Digital Twins for Printed Electronics for 3D Packaging, High-performance Sensors, and High-capacity Batteries
Virtual: https://events.vtools.ieee.org/m/481231[]Printed electronics has emerged as a versatile technique for on-demand fabrication of passives, interconnects, and active devices. Our group has recently extended this technique to create freeform devices in Three-Dimensional space that have opened exciting application areas for this technology. The manufacturing process for printed electronics, however, can suffer from process drifts and does not […]