heterogeneous integration driven by fast, efficient and big data computing resources at our fingertips. The mega-monolithic silicon chip is a thing of the past, replaced with 3D heterogeneous integration of chiplets onto a platform made of an organic build-up substrate. Volume manufacturers of build-up substrates are entirely based […]