Achieving efficient p-type doping in gallium nitride (GaN) and its alloys remains one of the most critical challenges in realizing the full potential of III-nitride semiconductors for high-power electronics, deep-ultraviolet (DUV) optoelectronics, and quantum information technologies. While magnesium is the conventional acceptor dopant, its high ionization energy (≈0.22 eV in GaN and up to 0.6 […]

EVENT LOGISTICS The event is hybrid. The audience can attend in Mountain View, CA or join on Zoom or YouTube Valley Research Park (VRP) 319 North Bernardo Ave Mountain View, CA 94043 From the locked front door, go to the right side of the building. The 2nd door will be open. Agenda  (one hour earlier […]

The Product Safety Engineering Society Bay Area Joint Section Chapter (SCV/SF/OEB) invites you to a virtual meetup of professionals interested in product safety and compliance. We will discuss the future of the chapter and plan future events. Agenda: - Business Meeting - Plan future activity of the chapter - New Officer Elections Virtual: https://events.vtools.ieee.org/m/507461

This is a hybrid in-person and online event. Pre-registration is required for either. >> DIFFERENT LOCATION FOR IN-PERSON MEETING THIS MONTH! This presentation will discuss the pioneering microprocessor R&D efforts at Bell Labs in 1976-1982 which created a new chip architecture and physical design. New test and verification methods were needed to overcome challenges in […]

Free Registration (with a Zoom account; you can get one for free if you don't already have it. This requirement is to avoid Zoom bombing. Please sign in using the email address tied to your Zoom account — not necessarily the one you used to register for the event.): https://sjsu.zoom.us/meeting/register/qGy644m7StmKMra3Xs_x2g Synopsis: Please feel free to […]

Rethinking Chip Design to deliver Faster, Smarter, More Compact Solutions [] Abstract: CDimension is rethinking chip design from the ground up, delivering solutions that are faster, smarter, and more compact. We’re moving beyond the limitations of traditional technology. Our foundational innovations in advanced materials and semiconductor integration unlock unprecedented gains in performance, efficiency, and scalability […]

The rapid growth of 3D advanced packaging introduces new challenges in inspection and failure analysis, where complex structures such as microbumps, redistribution layers (RDLs), and through-silicon vias (TSVs) demand reliable non-destructive testing (NDT). Conventional approaches, including Scanning Acoustic Microscopy (SAM) and X-ray imaging, are limited by noise, resolution, and defect visibility, creating barriers for reproducible […]

This virtual meeting can accommodate up to 100 attendees. While military systems in general have to operate in tough electromagnetic environments, missile programs require special attention and considerations from an EMI/EMC perspective. From environments to requirements to best practices, this presentation will discuss key focuses of EMI/EMC engineering in relation to missile programs and systems […]

Building on the tremendous response to Dhanashree Lele’s ACM talk on Multi-Agent Architectures for Enterprise AI, this 2-day, research-caliber, hands-on workshop is designed to advance the state of practice in Agentic AI system design, evaluation, and optimization. This workshop will guide participants through theory-to-deployment workflows for constructing next-generation multi-agent frameworks, benchmarking agentic behaviors, and applying […]

Silicon Valley Engineering Council's annual Open House features networking with refreshments and a Biotech panel discussion, including engineering's role in healthcare futures. The population in the United States and many Western countries is aging. The cost for developing and using healthcare is rising so much that one wonders if it is sustainable. New ways of thinking […]

Hosted via Google Meet - https://meet.google.com/pqw-trcy-xpg The financial industry is entering a new phase of intelligence—one where AI systems are no longer just analytical tools but autonomous collaborators capable of interpreting goals, reasoning over complex data, and taking context-aware actions. This talk explores the emergence of agentic AI systems in finance—AI architectures designed with intent, […]

Millimeter-wave (mmWave) power amplifiers (PAs) are critical building blocks in next-generation radar, satellite, defense, and 6G communication systems, where output power, bandwidth, and efficiency must be achieved under stringent size, weight, and power (SWaP) constraints. Among the enabling technologies, Gallium Arsenide (GaAs) and Gallium Nitride (GaN) continue to dominate due to their complementary strengths in […]

Millimeter-wave (mmWave) power amplifiers (PAs) are critical building blocks in next-generation radar, satellite, defense, and 6G communication systems, where output power, bandwidth, and efficiency must be achieved under stringent size, weight, and power (SWaP) constraints. Among the enabling technologies, Gallium Arsenide (GaAs) and Gallium Nitride (GaN) continue to dominate due to their complementary strengths in […]

[] This symposium will focus on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging. This includes failure modes, mechanisms, testing schemes, accelerated testing, stress levels, and environmental stresses. Visit our website for details, for our Advance […]

The power industry is under pressure to rapidly expand infrastructure to meet growing demands from both consumers and producers. But sticking to traditional design and construction methods may no longer be enough. One of the biggest bottlenecks? Hardware dependencies—like waiting on control wiring or specific components—that delay commissioning and inflate project timelines. This presentation explores […]

[]Trends in consumer goods are leaning towards thinner, more compact products with higher performance than their predecessors. Today’s consumer wants lightweight, portable, battery-operated gear that is powerful enough to satisfy their needs for speed and ease of use. One of the biggest challenges facing product design is thermal management. Case temperature limits for products that […]

[]The rapid rise in power density and complexity of electronic systems has made thermal management a critical challenge for ensuring reliability, performance, and sustainability. Artificial Intelligence (AI) offers transformative opportunities to address this challenge by enabling data-driven modeling, optimization, and predictive control of cooling systems. By integrating AI with experimental and physics-based approaches, adaptive models […]

[] Requirements on the high-performance compute (HPC) systems from AI workloads necessitates transition to larger package sizes with 2.5D to 3.5D integration and density scaling at every level in the stack. Several competing packaging architectures are emerging to solve the compute and power efficiency challenge presented by AI workloads. Each presents unique lithography challenges such […]

[] Hybrid Bonding has emerged as the technology of choice in the semiconductor industry for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device performance, it will become widely adopted for a broad range of high-performance semiconductor devices in the years to come. The success of Hybrid Bonding technology for high-volume manufacturing depends critically […]