April 7 6PM-7:30PM Member Techical Meeting at Santa Clara University - with Pizza: This meeting will explore the Future of Work with speakers who will address the technical and business workforce environment given the changes that have transpired with the increasing use of generative and agentic AI. Our speakers include Claudionor Coelho, Chief AI Officer […]
In this presentation, I will present some of the recent progresses in building conversational agents, with a focus on the speech modality. I will introduce desirable properties of such systems and explain some of the key concepts, core ideas, and main technologies developed in practical systems. Speaker(s): , Dong Yu Virtual: https://events.vtools.ieee.org/m/545402
[]Chiplets have become a compelling approach to scaling and heterogeneous integration e.g. integrating workload-specific processors and massive bandwidth memory systems into computing systems; integrating die from multiple function-optimized process nodes into one product; integrating silicon from multiple businesses into one product. Chiplet-based products have been produced in high volume by multiple companies using proprietary chiplet […]
Silicon Valley is commonly acknowledged as the tech capital of the world. How did Silicon Valley come into being, and what can we learn for our own careers? The story goes back to local Hams trying to break RCA's tube patents, Stanford "angel" investors, the sinking of the Titanic, WW II and radar, and the […]
The talk will explore some of the research projects in the Adaptive Microsystems (AdaMist) lab led by Dr. Cretu, with an emphasis on a common vision and strategy. Polymer-based transducers, fabricated using green, rapid and low-cost processes, have been used for inertial and ultrasonic transducers. MEMS accelerometers with piezoelectric polymers show the promise of novel […]
This is a hybrid in-person and online event. Pre-registration is required for either. Conversational AI systems today speak with remarkable confidence, often giving the impression of understanding and reasoning. However, teams deploying these systems often quickly encounter familiar problems: drift, hallucinations, contradictory answers, and conversations that quietly lose their original purpose. Why do systems that […]
Th[]e transition to 3D heterogeneous integration has fundamentally changed the thermal characterization problem. Buried heat sources, anisotropic thin-film materials, through-silicon vias, and multilayer stacked structures require measurement techniques with sub-micron spatial resolution, depth sensitivity, and a temporal range — capabilities that infrared thermography and Raman spectroscopy cannot reliably deliver at this level of structural complexity. […]
Continuation of Speaker Series at Stanford IEEE. Stanford, California, United States, 94305
Ontario Power Generation’s Darlington New Nuclear Project (DNNP) is at the forefront of deploying Small Modular Reactor (SMR) technology in Canada, anchored by the GE Vernova Hitachi BWRX-300. As North America’s first commercial, grid-scale SMR, DNNP plans up to four units totaling 1,200 MW. The project introduces advanced safety features, including natural circulation cooling, integral […]
**TALK LOGISTICS:** Monday, April 20, 2026 6:30 registration, food, networking. 7:00 SFbayACM upcoming events, introduce the speaker 7:10 to 8:15 or 8:30 presentation The Zoom and YouTube links will be provided here about 2-3 days before the event SFbayACM will support a local audience at VRP in Mountain View **TALK DESCRIPTION:** Large language models (LLMs) […]
Join us at Santa Clara University for the APEC 2026 Download Event, hosted by the IEEE PELS San Francisco Bay Area Chapter. This engaging session brings together engineers, researchers, and industry professionals to explore the most impactful moments and innovations presented at the Applied Power Electronics Conference (APEC) 2026. The event will highlight key takeaways […]
Reserve this date for a social gathering and a program of general interest to be determined. IEEE member fee is subsidized. Agenda: Social meeting, presentation, and lunch. Select from buffet or order from menu depending on the number of registrations. Bldg: Golf course restaurant, not pro shop, Beeb's Sports Bar and Grill, 915 Club House […]
Diamond Semiconductor Device Design & Fabrication [] Abstract: Diamond Quanta: making diamond as available as silicon Speaker: Adam Khan Founder & CEO Diamond Quanta AGENDA: Thursday April 23, 2026 11:30 AM: Networking, Pizza & Drinks Noon -- 1 pm: Seminar Please register on Eventbrite before 9:30 AM on Thursday April 23, 2026 $4 IEEE members […]
Monthly AdCom meeting: 1. Welcome - Hualiang 2. Symposium status update - Annette/Paul/Hualiang 3. Education outreach status - Masha/Azmat/Hualiang 4. Chapter Storage - Hualiang XXXX NOT 5. Monthly talk preparation - Chandan/Luu 6. Chapter website update - XXXX NOT Venkatesh/Claire/Paul 7. Senior member advancement - Dwayne Xxxx NOT 8: Election 2026 9: Open discussion - […]
[]Join us for an insightful webinar with Francesco Carobolante, founder of IoTissimo® LLC and an EPS Distinguished Lecturer, as he explores the critical challenges and innovative solutions that advanced packaging can provide to address the "Power Wall". With over 30 years of industry experience and a tenure at Intel’s Corporate Strategy Office, Francesco will delve […]
As uOLED and uLED technologies transition from research to high-volume manufacturing, system performance is increasingly constrained by process variability rather than design intent. Electrical, thermal, and mechanical decisions made during manufacturing directly translate into optical non-uniformity, efficiency loss, and reliability challenges. Understanding these process-to-performance linkages is critical for building scalable, high-performance emissive display systems. Virtual: […]
IEEE Event Agenda - Tuesday May 12, 2026 🔹 5:00 PM – 5:30 PM Registration, Refreshments, Food & Networking (Meet & Greet) Featured Speakers & Sessions 🔹 5:30 PM – 6:15 PM Topic 1: Industry Talk – Standardizing Automotive Firmware for SDVs Experts from Mercedes-Benz, Arm, and Athos Silicon will discuss the urgent need for […]
Continuation of Speaker Series at Stanford IEEE. Stanford, California, United States, 94305
[] (More information will be added in early March. General Registration should open around March 1st. Sponsors may register at the link below.) We are living in the era of heterogeneous integration driven by fast, efficient and big data computing resources at our fingertips. The mega-monolithic silicon chip is a thing of the past, replaced […]
We are living in the era of heterogeneous integration driven by fast, efficient and big data computing resources at our fingertips. The mega-monolithic silicon chip is a thing of the past, replaced with 3D heterogeneous integration of chiplets onto a platform made of an organic build-up substrate. Volume manufacturers of build-up substrates are entirely based […]
