Events

Join (https://www.linkedin.com/in/rajesh-dommaraju-159958100/) from (https://www.linkedin.com/company/spanidea/) as you explore how AIoT, edge AI, and embedded sensing can be combined to design smarter elderly monitoring systems for healthcare applications. We will share practical insights into building scalable, intelligent solutions using ST’s SensorTile box PRO and AIoT Craft Platform. Whether you are working on embedded systems, IoT, AI/ML, or […]

Artificial Intelligence is rapidly progressing from systems that generate responses to intelligent agents capable of reasoning, planning, using tools, maintaining context, and executing multi-step tasks. As organizations move toward agentic AI, the opportunity is no longer limited to helping employees find information—it is increasingly about enabling AI systems to participate in and automate real business […]

Join us for the 2nd Annual IEEE Power & Energy (PES) Resiliency Summit on Achieving a More Reliable and Resilient Energy Future, taking place 6-8 October 2026 at the Hilton San Francisco Union Square in San Francisco, CA. Registration and full details are at: (https://ieee-pes.org/events/2026-ieee-power-energy-society-pes-resiliency-summit/) Hosted by PG&E, this year's summit convenes utility professionals, solution […]

IEEE SCV WIE AI Summit 2026 [] In an era where AI technologies are rapidly transforming industries and redefining possibilities, it is crucial to explore both the innovations driving this change and the responsibilities that come with it. Today, we will delve into a diverse array of topics that highlight the multifaceted nature of AI […]

Our IEEE PES San Francisco / Oakland East Bay Chapter invites you to join our post IEEE PES Resiliency Summit Networking session (at the Hilton Union Square) and a delicious 5-course Moroccan dinner & show at Marrakech Restaurant right afterwards. (The restaurant will not be open to the public and registration will be required.) Our […]

[]This talk will cover the status of fiber optic transceiver co-packaging efforts, both VCSEL- and SiPh-based, where they fit into the Ethernet switch market and the evolving Computer IO market, and how these technologies are advancing HPC (High Performance Computing), Data Center, and AI applications. The emphasis will be on new requirements and challenges driven […]

Part of the 11th ACM/IEEE Symposium on Edge Computing (SEC 2026) Location: Santa Clara University | Date: Oct 13-15, 2026 Overview The future of the Edge is not just decentralized—it must be sustainable. As AI models grow in complexity, the environmental and energetic costs of deploying them on edge devices have become a critical bottleneck. […]

IEEE OEB-LMAG, 4Q26 Meeting Visit both the USS Hornet and CA Historical Radio Society Museum! This is one meeting you won’t want to miss! Wednesday, October 14, 2026 (11:50 AM to 2:30 PM PDT) The Oakland East Bay Life Members Affinity Group (OEB LMAG) is hosting an excursion to two historical locations in Alameda CA, […]

This one-day Technical Seminar will cover the fundamentals of electrical design, cable ampacity, protective relaying, and interconnections. The seminar will serve as a primer for engineers and a refresher for experienced engineers. During breaks and lunch there will be opportunities to network with your peers and meet with manufacturers. The registration cost includes continental breakfast, […]

*****This vTools link is for purchase of Vendor Tables ONLY! No walk-in registrations.***** (Limit of 10 vendor tables so do not delay!) Vendor table will be one 6-foot exhibit table. Vendor table includes one (1) attendee ticket. A power strip will be available upon request. For more than one (1) attendee to support the table, […]

Four guided training talks with small-group interaction: 9:00: Advanced Packaging for AI – Challenges and Roadmaps in Fault Isolation and Failure Analysis 9:30: Metal TIM and Low-Temp Solder Paste for HPC & AI Industry Challenges 10:30: Failure Analysis of Electronic Components for AI and Data Center Infrastructure 11:00: Scanning Acoustic Microscopy (SAM) and Photo-induced Force […]

[]This 2-day symposium focuses on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging. This includes failure modes, stress levels, mechanisms, testing schemes, accelerated testing, and environmental stresses. The intent is to bring together electrical, reliability, materials, […]

The rapid deployment of AI-optimized data centers is introducing electrical load behaviors that differ significantly from traditional IT facilities. AI workloads exhibit high power density, fast transient demand, and large step changes in active power associated with training and inference cycles, creating new challenges for power system stability and protection. In parallel, the growing adoption […]