Events

The IEEE Oakland-East Bay Communications Society Chapter is pleased to host an IEEE Communications Society Distinguished Lecturer presentation by Dr. Wei Gao, Principal Engineer at Broadcom. Presentation Title Meta-Learning-Assisted Predistortion for Power Amplifier Linearization in Wireless Communication Systems Abstract Modern wireless communication systems require highly efficient RF power amplifiers while maintaining excellent signal linearity. This […]

The IEEE Signal Processing Society Industry Board and Santa Clara Valley Chapter are pleased to announce an upcoming event on Video Coding Standards in the Age of AI which will be held on July 30, 2026 in Palo Alto, CA. As AI continues to evolve, it is playing an increasingly important role in next-generation signal […]

[] As AI, high-performance computing, and heterogeneous integration continue to scale, advanced packaging is facing growing interconnect challenges across redistribution layers, IC substrates, HDI boards, silicon vias, and emerging glass-core platforms. Higher bandwidth and larger package form factors require finer wiring, smaller vias, higher fan-out density, and more reliable vertical interconnects. In this context, copper […]

As AI and HPC workloads scale exponentially, traditional network fabrics are hitting a critical bottleneck. Legacy Ethernet simply wasn’t built for the ultra-low latency and zero-loss tolerances demanded by next-generation clusters. This talk will provide an engineering-first primer on UltraEthernet—the industry’s collaborative answer to modern data center scaling. Rip Sohan will dissect the architectural gaps […]

Dr. Stan Trout of Spontaneous Materials will discuss how changing tariffs, domestic sourcing requirements, and global market forces are reshaping the permanent magnet industry and what these trends mean for its future. With nearly 50 years of experience in permanent magnets, magnetic materials, and rare-earth technologies, Dr. Trout is widely recognized as a leading authority […]

In the past few years, because of high-performance computing (HPC) driven by artificial intelligence (AI) and data centers in this AI era, packaging using glass-core substrates has been attracting lots of traction. For example, among others, Intel’s one-trillion-transistors application processor with glass-core substrate is to be shipped by the end of 2030 (announced September 2023) […]

Part of the 11th ACM/IEEE Symposium on Edge Computing (SEC 2026) Location: Santa Clara University | Date: Oct 13-15, 2026 Overview The future of the Edge is not just decentralized—it must be sustainable. As AI models grow in complexity, the environmental and energetic costs of deploying them on edge devices have become a critical bottleneck. […]

*****This vTools link is for purchase of Vendor Tables ONLY! No walk-in registrations.***** (Limit of 10 vendor tables so do not delay!) Vendor table will be one 6-foot exhibit table. Vendor table includes one (1) attendee ticket. A power strip will be available upon request. For more than one (1) attendee to support the table, […]

This one-day Technical Seminar will cover the fundamentals of electrical design, cable ampacity, protective relaying, and interconnections. The seminar will serve as a primer for engineers and a refresher for experienced engineers. During breaks and lunch there will be opportunities to network with your peers and meet with manufacturers. The registration cost includes continental breakfast, […]