Dual Seed Semi-Additive and Damascene Processes: Enabling Fine-Pitch Interconnects for Advanced Packaging
[] As AI, high-performance computing, and heterogeneous integration continue to scale, advanced packaging is facing growing interconnect challenges across redistribution layers, IC substrates, HDI boards, silicon vias, and emerging glass-core platforms. Higher bandwidth and larger package form factors require finer wiring, smaller vias, higher fan-out density, and more reliable vertical interconnects. In this context, copper […]