[]Advanced Packaging enables heterogeneous integration of chiplets with die-embedding and die-stacking techniques, and provides maximum […]
A major hurdle in developing next-generation systems for high-performance applications and industries that require handling […]
Come join your local Santa Clara Valley Section of the American Society of Mechanical Engineers […]
During this event, we will host different IEEEXtreme Teams in different rooms on campus. Those […]
The combined Santa Clara Valley, San Francisco, & Oakland/East Bay IEEE PELS is very pleased […]
San Francisco, & Oakland/East Bay Chapter of IEEE Power Electronics Society is excited to be […]
Abstract Microchannel particle deposition (MPD) is a wafer-scale thick-film deposition process used to accurately and […]
Abstract: While silicon scaling has reached astonishing levels over the last half century, there has […]
Abstract- High Purity Germanium (HPGe) detectors are renowned for their exceptional energy resolution and high […]
Synthetic Aperture Radar (SAR) offers significant advantages to customers within the commercial market due to […]
GET Digital Health Informatics Forum Global Emerging Technologies for Digital Health (ISO/TC215 + IEEE-SA + […]
[] Welcome to the fifth year of this IEEE Electronics Packaging Society Symposium. This symposium […]
