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Achieving efficient p-type doping in gallium nitride (GaN) and its alloys remains one of the most critical challenges in realizing the full potential of III-nitride semiconductors for high-power electronics, deep-ultraviolet (DUV) optoelectronics, and quantum information technologies. While magnesium is the conventional acceptor dopant, its high ionization energy (≈0.22 eV in GaN and up to 0.6 […] |
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Free Registration (with a Zoom account; you can get one for free if you don't already have it. This requirement is to avoid Zoom bombing. Please sign in using the email address tied to your Zoom account — not necessarily the one you used to register for the event.): https://sjsu.zoom.us/meeting/register/qGy644m7StmKMra3Xs_x2g Synopsis: Please feel free to […] |
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Rethinking Chip Design to deliver Faster, Smarter, More Compact Solutions [] Abstract: CDimension is rethinking chip design from the ground up, delivering solutions that are faster, smarter, and more compact. We’re moving beyond the limitations of traditional technology. Our foundational innovations in advanced materials and semiconductor integration unlock unprecedented gains in performance, efficiency, and scalability […]
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The rapid growth of 3D advanced packaging introduces new challenges in inspection and failure analysis, where complex structures such as microbumps, redistribution layers (RDLs), and through-silicon vias (TSVs) demand reliable non-destructive testing (NDT). Conventional approaches, including Scanning Acoustic Microscopy (SAM) and X-ray imaging, are limited by noise, resolution, and defect visibility, creating barriers for reproducible […] |
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Save the Date for the 2025 Open House The Open House event is offers a great opportunity to recognize our member organizations and promote their programs and events, This event features a prominent speaker with a n important technology topic and offers refreshments with networking time for attendees to meet other Silicon Valley engineers. Stay […] |
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[] This symposium will focus on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging. This includes failure modes, mechanisms, testing schemes, accelerated testing, stress levels, and environmental stresses. Visit our website for details, for our Advance […]
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The power industry is under pressure to rapidly expand infrastructure to meet growing demands from both consumers and producers. But sticking to traditional design and construction methods may no longer be enough. One of the biggest bottlenecks? Hardware dependencies—like waiting on control wiring or specific components—that delay commissioning and inflate project timelines. This presentation explores […] |
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