Abstract: Advances in soft materials, low-power circuits, and wireless energy harvesting now allow imperceptible, long-lived bioelectronic systems that are practical beyond the lab bench. This talk presents translational pathways for multimodal bioelectronics that bridge engineering innovation with clinical impact. We highlight epidermal and implantable platforms that acquire high-fidelity biosignals—EEG/IMU for neonatal seizure risk and sleep, […]

[] This symposium will focus on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging. This includes failure modes, mechanisms, testing schemes, accelerated testing, stress levels, and environmental stresses. Visit our website for details, for our Advance […]

The power industry is under pressure to rapidly expand infrastructure to meet growing demands from both consumers and producers. But sticking to traditional design and construction methods may no longer be enough. One of the biggest bottlenecks? Hardware dependencies—like waiting on control wiring or specific components—that delay commissioning and inflate project timelines. This presentation explores […]

Inferencing has become ubiquitous across cloud, regional, edge, and device environments, powering a wide spectrum of AI use cases spanning vision, language, and traditional machine learning applications. In recent years, Large Language Models (LLMs), initially developed for natural language tasks, have expanded to multimodal applications including vision speech, reasoning and planning each demanding distinct service-level […]

[]Trends in consumer goods are leaning towards thinner, more compact products with higher performance than their predecessors. Today’s consumer wants lightweight, portable, battery-operated gear that is powerful enough to satisfy their needs for speed and ease of use. One of the biggest challenges facing product design is thermal management. Case temperature limits for products that […]

Careers don’t always follow a straight line — and that’s a good thing! In this talk, I’ll share lessons learned from my own journey and from others who’ve navigated career twists, pauses, and pivots. You’ll hear practical strategies for building confidence, staying current, and navigating transitions at every career stage. We’ll look at how to […]

This is a hybrid in-person and online event. Pre-registration is required for either. The holy grail of medical diagnostics is a test that is accurate, sensitive, non-invasive, and inexpensive. For solid tumors such as pancreatic cancer and for many neurological diseases, current diagnostics come too little, too late. An exciting direction of research in this […]

[]The rapid rise in power density and complexity of electronic systems has made thermal management a critical challenge for ensuring reliability, performance, and sustainability. Artificial Intelligence (AI) offers transformative opportunities to address this challenge by enabling data-driven modeling, optimization, and predictive control of cooling systems. By integrating AI with experimental and physics-based approaches, adaptive models […]

[] Requirements on the high-performance compute (HPC) systems from AI workloads necessitates transition to larger package sizes with 2.5D to 3.5D integration and density scaling at every level in the stack. Several competing packaging architectures are emerging to solve the compute and power efficiency challenge presented by AI workloads. Each presents unique lithography challenges such […]

Short-circuit current ratings (SCCR) and interrupting ratings form the backbone of electrical safety, coordination, and compliance in modern power systems. This presentation explores how UL 508A Supplement SB intersects with the National Electrical Code (NEC) to define the limits of what electrical equipment can safely withstand and interrupt under fault conditions. The presentation examines how […]

[] Hybrid Bonding has emerged as the technology of choice in the semiconductor industry for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device performance, it will become widely adopted for a broad range of high-performance semiconductor devices in the years to come. The success of Hybrid Bonding technology for high-volume manufacturing depends critically […]

Vision for Heterogeneous Integration from Global Perspectives, 2 days, keynote talks, working groups ... 1: Registration is $125 ($100 for IEEE members). PayPal is the credit card payments processor; please do not use your Paypal account during the payment process here. This fee is only to cover the food and beverage service costs at the […]