Co-Packaged Optics: Heterogeneous Integration of Chiplets in Switches, Photonic ICs and Electronic ICs
[]Co-packaged optics (CPO) are heterogeneous integration packaging methods to integrate the optical engine (OE) which consists of photonic ICs (PIC) such as the photodiode laser, etc. and the electrical engine (EE) which consists of the electronic ICs (EIC) such as the laser driver, transimpedance amplifier, etc. as well as the switch ASIC (application specific IC). […]