Advances in Vertical Wire Technology for Wire Bond Applications
Virtual: https://events.vtools.ieee.org/m/495344[]Advances in smart response-based processes have significantly improved wire bond reliability and further strengthened the use of the technology in high-volume manufacturing (HVM). Wire bonding technology remains a staple choice in vast majority of semiconductor packages due to its low cost, increased flexibility, and high yield rate. A traditional wire bond process consists of a […]