Workshop: Decoding AI Hardware – Materials, Metrology, and Failure Analysis in Advanced Packaging
October 23 @ 9:00 am - 1:30 pm
Four guided training talks with small-group interaction:
9:00: Advanced Packaging for AI – Challenges and Roadmaps in Fault Isolation and Failure Analysis
9:30: Metal TIM and Low-Temp Solder Paste for HPC & AI Industry Challenges
10:30: Failure Analysis of Electronic Components for AI and Data Center Infrastructure
11:00: Scanning Acoustic Microscopy (SAM) and Photo-induced Force Microscopy (PiFM) for Defect Identification and Characterization in AI Hardware
11:30: lunch, social/networking, and optional lab tours
Co-sponsored by: Paul Wesling
Speaker(s): Yan Li, David Hu, Audrey Chamoire , Austin Barnes
Covalent Corp., 925 Thompson Place, Sunnyvale, California, United States, 94085, Virtual: https://events.vtools.ieee.org/m/575155