Events

Brain-Scale Intelligence with Atomic-Scale Technology: From 2D Materials to Monolithic 3D AI Computing What becomes possible when we scale computing vertically rather than relying on ever-smaller transistors? This talk introduces PhantaField’s approach to connecting atomic-scale materials engineering with AI chip architecture—using low-temperature two-dimensional semiconductors to bring memory and computation closer together. The talk begins with […]

The biggest shift in AI is that women are rapidly adopting it, and being trained to us it, like women, not men. This can be a real competitive advantage, along with genuinely good news for everyone. When Claude OS and AI Agents are created through the users own terms, there is more capacity to apply […]

PG&E's Distributed Energy Resource Management System (DERMS) platform provides a method to better integrate and manage distributed energy resources and flexible loads on the grid. This presentation will provide insights and lessons learned regarding deploying a DERMS to help large customer sites like front of the meter batteries and large EV charging stations connect flexibly […]

AI has fundamentally reshaped the startup landscape in just two years. But what does that mean for the traditional Silicon Valley startup playbook? In this one hour Talk, Silicon Valley veteran Bret Waters explores how the path to startup success is evolving for 2027—and what timeless principles remain unchanged. Drawing on decades of experience as […]

Dr. J. Ping Liu of the University of Texas at Arlington will explore the century-old puzzle of magnetic coercivity, including Brown’s Paradox and recent progress toward understanding magnetic hardening. With four decades of R&D experience in permanent magnets and magnetic materials, his research focuses on hard magnetic nanoparticles, thin films, and nanocomposites. For additional information, […]

Santa Clara Valley IEEE Power & Energy and Industry Applications Societies Join us for a presentation and discussion on: Critical Power Systems: Design & NEC Requirements Speaker: Tyler Shewbert, P.E., Field Application Engineer, Eaton’s Bussmann Division Cost: IEEE Members $30, Non-Members $40 by 9/17 (https://events.vtools.ieee.org/m/570048) Date: September 23, 2026, 5:30 to 8:30 PM Place: Delta/Marriott […]

In the past few years, because of high-performance computing (HPC) driven by artificial intelligence (AI) and data centers in this AI era, packaging using glass-core substrates has been attracting lots of traction. For example, among others, Intel’s one-trillion-transistors application processor with glass-core substrate is to be shipped by the end of 2030 (announced September 2023) […]

Join (https://www.linkedin.com/in/rajesh-dommaraju-159958100/) from (https://www.linkedin.com/company/spanidea/) as you explore how AIoT, edge AI, and embedded sensing can be combined to design smarter elderly monitoring systems for healthcare applications. We will share practical insights into building scalable, intelligent solutions using ST’s SensorTile box PRO and AIoT Craft Platform. Whether you are working on embedded systems, IoT, AI/ML, or […]

Artificial Intelligence is rapidly progressing from systems that generate responses to intelligent agents capable of reasoning, planning, using tools, maintaining context, and executing multi-step tasks. As organizations move toward agentic AI, the opportunity is no longer limited to helping employees find information—it is increasingly about enabling AI systems to participate in and automate real business […]

Join us for the 2nd Annual IEEE Power & Energy (PES) Resiliency Summit on Achieving a More Reliable and Resilient Energy Future, taking place 6-8 October 2026 at the Hilton San Francisco Union Square in San Francisco, CA. Registration and full details are at: (https://ieee-pes.org/events/2026-ieee-power-energy-society-pes-resiliency-summit/) Hosted by PG&E, this year's summit convenes utility professionals, solution […]

IEEE SCV WIE AI Summit 2026 [] In an era where AI technologies are rapidly transforming industries and redefining possibilities, it is crucial to explore both the innovations driving this change and the responsibilities that come with it. Today, we will delve into a diverse array of topics that highlight the multifaceted nature of AI […]

Our IEEE PES San Francisco / Oakland East Bay Chapter invites you to join our post IEEE PES Resiliency Summit Networking session (at the Hilton Union Square) and a delicious 5-course Moroccan dinner & show at Marrakech Restaurant right afterwards. (The restaurant will not be open to the public and registration will be required.) Our […]

[]This talk will cover the status of fiber optic transceiver co-packaging efforts, both VCSEL- and SiPh-based, where they fit into the Ethernet switch market and the evolving Computer IO market, and how these technologies are advancing HPC (High Performance Computing), Data Center, and AI applications. The emphasis will be on new requirements and challenges driven […]

Part of the 11th ACM/IEEE Symposium on Edge Computing (SEC 2026) Location: Santa Clara University | Date: Oct 13-15, 2026 Overview The future of the Edge is not just decentralized—it must be sustainable. As AI models grow in complexity, the environmental and energetic costs of deploying them on edge devices have become a critical bottleneck. […]

IEEE OEB-LMAG, 4Q26 Meeting Visit both the USS Hornet and CA Historical Radio Society Museum! This is one meeting you won’t want to miss! Wednesday, October 14, 2026 (11:50 AM to 2:30 PM PDT) The Oakland East Bay Life Members Affinity Group (OEB LMAG) is hosting an excursion to two historical locations in Alameda CA, […]

This one-day Technical Seminar will cover the fundamentals of electrical design, cable ampacity, protective relaying, and interconnections. The seminar will serve as a primer for engineers and a refresher for experienced engineers. During breaks and lunch there will be opportunities to network with your peers and meet with manufacturers. The registration cost includes continental breakfast, […]

*****This vTools link is for purchase of Vendor Tables ONLY! No walk-in registrations.***** (Limit of 10 vendor tables so do not delay!) Vendor table will be one 6-foot exhibit table. Vendor table includes one (1) attendee ticket. A power strip will be available upon request. For more than one (1) attendee to support the table, […]

Four guided training talks with small-group interaction: 9:00: Advanced Packaging for AI – Challenges and Roadmaps in Fault Isolation and Failure Analysis 9:30: Metal TIM and Low-Temp Solder Paste for HPC & AI Industry Challenges 10:30: Failure Analysis of Electronic Components for AI and Data Center Infrastructure 11:00: Scanning Acoustic Microscopy (SAM) and Photo-induced Force […]