Second Annual IEEE Build-Up Substrate Symposium (BUSS)
SEMI World Headquarters, 673 South Milpitas Blvd, Milpitas, California, United States, 95035[]We are living in the era of heterogeneous integration driven by fast, efficient and big data computing resources at our fingertips. The mega-monolithic silicon chip is a thing of the past, replaced with 3D heterogeneous integration of chiplets onto a platform made of an organic build-up substrate. Volume manufacturers of build-up substrates are entirely based […]