Seventh Annual IEEE Symposium on Reliability for Electronics and Photonics Packaging (REPP)

[]This 2-day symposium focuses on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging. This includes failure modes, stress levels, mechanisms, testing schemes, accelerated testing, and environmental stresses. The intent is to bring together electrical, reliability, materials, mechanical, and computer engineers and applied scientists to address the state-of-the-art in all the interconnected fields of electronic and photonic packaging, with an emphasis on various reliabilit-yrelated aspects: design-for-reliability, manufacturing, reliability modeling and accelerated testing.
Location: In person at UCLA, and over IEEE WebEx
Dates: November 12-13, 2026
Cost: $90 ($75 for IEEE members, $35 for WebEx) through Oct. 16
UCLA, Los Angeles, California, United States