Reserve this date for a social gathering and a program of general interest to be determined. IEEE member fee is subsidized. Agenda: Social meeting, presentation, and lunch. Select from buffet or order from menu depending on the number of registrations. Bldg: Golf course restaurant, not pro shop, Beeb's Sports Bar and Grill, 915 Club House […]
Monthly AdCom meeting: 1. Welcome - Hualiang 2. Symposium status update - Annette/Paul/Hualiang 3. Education outreach status - Masha/Azmat/Hualiang 4. Chapter Storage - Hualiang XXXX NOT 5. Monthly talk preparation - Chandan/Luu 6. Chapter website update - XXXX NOT Venkatesh/Claire/Paul 7. Senior member advancement - Dwayne Xxxx NOT 8: Election 2026 9: Open discussion - […]
[]Join us for an insightful webinar with Francesco Carobolante, founder of IoTissimo® LLC and an EPS Distinguished Lecturer, as he explores the critical challenges and innovative solutions that advanced packaging can provide to address the "Power Wall". With over 30 years of industry experience and a tenure at Intel’s Corporate Strategy Office, Francesco will delve […]
As uOLED and uLED technologies transition from research to high-volume manufacturing, system performance is increasingly constrained by process variability rather than design intent. Electrical, thermal, and mechanical decisions made during manufacturing directly translate into optical non-uniformity, efficiency loss, and reliability challenges. Understanding these process-to-performance linkages is critical for building scalable, high-performance emissive display systems. Virtual: […]
Continuation of Speaker Series at Stanford IEEE. Stanford, California, United States, 94305
[] (More information will be added in early March. General Registration should open around March 1st. Sponsors may register at the link below.) We are living in the era of heterogeneous integration driven by fast, efficient and big data computing resources at our fingertips. The mega-monolithic silicon chip is a thing of the past, replaced […]
We are living in the era of heterogeneous integration driven by fast, efficient and big data computing resources at our fingertips. The mega-monolithic silicon chip is a thing of the past, replaced with 3D heterogeneous integration of chiplets onto a platform made of an organic build-up substrate. Volume manufacturers of build-up substrates are entirely based […]
The IEEE Blockchain Forum is returning for the fourth time as part of (https://www.torontotechweek.com/). The goal of this compact one-day event is to congregate BUIDLers, researchers, academics, and engineers building blockchain protocols, infrastructure, and decentralized software applications. Note: (https://events.vtools.ieee.org/m/469545) counted with 200 participants and speakers from JP Morgan, the Bank of Canada, Mastercard, the Ethereum […]
We are thrilled to host LLNL’s 30th Center for Advanced Signal and Image Sciences (CASIS) workshop. The workshop returns with a full 2-day in-person schedule on Wednesday and Thursday, June 24-25, 2026. We encourage a broad range of technical topics at the workshop and being non-archival apart from original work, we are also considering intermediate […]
