Rethinking Chip Design to deliver Faster, Smarter, More Compact Solutions [] Abstract: CDimension is rethinking chip design from the ground up, delivering solutions that are faster, smarter, and more compact. We’re moving beyond the limitations of traditional technology. Our foundational innovations in advanced materials and semiconductor integration unlock unprecedented gains in performance, efficiency, and scalability […]

The rapid growth of 3D advanced packaging introduces new challenges in inspection and failure analysis, where complex structures such as microbumps, redistribution layers (RDLs), and through-silicon vias (TSVs) demand reliable non-destructive testing (NDT). Conventional approaches, including Scanning Acoustic Microscopy (SAM) and X-ray imaging, are limited by noise, resolution, and defect visibility, creating barriers for reproducible […]