Next Generation Microelectronics for Sensing & Communication Systems: Challenges and Opportunities for Innovations from Novel Materials, Devices & Circuits to Advanced Packaging & 3D Heterogenous Integration
[]Microelectronics serve as the structural backbone for both global economic competitiveness and as our national defense strategy and forms the technical foundation for a wide array of applications. These include high-performance computing, artificial intelligence, autonomous systems, communications networks, and integrated sensing ecosystems. Next-generation microelectronic technologies are shifting away from traditional 2D silicon scaling by embracing […]