[]The rapid rise in power density and complexity of electronic systems has made thermal management a critical challenge for ensuring reliability, performance, and sustainability. Artificial Intelligence (AI) offers transformative opportunities to address this challenge by enabling data-driven modeling, optimization, and predictive control of cooling systems. By integrating AI with experimental and physics-based approaches, adaptive models […]

[] Requirements on the high-performance compute (HPC) systems from AI workloads necessitates transition to larger package sizes with 2.5D to 3.5D integration and density scaling at every level in the stack. Several competing packaging architectures are emerging to solve the compute and power efficiency challenge presented by AI workloads. Each presents unique lithography challenges such […]