Inferencing has become ubiquitous across cloud, regional, edge, and device environments, powering a wide spectrum of AI use cases spanning vision, language, and traditional machine learning applications. In recent years, Large Language Models (LLMs), initially developed for natural language tasks, have expanded to multimodal applications including vision speech, reasoning and planning each demanding distinct service-level […]

[]Trends in consumer goods are leaning towards thinner, more compact products with higher performance than their predecessors. Today’s consumer wants lightweight, portable, battery-operated gear that is powerful enough to satisfy their needs for speed and ease of use. One of the biggest challenges facing product design is thermal management. Case temperature limits for products that […]

Careers don’t always follow a straight line — and that’s a good thing! In this talk, I’ll share lessons learned from my own journey and from others who’ve navigated career twists, pauses, and pivots. You’ll hear practical strategies for building confidence, staying current, and navigating transitions at every career stage. We’ll look at how to […]

This is a hybrid in-person and online event. Pre-registration is required for either. The holy grail of medical diagnostics is a test that is accurate, sensitive, non-invasive, and inexpensive. For solid tumors such as pancreatic cancer and for many neurological diseases, current diagnostics come too little, too late. An exciting direction of research in this […]

[]The rapid rise in power density and complexity of electronic systems has made thermal management a critical challenge for ensuring reliability, performance, and sustainability. Artificial Intelligence (AI) offers transformative opportunities to address this challenge by enabling data-driven modeling, optimization, and predictive control of cooling systems. By integrating AI with experimental and physics-based approaches, adaptive models […]

[] Requirements on the high-performance compute (HPC) systems from AI workloads necessitates transition to larger package sizes with 2.5D to 3.5D integration and density scaling at every level in the stack. Several competing packaging architectures are emerging to solve the compute and power efficiency challenge presented by AI workloads. Each presents unique lithography challenges such […]