Stationary generator sets operated in regions governed by a local environmental review board may be subject to strict emissions regulations. Many of these areas, known as non-attainment zones, have enacted clean air requirements that adhere to the EPA’s Tier 4 standard, effective in 2015. For these stringent applications, Cummins provides Tier 4 gensets that reduce […]
Speaker(s): Roberto Morabito, Room: 4021, Bldg: Sobrato Campus for Discovery and Innovation, Santa Clara University, 500 El Camino Real, Santa Clara, California, United States, 95054, Virtual: https://events.vtools.ieee.org/m/539764
**TALK LOGISTICS:** Monday, March 23, 2026 (remote speaker, audience can be either in person or remote on Zoom. Please RSVP and indicate if you will be local or remote) 6:30 registration, food sponsored by Neo4j, networking. Neo4j contacts will be attending. 7:00 SFbayACM upcoming events, introduce the speaker 7:10 to 8:15 or 8:30 based on […]
**TALK LOGISTICS:** Monday, March 23, 2026 (remote speaker, audience can be either in person or remote on Zoom. Please RSVP and indicate if you will be local or remote) 6:30 registration, food sponsored by Neo4j, networking. Neo4j contacts will be attending. 7:00 SFbayACM upcoming events, introduce the speaker 7:10 to 8:15 or 8:30 based on […]
Chiplet and disaggregated architectures are rapidly becoming mainstream across applications from edge to server. Yet the resulting design complexity exceeds the capabilities of today’s tools, flows, and methodologies—particularly when aiming for highly optimized solutions at scale. Augmented Intelligence, the combination of human expertise and machine intelligence, offers a transformative approach to this challenge. By assigning […]
[]Co-packaged optics (CPO) are heterogeneous integration packaging methods to integrate the optical engine (OE) which consists of photonic ICs (PIC) such as the photodiode laser, etc. and the electrical engine (EE) which consists of the electronic ICs (EIC) such as the laser driver, transimpedance amplifier, etc. as well as the switch ASIC (application specific IC). […]
[] Designing Your Early Career: LinkedIn, Resume & Interview Strategy That Works Breaking into today’s competitive job market requires more than technical excellence. It requires clarity, positioning, and the ability to communicate your value with confidence. In this practical and engaging session, career strategist Shima Ghaheri shares how hiring managers actually evaluate candidates — and […]
Monthly AdCom meeting: 1. Welcome - Hualiang 2. Symposium status update - Annette/Paul/Hualiang 3. Education outreach status - Masha/Azmat/Hualiang 4. Chapter Storage - Hualiang XXXX NOT 5. Monthly talk preparation - Chandan/Luu 6. Chapter website update - XXXX NOT Venkatesh/Claire/Paul 7. Senior member advancement - Dwayne Xxxx NOT 8: Election 2026 9: Open discussion - […]
Hike at Green Belt Trail Hayward, California, United States
Synopsis: Please feel free to check out the work and thoughts of Prof. Ethem Alpaydın, Ph.D., https://mitpress.mit.edu/author/ethem-alpaydn-10375/ on Google Scholar at https://scholar.google.com/scholar?hl=en&as_sdt=0%2C5&q=%22Ethem+Alpayd%C4%B1n%22&btnG=, and generally on the Internet. Then, please feel free to submit your questions to Prof. Ethem Alpaydın - via Twitter by using the hashtag #ProfAlpaydinAMA and tagging @vishnupendyala - emailing vspendyala(at)hotmail(dot)com with #ProfAlpaydinAMA […]
Pierre-Olivier Jubert of Western Digital will review the design and characterization of media used in heat-assisted magnetic recording (HAMR). Speaker(s): Pierre-Olivier, Agenda: 6:30 – 7:00 Socializing and Networking at Quadrant 6:55 Zoom session will be online with Waiting Room 7:00 – 7:45 Lecture begins, online and in person 7:45 – 8:00 Questions and Answers Quadrant […]
Continuation of Stanford IEEE Speaker Series Stanford, California, United States, 94305
[]Chiplets have become a compelling approach to scaling and heterogeneous integration e.g. integrating workload-specific processors and massive bandwidth memory systems into computing systems; integrating die from multiple function-optimized process nodes into one product; integrating silicon from multiple businesses into one product. Chiplet-based products have been produced in high volume by multiple companies using proprietary chiplet […]
This is a hybrid in-person and online event. Pre-registration is required for either. Conversational AI systems today speak with remarkable confidence, often giving the impression of understanding and reasoning. However, teams deploying these systems often quickly encounter familiar problems: drift, hallucinations, contradictory answers, and conversations that quietly lose their original purpose. Why do systems that […]
Continuation of Speaker Series at Stanford IEEE. Stanford, California, United States, 94305
Reserve this date for a social gathering and a program of general interest to be determined. IEEE member fee is subsidized. Agenda: Social meeting, presentation, and lunch. Select from buffet or order from menu depending on the number of registrations. Bldg: Golf course restaurant, not pro shop, Beeb's Sports Bar and Grill, 915 Club House […]
As uOLED and uLED technologies transition from research to high-volume manufacturing, system performance is increasingly constrained by process variability rather than design intent. Electrical, thermal, and mechanical decisions made during manufacturing directly translate into optical non-uniformity, efficiency loss, and reliability challenges. Understanding these process-to-performance linkages is critical for building scalable, high-performance emissive display systems. Virtual: […]
Continuation of Speaker Series at Stanford IEEE. Stanford, California, United States, 94305
[] (More information will be added in early March. General Registration should open around March 1st. Sponsors may register at the link below.) We are living in the era of heterogeneous integration driven by fast, efficient and big data computing resources at our fingertips. The mega-monolithic silicon chip is a thing of the past, replaced […]
We are living in the era of heterogeneous integration driven by fast, efficient and big data computing resources at our fingertips. The mega-monolithic silicon chip is a thing of the past, replaced with 3D heterogeneous integration of chiplets onto a platform made of an organic build-up substrate. Volume manufacturers of build-up substrates are entirely based […]
