[]The rapid rise in power density and complexity of electronic systems has made thermal management a critical challenge for ensuring reliability, performance, and sustainability. Artificial Intelligence (AI) offers transformative opportunities to address this challenge by enabling data-driven modeling, optimization, and predictive control of cooling systems. By integrating AI with experimental and physics-based approaches, adaptive models […]

[] Requirements on the high-performance compute (HPC) systems from AI workloads necessitates transition to larger package sizes with 2.5D to 3.5D integration and density scaling at every level in the stack. Several competing packaging architectures are emerging to solve the compute and power efficiency challenge presented by AI workloads. Each presents unique lithography challenges such […]

Short-circuit current ratings (SCCR) and interrupting ratings form the backbone of electrical safety, coordination, and compliance in modern power systems. This presentation explores how UL 508A Supplement SB intersects with the National Electrical Code (NEC) to define the limits of what electrical equipment can safely withstand and interrupt under fault conditions. The presentation examines how […]

[] Hybrid Bonding has emerged as the technology of choice in the semiconductor industry for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device performance, it will become widely adopted for a broad range of high-performance semiconductor devices in the years to come. The success of Hybrid Bonding technology for high-volume manufacturing depends critically […]

Vision for Heterogeneous Integration from Global Perspectives, 2 days, keynote talks, working groups ... 1: Registration is $125 ($100 for IEEE members). PayPal is the credit card payments processor; please do not use your Paypal account during the payment process here. This fee is only to cover the food and beverage service costs at the […]